DSPIC33CK256MP206-E/MR - 100MHz 16-bit DSC 256KB Flash | Microchip
料号： DSPIC33CK256MP206-E/MR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $3.1 | $3.10 |
| 10 | $2.9 | $29.00 |
| 100 | $2.75 | $275.00 |
| 500 | $2.62 | $1,310.00 |
| 1,000 | $2.52 | $2,520.00 |
DSPIC33CK256MP206-E/MR 概述
A digital signal controller combines the computational throughput of a digital signal processor with the peripheral integration and control-oriented architecture of a microcontroller. Within the power-management hierarchy, the dsPIC33CK family sits above basic MCUs and below multi-core application processors, targeting closed-loop control loops such as digital power conversion, motor control, and advanced sensing where deterministic interrupt latency and high-resolution PWM are essential.
Key features include the dsPIC33CK DSC core running DC to 100 MIPS from a 3.0V to 3.6V supply, dual-partition flash with ECC and Live Update for field firmware upgrades, and 24 KB of SRAM with Memory Built-In Self-Test (MBIST) for functional-safety designs. Mouser lists 3 on-chip operational amplifiers, 3 comparators, and a PTG (Peripheral Trigger Generator) block, which offload analog signal conditioning and trigger sequencing from software. High-resolution PWM and CAN FD support (per the MP508 family datasheet) make the family well suited to automotive-adjacent and industrial communication tasks.
Architecturally, the device uses a modified Harvard architecture with separate program and data buses, enabling single-cycle MAC and DSP instructions while retaining deterministic C-friendly execution. The dual-partition flash allows firmware to run from one partition while the other is erased and written, minimizing downtime during Live Update events.
Typical applications include digital power supplies (PFC, LLC, totem-pole converters), BLDC/PMSM motor control, solar inverters, and high-accuracy sensing front ends that exploit the integrated op-amps and comparators.
A key design consideration is supply regulation: the 3.0V to 3.6V operating window requires a tight 3.3V rail, and the -E temperature grade (-40C to +150C) must be matched to your thermal budget, since the exposed pad must be soldered to a ground pour for heat dissipation.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： DSPIC33CK256MP206-E/MR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC33CK256MP206-E/MR （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Program Flash, PWM Resolution, Core Architecture.
快速对比工具——选择替代料号进行并排对比：
DSPIC33CK256MP206-I/MR
✅ 直接替换✓ 有现货
$3.85 / 个
查看数据手册 →DSPIC33CK128MP506-E/MR
✅ 直接替换✓ 有现货
$4.42 / 个
查看数据手册 →DSPIC33CH512MP206-I/MR
✅ 直接替换✓ 有现货
$3.96 / 个
查看数据手册 →DSPIC33CK256MP206-E/MR 最大额定值与电气特性
| Core | dsPIC33CK 16-bit DSC |
| Maximum Clock Speed | 100 MHz (100 MIPS) |
| Program Flash | 256 KB with ECC and Live Update (dual-partition) |
| Data SRAM | 24 KB with MBIST |
| 电源电压 | 3.0 V to 3.6 V |
| 工作温度 | -40C to +150C |
| 封装 | 64-QFN (9x9 mm) exposed pad |
| 安装类型 | Surface Mount |
| On-chip Op-Amps | 3 |
| Comparators | 3 |
| Peripheral Trigger Generator | Yes (PTG) |
| CAN | CAN FD (family feature per MP508 datasheet) |
| PWM | High-Resolution PWM (family feature) |
| Architecture | Modified Harvard |
| Functional Safety | FuSa variant supported (per DigiKey category) |
| RoHS 状态 | Compliant |
DSPIC33CK256MP206-E/MR 64-qfn (9x9 mm) exposed pad 引脚配置指南
DSPIC33CK256MP206-E/MR（64-qfn (9x9 mm) exposed pad 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC33CK256MP206-E/MR.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC33CK256MP206-E/MR 适用于 6 应用s: Digital Power Conversion, BLDC/PMSM Motor Control, Solar Inverters and MPPT, Advanced Sensing and Control, Automotive-Adjacent Industrial Control, Wireless Charging and LED Drivers.
Digital Power Conversion
The DSPIC33CK256MP206-E/MR fits digital power supplies because its 100 MHz core executes voltage- and current-loop compensation at switching frequencies well beyond 100 kHz, while family high-resolution PWM provides fine duty-cycle steps for LLC and totem-pole PFC stages. The 3 integrated op-amps amplify shunt or current-transformer signals on-chip, cutting BOM cost and board area, and the 3 comparators deliver hardware cycle-by-cycle overcurrent protection without CPU intervention. Used as the main controller between the sensing divider network and the gate-driver PWM inputs, it closes control loops deterministically; the PTG sequences ADC triggers aligned to PWM events for distortion-free sampling. The 256 KB dual-partition flash allows firmware field updates on deployed converters.
推荐
BLDC/PMSM Motor Control
For field-oriented control of PMSM and BLDC motors, the DSPIC33CK256MP206-E/MR offers the compute throughput and analog integration motor drives demand. The 100 MHz core with single-cycle DSP MACs executes FOC current loops in a fraction of the PWM period, and the 3 on-chip op-amps condition two or three low-side shunt signals directly, removing external amplifiers. Comparators provide independent hardware overcurrent trips to the PWM module for fault reaction within one switching cycle. The part drives three-phase inverter gate drivers through its complementary PWM outputs with dead-time insertion. The -40C to +150C rating suits thermally harsh drive environments, and dual-partition flash supports firmware updates on installed drives.
推荐
Solar Inverters and MPPT
Grid-tied solar micro-inverters and MPPT converters benefit from the DSPIC33CK256MP206-E/MR's combination of DSP throughput and analog peripherals. The 100 MHz core runs MPPT algorithms plus grid-current control concurrently with less than full CPU loading, while high-resolution PWM keeps switching harmonics predictable for EMI filter design. Integrated op-amps scale panel-voltage, bus-voltage and current feedback into the ADC range, and comparators protect the power stage during transients. CAN FD (family feature) links the inverter to monitoring gateways. The 256 KB flash accommodates grid-code compliance firmware across regions, and Live Update allows certification-driven firmware revisions to ship without returning units to the factory.
推荐
Advanced Sensing and Control
High-accuracy sensing front ends exploit the DSPIC33CK256MP206-E/MR's analog suite: the 3 op-amps can be configured as programmable-gain amplifiers for bridge or shunt sensors, and the 3 comparators implement window thresholds locally. The 100 MHz core applies DSP filtering (IIR/FIR, oversampling, averaging) on sampled channels with deterministic latency, appropriate for precision process-control and instrumentation nodes. SRAM with MBIST and flash with ECC support functional-safety workflows where sensor data integrity must be demonstrable, aligning with Microchip's FuSa positioning for this part. The 64-QFN 9x9 mm footprint concentrates analog and digital functions in a compact area suitable for distributed control modules and retrofit sensor nodes.
推荐
Automotive-Adjacent Industrial Control
Industrial systems that borrow automotive practice - high ambient temperature, CAN FD networking, EMC robustness - fit the DSPIC33CK256MP206-E/MR. Its -40C to +150C ambient rating tolerates enclosure hot spots near actuators or power electronics, and CAN FD (a dsPIC33CK family feature) provides the bandwidth for modern control networks. The PTG offloads deterministic peripheral sequences from the CPU, keeping the 100 MHz core available for supervisory logic. Dual-partition Live Update flash enables maintenance windows to apply firmware patches without downtime, an important availability metric in factory automation. Typical roles include actuator controllers, pump and fan drives, and gateways bridging CAN FD to higher-level fieldbus systems.
推荐
Wireless Charging and LED Drivers
Resonant wireless power transmitters and high-power LED drivers share the DSPIC33CK256MP206-E/MR's sweet spot: high-frequency, phase-shifted or frequency-modulated control with fast fault protection. The 100 MHz core resolves frequency and phase commands for resonant tanks above several hundred kHz, while high-resolution PWM suppresses jitter that would otherwise create EMI. On-chip comparators guard against foreign-object or short-circuit events by tripping PWM within one cycle, and integrated op-amps read coil or LED-string current directly. The extended -40C to +150C rating tolerates enclosed, convection-limited luminaires and charging pads, and the 9x9 mm QFN keeps controller area minimal on compact transmitter coils.
推荐
推荐产品汇总
工程参考数据： DSPIC33CK256MP206-E/MR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC33CK256MP206-I/MR | DSPIC33CK128MP506-E/MR | DSPIC33CH512MP206-I/MR |
|---|---|---|---|---|
| Package | 64-QFN (9x9) MR | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 100 MHz (100 MIPS) | 100 MHz | 100 MHz | 100 MHz (dual-core) |
| Program Flash | 256 KB (ECC, dual-partition) | 256 KB | 128 KB | 512 KB |
| Temperature Range | -40C to +150C (E grade) | -40C to +85C (I grade) | -40C to +150C (E grade) | -40C to +85C (I grade) |
| Core Count | 1 (single-core dsPIC33CK) | 1 | 1 | 2 (master + slave) |
关键差异点
- Extended -40C to +150C ambient rating （对比 DSPIC33CK256MP206-I/MR)
- Double the flash of the cost-down variant （对比 DSPIC33CK128MP506-E/MR)
- Single-core simplicity and software portability （对比 DSPIC33CH512MP206-I/MR)
设计说明
Regulate the 3.3V rail tightly within the 3.0V-3.6V datasheet window. In digital power designs the DSC often shares a rail with gate-driver logic; place a local ferrite plus 100 nF and 10 uF decoupling at each VDD pin pair, and verify that gate-driver switching transients do not pull VDD outside the window, which can trigger brown-out resets mid-PWM-cycle. Estimated: a 100 mA core load through 1 ohm of trace resistance drops only 0.1 V, but shared-rail noise from gate drive can exceed 300 mV - measure with an oscilloscope at the pin.
The exposed pad of the 64-QFN (9x9) must be soldered to a ground pour - it is both the primary thermal and ground return path. For the -E grade (-40C to +150C ambient), estimate junction temperature as Ta + P * theta_JA; Estimated: at 60 mA core current on 3.3 V (~0.2 W) with theta_JA of roughly 30-40 C/W on a good pour, junction rise is only 6-8 C, but verify with the exact theta_JA value from the datasheet thermal table for your board stack-up.
Plan the flash partitioning early: Live Update requires splitting 256 KB into two partitions, halving contiguous code space per partition. Applications needing more than ~128 KB of code plus constant data in one partition cannot use dual-partition mode. Also configure ADC sampling with the PTG or PWM-trigger alignment rather than free-running sampling in digital power loops - misaligned sampling causes control-loop jitter and output ripple that is difficult to diagnose in hardware.
合规信息
DigiKey lists the part under the RoHS-compliant dsPIC33CK category; REACH, lead-free, halogen-free and conflict-minerals status were not explicitly stated in the provided data.
