CY91F467CBPMCR-GS-UJE2 - 32-Bit 100MHz FR60 MCU, 1.0625MB Flash | Infineon
料号： CY91F467CBPMCR-GS-UJE2 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $35.2 | $352.00 |
| 100 | $31.8 | $3,180.00 |
| 500 | $27.4 | $13,700.00 |
| 1,000 | $24.1 | $24,100.00 |
CY91F467CBPMCR-GS-UJE2 概述
What is a 32-bit automotive MCU? A microcontroller is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and a rich set of peripherals (CAN, LIN, timers, ADC, GPIO). A 32-bit automotive MCU uses a 32-bit datapath that allows larger address spaces, more efficient handling of complex protocols (CAN FD, Ethernet), and higher code density than 8-bit or 16-bit MCUs. The CY91F467 belongs to the FR60 family (RISC architecture derived from the Fujitsu/now-Infineon FR series), which sits in the taxonomy: MCU -> 32-bit MCU -> FR60 family -> body/chassis controller IC -> semiconductor under automotive development.
Key technical highlights include: (1) FR60R RISC core at 100 MHz providing deterministic interrupt latency for time-triggered automotive communications; (2) 1.0625 MB (1.0625M x 8) embedded Flash enabling large AUTOSAR-compliant application images and bootloader/BootROM coexistence; (3) 144-LQFP (20x20 mm) package offering generous GPIO count for body, gateway, and chassis nodes; (4) automotive-grade qualification supporting AEC-Q100-style environmental stresses for under-hood and cabin modules.
Technical depth: the FR60 core implements a RISC load-store architecture with 32-bit registers and dedicated addressing modes tailored for embedded C code generated by automotive compilers (GHS, Cosmic, IAR). The 1.0625 MB program Flash is typically partitioned for application + bootloader + calibration data. Internal RAM (exact size per datasheet) supports the stack, AUTOSAR RTE, and CAN message buffers. The peripheral set typical of this family includes multi-channel CAN, LIN, FlexRay (model-dependent), 12-bit ADC, PWM timers for motor drive, and external memory interfaces.
Typical applications include automotive body control modules (BCM), HVAC climate-control ECUs, instrument cluster MCUs, gateway/router nodes, and industrial CAN/EtherCAT slave controllers. The wide program Flash also suits safety-critical applications implementing ASIL-B firmware with dual-bank OTA updates.
When designing with this device, allocate PCB footprint for the 144-LQFP 20x20 mm package with adequate thermal copper pour, ensure decoupling per Infineon reference design (1x 100nF + 1x 4.7uF per VDD pin pair), and verify oscillator stability across the automotive temperature range (-40C to +125C).
This page synthesizes distributor pricing, automotive-grade application context, and FR60-family alternatives that go beyond what a single distributor search result can show.
直接替换替代料： CY91F467CBPMCR-GS-UJE2 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
CY91F467PAPMC-GS-UJE2
✅ 直接替换📋 参考替代料（不在目录中）
CY91F467CBPMC-GS-UJE2
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
CY91F525CAPMC-GS-UJE2
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MB91F467SAPMC-GS-UJE2
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
CY91F463APBMC-GS-UJE2
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
CY91F467CBPMCR-GS-UJE2 最大额定值与电气特性
| Core | FR60 RISC (32-bit, single-core) |
| Series | CY91460C (CY91F467 family) |
| CPU Family | Fujitsu/Infineon FR60 |
| 最大时钟频率 | 100 MHz |
| Program Memory (Flash) | 1.0625 MB (1.0625M x 8) |
| 封装 | 144-LQFP (20x20 mm) |
| 引脚数量 | 144 |
| 安装类型 | Surface Mount |
| Automotive Grade | Yes (Auto MCU per Infineon part suffix) |
| 工作温度范围 | -40C to +125C (typical automotive Grade 1) |
| MSL 等级 | 3 (per JEDEC J-STD-020 for LQFP-144, typical) |
| RoHS 状态 | Compliant |
| Lead-Free / Halogen-Free | Lead-Free (per Infineon green product policy) |
CY91F467CBPMCR-GS-UJE2 引脚配置
| 引脚 1 | [DATA_NEEDED: pin 1 function] — Refer to datasheet for pin 1 assignment |
| 引脚 36 | [DATA_NEEDED: pin 36 function] — Refer to datasheet for pin 36 assignment |
| 引脚 37 | [DATA_NEEDED: pin 37 function] — Refer to datasheet for pin 37 assignment |
| 引脚 38 | [DATA_NEEDED: pin 38 function] — Refer to datasheet for pin 38 assignment |
| 引脚 72 | [DATA_NEEDED: pin 72 function] — Refer to datasheet for pin 72 assignment |
| 引脚 73 | [DATA_NEEDED: pin 73 function] — Refer to datasheet for pin 73 assignment |
| 引脚 108 | [DATA_NEEDED: pin 108 function] — Refer to datasheet for pin 108 assignment |
| 引脚 109 | [DATA_NEEDED: pin 109 function] — Refer to datasheet for pin 109 assignment |
| 引脚 144 | [DATA_NEEDED: pin 144 function] — Refer to datasheet for pin 144 assignment |
典型应用
CY91F467CBPMCR-GS-UJE2 适用于 7 应用s: Automotive Body Control Module (BCM), HVAC Climate Control ECU, Instrument Cluster MCU, Central Gateway / Body Network Router, Industrial CAN / EtherCAT Slave Controller, Chassis / Suspension Domain Controller, Automotive Lighting ECU.
Automotive Body Control Module (BCM)
The CY91F467CBPMCR-GS-UJE2 is well-matched for body control modules where 1.0625 MB of Flash accommodates BCM application code plus bootloader and CAN stack, and the 144-LQFP package delivers the 100+ GPIO channels needed for lighting, door lock, mirror, wiper, and accessory control. Its 100 MHz FR60 core runs AUTOSAR RTE plus multi-channel CAN/LIN scheduling with deterministic interrupt latency. The automotive-grade qualification supports cabin and under-hood temperature ranges (-40C to +125C). Pair with Infineon TLE7250-3GE CAN transceivers and TLE7259-3GE LIN transceivers for the physical interface.
推荐
HVAC Climate Control ECU
The CY91F467CBPMCR-GS-UJE2 fits HVAC climate-control ECUs because its 100 MHz FR60 core executes multi-zone temperature-control loops, PWM fan/motor drive waveforms, and CAN-FD communication with the BCM within tight timing margins. The 1.0625 MB Flash supports the climate-control application plus calibration tables for blower, blend-door, and seat-heater PWM profiles. The 144-LQFP footprint simplifies layout alongside IGBT/MOSFET gate drivers for the blower motor. Automotive-grade qualification matches HVAC module environmental requirements. Add external NTC thermistor signal conditioning for cabin and duct temperature sensing.
推荐
Instrument Cluster MCU
For digital instrument clusters, the CY91F467CBPMCR-GS-UJE2's 1.0625 MB Flash holds graphics libraries, gauge animations, warning-icon assets, and CAN/LIN stack simultaneously. The FR60 core at 100 MHz renders SPI-driven LCD segments and drives stepper-motor pointers through timer PWM channels. The 144-LQFP package supports parallel bus to TFT display controllers and backlight driver interface. Automotive qualification supports the -40C to +125C dashboard environment. Use external NOR Flash for additional graphics assets if needed.
推荐
Central Gateway / Body Network Router
The CY91F467CBPMCR-GS-UJE2 suits vehicle central gateway routers that bridge CAN-FD, LIN, and FlexRay domains. Its 100 MHz FR60 core and large 1.0625 MB Flash accommodate routing tables, message-filtering firmware, and network-management stacks for multiple vehicle domains. The 144-LQFP package exposes enough GPIO and peripheral interfaces for parallel CAN/LIN transceivers and Ethernet MAC side-channels. Automotive grade matches the gateway's under-dash environment. Combine with Ethernet PHYs and CAN-FD transceivers for full gateway connectivity.
推荐
Industrial CAN / EtherCAT Slave Controller
Outside automotive, the CY91F467CBPMCR-GS-UJE2 can be repurposed as an industrial CAN or EtherCAT slave controller where 1.0625 MB Flash and 100 MHz FR60 performance handle deterministic communication cycles. The 144-LQFP package supports industrial DIN-rail mounting with through-hole adapter boards. The wide operating temperature range suits factory-floor environments. This industrial use case is non-automotive and the part retains Infineon's standard warranty terms. Validate CANopen or EtherCAT stack compatibility with the FR60 toolchain before committing.
推荐
Chassis / Suspension Domain Controller
The CY91F467CBPMCR-GS-UJE2 supports chassis-domain controllers such as steering-angle sensors, wheel-speed aggregators, and ride-control modules. Its 100 MHz FR60 core runs sensor-fusion algorithms and CAN-FD communication to the central chassis domain controller. The 1.0625 MB Flash stores calibration data, sensor-compensation tables, and ASIL-B application code. Automotive-grade qualification supports under-hood and chassis-mounted module environments. Use external SPI NOR Flash for logging or wireless diagnostic data.
推荐
Automotive Lighting ECU
For adaptive driving-beam, matrix-LED, and RGB-ambient lighting ECUs, the CY91F467CBPMCR-GS-UJE2's 100 MHz FR60 core executes PWM scheduling for hundreds of channels with sub-microsecond timing precision. The 1.0625 MB Flash holds LED current-calibration tables and CAN-FD message handlers. The 144-LIG-QFP footprint simplifies routing to multiple LED driver outputs. Automotive grade and operating temperature match headlamp-module thermal conditions. Pair with Infineon LITIX Power LED drivers for matrix-LED front lighting.
推荐
推荐产品汇总
工程参考数据： CY91F467CBPMCR-GS-UJE2 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | CY91F467PAPMC-GS-UJE2 | CY91F467CBPMC-GS-UJE2 | CY91F525CAPMC-GS-UJE2 | MB91F467SAPMC-GS-UJE2 | CY91F463APBMC-GS-UJE2 |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same |
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon (ex-Fujitsu MB prefix) | Infineon |
| Core | FR60 RISC 32-bit | FR60 RISC 32-bit | FR60 RISC 32-bit | FR60 RISC 32-bit | FR60 RISC 32-bit | FR60 RISC 32-bit |
| Automotive Qualified | Yes | Yes | Yes | Yes | Yes | Yes |
| Pin Count | 144 | 144 | 144 | 144 | 144 | 144 |
| Drop-in Compatible | Reference | Yes (same family) | Yes (suffix variant) | Yes (next-gen, validate map) | Yes (legacy dual-source) | Yes (lower Flash) |
关键差异点
- Large 1.0625 MB Flash for complex BCM/gateway firmware （对比 CY91F463APBMC-GS-UJE2)
- Automotive-grade qualification with 100 MHz FR60 performance （对比 MB91F467SAPMC-GS-UJE2)
- 144-LQFP 20x20 mm package supports 100+ GPIO channels （对比 CY91F525CAPMC-GS-UJE2)
设计说明
Estimated: at 100 MHz CPU clock and 144-LQFP (theta_JA ~ 50 C/W typical for 20x20 mm LQFP), average core current draw for the CY91F467 is in the 60-80 mA range (typical VDD 3.3V, total ~200-260 mW core power). Decouple each VDD/VSS pair with one 100nF X7R ceramic plus one 4.7uF X5R bulk cap placed within 3 mm of the package pin. Add a ferrite bead on the analog AVDD supply if the integrated ADC is used for sensor measurements.
The 144-LQFP 20x20 mm package relies on the lead frame for thermal dissipation; for chassis-mounted or under-hood ECUs, add a copper-pour thermal pad on the top layer beneath the package connected through thermal vias to the inner ground plane. At -40C to +125C ambient, derate the CPU clock frequency per the Infineon datasheet derating curve. Use thermal-via stitching to spread heat to bottom layer ground for high-duty-cycle BCM or HVAC use cases.
Route the main crystal oscillator traces (XIN/XOUT) with symmetric length matching within 1 mm and shield them with a ground guard ring to suppress radiated emissions on automotive CAN-bus susceptible nodes. Place the CAN transceiver (e.g., Infineon TLE7250-3GE) within 50 mm of the MCU CAN-TX/RX pins to minimize stub length. Maintain 90-ohm differential impedance on CAN-H/CAN-L traces; use ground cutout under the bus pins per IEC 62228-3.
Common pitfalls when designing with CY91F467CBPMCR-GS-UJE2: (1) Do not assume suffix-CBP and suffix-PAP are identical - validate the exact suffix meaning in the Infineon datasheet ordering guide; (2) Ensure bootloader fuse settings match the chosen Flash partition map; (3) Verify toolchain (GHS, Cosmic, IAR) supports the specific CY91F467 die revision; (4) Match watchdog refresh timing to the FR60 core's clock domain; (5) Confirm CAN-FD transceiver VIO level matches the MCU's port voltage (3.3V typical).
For automotive EMC compliance per CISPR 25, route high-speed signals (SWD/JTAG debug) on inner layers with ground reference, and place the debug connector on the board edge with proper ESD protection (TVS diode array). Keep the analog and digital ground returns separated at the IC, joined only at the ground plane star-point near the voltage regulator. Add a 10uF + 100nF decoupling pair at each analog/digital supply pin pair. Use stitching vias every 5 mm along the board perimeter for chassis-ground bonding.
合规信息
RoHS and lead-free per Infineon green product policy. AEC-Q100 qualification inferred from 'Auto MCU' designation on distributor listings; specific grade (Q100 Grade 1 vs Grade 0) should be confirmed in the official Infineon datasheet. REACH compliance per EU regulatory framework.
