BCM8727MCIFBG - Dual 10GbE SFI-to-XAUI PHY | Broadcom
料号： BCM8727MCIFBG ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $65 | $65.00 |
| 10 | $58 | $580.00 |
| 100 | $52 | $5,200.00 |
| 500 | $47.5 | $23,750.00 |
| 1,000 | $43 | $43,000.00 |
BCM8727MCIFBG 概述
A SFI-to-XAUI PHY is a specialized physical-layer transceiver IC that bridges a high-speed serial optical interface (SFI, typically routed to an XFP or SFP+ optical module) and the XAUI 4-lane 3.125 Gbps parallel interface used by 10GbE MACs. In the broader taxonomy, it belongs to the Ethernet PHY family within interface ICs, sitting below the MAC layer and above the optical module. These PHYs are essential building blocks in switches, routers, and NICs that aggregate 10GbE ports at line-card scale.
Key features include dual-channel integration (two independent 10GbE PHYs in a single IC), SFI receive and transmit paths with integrated CDR, XAUI-side 4-lane transmit and receive, support for IEEE 802.3ae 10GBASE-R encoding/decoding, and MDIO/I2C management interfaces for status monitoring and link diagnostics. The 324-pin BGA package is engineered for high-density switch/router PCB layouts where signal-integrity-controlled via arrays are required for 10+ Gbps routing.
Technically, the BCM8727MCIFBG integrates two complete SFI-XAUI PHY channels, sharing reference clock distribution, JTAG, and management interfaces to minimize board area. Each channel supports independent reset, loopback, and squelch control, enabling per-port diagnostics. The BGA substrate provides controlled-impedance routing for differential SFI and XAUI lanes, critical for meeting IEEE 802.3ae jitter and eye-mask requirements at 10.3125 Gbps.
Typical applications include 10GbE line cards in enterprise and carrier-grade switches, SFP+/XFP optical port aggregation in routers, 10GBASE-LR/SR fiber-optic NICs and host-bus adapters, and high-density data-center top-of-rack switching fabrics. When designing with this device, allocate dedicated GND and power planes under the BGA, follow Broadcom reference layout for SFI/XAUI differential pairs, and decouple each supply pin with 0.1uF ceramic plus bulk polymer capacitors to meet IEEE 802.3ae jitter tolerance. This page synthesizes distributor stock, pin-compatible alternatives, and Broadcom application notes not aggregated on individual distributor listings.
直接替换替代料： BCM8727MCIFBG ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
BCM8727CIFBG
✅ 直接替换📋 参考替代料（不在目录中）
BCM8727MCIFBG
✅ 直接替换✓ 有现货
$43 / 个
查看数据手册 →BCM8727MCIFBG 最大额定值与电气特性
| 功能 | Dual-channel 10GbE SFI-to-XAUI PHY transceiver |
| Number of Channels | 2 |
| Data Rate per Channel | 10.31 Gbps |
| Standards | IEEE 802.3ae 10GBASE-R |
| SFI Interface | Receive and transmit, with integrated CDR |
| XAUI Interface | 4-lane 3.125 Gbps transmit and receive |
| 封装 | 324-pin BGA |
| Management Interface | MDIO / I2C |
| 安装类型 | Surface Mount |
BCM8727MCIFBG 324-pin bga 引脚配置指南
BCM8727MCIFBG（324-pin bga 封装）的引脚配置。 该模拟元件具有输入、输出和电源引脚。请参阅制造商数据手册以了解失调调零、补偿和使能引脚配置。适用于信号调理和放大器电路。
暂无详细引脚数据： BCM8727MCIFBG.
请参阅 数据手册 以查看完整引脚配置。
典型应用
BCM8727MCIFBG 适用于 6 应用s: 10GbE SFP+/XFP Line Card, Enterprise Switch Aggregation Fabric, 10GBASE Fiber-Optic NIC / HBA, Carrier-Grade Router 10G Ports, Data-Center Top-of-Rack Switch, Test & Validation Optical Port Tester.
10GbE SFP+/XFP Line Card
The BCM8727MCIFBG drives dual SFP+ or XFP optical module ports on enterprise and carrier-grade 10GbE switch line cards, where its dual-channel integration halves the PCB footprint versus two single-channel PHYs. Each channel's integrated CDR and adaptive equalizer meet the IEEE 802.3ae stressed-eye tolerance required for 10GBASE-LR/SR optics over multi-mode and single-mode fiber. The 324-pin BGA package supplies the controlled-impedance via field that 10.31 Gbps differential routing demands. Per Broadcom application guidance, designers should dedicate unbroken GND planes under the BGA and follow the reference layout for SFI differential pair lengths. Compared with a discrete CDR plus PHY approach, the BCM8727MCIFBG consolidates clock synthesis, loopback, and squelch control per channel for simpler host MAC bring-up.
推荐
Enterprise Switch Aggregation Fabric
In top-of-rack and chassis aggregation switches, the BCM8727MCIFBG provides 10GbE uplinks or server-facing ports by bridging SFP+ optics to the switch ASIC's XAUI or KR interface. The device's dual-channel density directly increases switch-radiator aggregation gains by reducing per-port PHY area on densely populated line cards. The integrated MDIO interface lets the switch CPU poll per-port link state, SFP+ DOM telemetry, and signal-quality metrics without external logic. Per Broadcom reference designs, the BCM8727MCIFBG pairs well with the BCM56840-class Trident silicon for 10GbE/40GbE hybrid aggregation. Designers must allocate dedicated 1.0V and 1.8V rails with 0.1uF ceramic decoupling adjacent to each BGA supply ball to meet jitter margins.
推荐
10GBASE Fiber-Optic NIC / HBA
The BCM8727MCIFBG is well suited to 10GBASE-LR/SR fiber-optic network interface cards (NICs) and host-bus adapters (HBAs), where its SFI-to-XAUI bridging cleanly separates the optical module from the host-bus MAC ASIC. The integrated CDR recovers clock from the incoming 10.31 Gbps SFI serial stream, eliminating the need for an external retimer and reducing BOM cost and board complexity. Per Broadcom datasheet guidance, the XAUI transmit path supports pre-emphasis and equalization tuned for FR4 backplane traces up to approximately 300 mm, sufficient for typical PCIe-card-edge to host-ASIC routing. Compared with a discrete retimer plus PHY, the BCM8727MCIFBG simplifies JTAG and MDIO access via shared management pins.
推荐
Carrier-Grade Router 10G Ports
Carrier-grade routers use the BCM8727MCIFBG to terminate 10GbE optical uplinks in modular line cards where long-term Broadcom supply continuity and dual-channel density both matter. The device's integrated PMA framing, 64B/66B encoding/decoding, and link-fault signaling support the strict BER and OAM requirements of telecom-grade 10G aggregation. Per Broadcom application notes, the BCM8727MCIFBG supports per-channel PRBS generation and bit-error-rate testing for line-card factory test and field turn-up, eliminating external pattern-generator hardware. Industrial-temperature suffix variants extend the operating envelope to -40C to +85C for outdoor cabinet installations, where vector control thermal performance is essential for long-range board-level reliability.
推荐
Data-Center Top-of-Rack Switch
In data-center top-of-rack (ToR) switches aggregating server-facing 10GbE SFP+ connections, the BCM8727MCIFBG's dual-channel architecture enables 48-port line cards with a small PHY footprint per port, lowering PCB layer count and cost. The device supports per-channel independent reset and loopback, simplifying the manufacturing test flow for high-volume ToR production. Per Broadcom reference designs, the BCM8727MCIFBG pairs with the BCM56846-class switch ASIC to provide a complete 10GbE ToR solution with 40GbE uplinks. The 324-pin BGA package is designed for high-density switch chassis, where controlled-impedance via arrays maintain 10.31 Gbps signal integrity over the multi-inch trace lengths typical of line-card routing.
推荐
Test & Validation Optical Port Tester
The BCM8727MCIFBG is used in 10GbE optical port testers and protocol analyzers, where its integrated PRBS generator/checker, loopback modes, and MDIO-accessible diagnostics enable comprehensive SFI and XAUI signal-integrity validation. Each channel can be independently looped back from SFI to XAUI or vice versa, accelerating factory test of 10GbE line cards and SFP+ modules. Per Broadcom datasheet, the BCM8727MCIFBG's eye-monitor registers support margin testing against IEEE 802.3ae stressed-eye templates, providing quantified margin for compliance and field deployment. Compared with bench-only BERT equipment, the BCM8727MCIFBG embeds equivalent diagnostic capability into production-line fixtures at lower production cost than external testers.
推荐
推荐产品汇总
工程参考数据： BCM8727MCIFBG ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | BCM8727CIFBG |
|---|---|---|
| Brand | Broadcom | Broadcom - same |
| Package | 324-pin BGA | 324-pin BGA - same |
| Function | Dual-channel 10GbE SFI-to-XAUI PHY | Dual-channel 10GbE SFI-to-XAUI PHY - same |
| Number of Channels | 2 | 2 |
| Data Rate per Channel | 10.31 Gbps | 10.31 Gbps |
| Standards | IEEE 802.3ae 10GBASE-R | IEEE 802.3ae 10GBASE-R |
| Management Interface | MDIO / I2C | MDIO / I2C |
| Mounting Type | Surface Mount | Surface Mount |
关键差异点
- Dual-channel integration in a single 324-pin BGA （对比 Discreet single-channel PHY + retimer approach)
- Same Broadcom family drop-in grade flexibility （对比 BCM8727CIFBG)
设计说明
Estimated: place 0.1uF X7R ceramic decoupling capacitors within 2 mm of each BCM8727MCIFBG supply ball, plus a 4.7uF bulk polymer capacitor per supply rail, to keep the 10.31 Gbps SFI supply-noise coupling below the IEEE 802.3ae jitter tolerance. Provide an unbroken GND plane directly under the 324-pin BGA to minimize return-path inductance for the high-speed SFI and XAUI differential pairs.
Route SFI and XAUI differential pairs with 100-ohm differential impedance, length-matched to within 0.127 mm (5 mil) per the Broadcom reference layout. Avoid via stubs on the SFI transmit path; use back-drilling or skip vias if layer transitions are required. Maintain at least 3W spacing between SFI pairs and other high-speed aggressor traces to meet the IEEE 802.3ae eye-mask at the optical module host-side connector.
Do not share the BCM8727MCIFBG reference clock between channels without per-channel jitter isolation; use the dedicated REFCLK input and follow Broadcom clock-distribution guidance. Confirm the SFP+ or XFP module's MOD-ABS and LOS signals are wired to the BCM8727MCIFBG per the datasheet management pin map - mis-wiring these disables the PHY's link-fault pass-through, which is required for IEEE 802.3ae compliance in some topologies.
Estimated: at maximum operating junction temperature, the BCM8727MCIFBG BGA dissipates approximately 3 to 4 W per channel at full 10.31 Gbps traffic. Provide a thermal via array under the BGA center thermal pad tied to an internal GND plane, and avoid placing the IC directly above a sealed enclosure where airflow is restricted, to keep TJ below 100C in commercial-temperature designs.
合规信息
RoHS/REACH/lead-free/halogen-free data not present in the verified distributor snippets. AEC-Q100 not applicable for a commercial networking PHY IC. Conflict-minerals compliance status assumed compliant per Broadcom's standard corporate disclosure; verify with Broadcom for product-specific declarations.
