DSPIC33CK32MC102-I/M6 - 100MHz 32KB DSC 28-UQFN | Microchip
料号： DSPIC33CK32MC102-I/M6 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $3.42 | $3.42 |
| 10 | $3.08 | $30.80 |
| 100 | $2.74 | $274.00 |
| 500 | $2.45 | $1,225.00 |
| 1,000 | $2.18 | $2,180.00 |
DSPIC33CK32MC102-I/M6 概述
A Digital Signal Controller combines the deterministic control of a microcontroller with the mathematical throughput of a DSP. In the power-management hierarchy, the dsPIC33CK family sits within Microchip's 16-bit DSC taxonomy (DSC -> Digital Signal Controller -> embedded controller -> semiconductor), built on a modified Harvard architecture with separate program and data buses that enable simultaneous instruction fetch and data access for efficient fixed-point DSP processing.
Key features include DC-to-100 MIPS performance, integrated DSP engine with single-cycle MAC instructions, high-speed 12-bit ADC, on-chip operational amplifiers, comparators, and a high-resolution PWM module for precision power conversion. Program flash includes ECC and fault-injection test features, and SRAM includes Memory Built-In Self-Test (MBIST), supporting functional-safety (FuSa) oriented designs.
Architecturally, the dsPIC33CK core is a next-generation evolution of the dsPIC33CH architecture with four DMA channels, and a peripheral ecosystem (UART, timers, PWM) optimized for closed-loop control loops executing at hundreds of kilohertz. C compiler and MPLAB X IDE toolchain support keeps software development straightforward.
Typical applications include brushless DC and PMSM motor control, digital power supplies (LLC, totem-pole PFC), advanced sensing, touch sensing, and lighting control where deterministic fast control loops are required.
Design consideration: the 28-UQFN 4x4 package has an exposed pad that must be soldered to a grounded copper pour for thermal and electrical performance; the 3.0-3.6 V supply range excludes direct 5 V operation.
This page synthesizes distributor pricing, drop-in family alternatives, design notes, and comparison data not found in the manufacturer datasheet alone, with pricing referenced as of 2026-09-23.
直接替换替代料： DSPIC33CK32MC102-I/M6 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC33CK32MC102-I/M6 （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, PWM, ADC Resolution, Data SRAM.
快速对比工具——选择替代料号进行并排对比：
DSPIC33CK32MC102-H/M6
✅ 直接替换📋 参考替代料（不在目录中）
DSPIC33CK64MC102-I/M6
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$0.42 / 个
查看数据手册 →DSPIC33CK32MC101-I/M6
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33CK64MC101-I/M6
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33CK32MC102-I/M6 最大额定值与电气特性
| Core | dsPIC33CK 16-bit DSC core |
| 最大时钟频率 | 100 MHz (100 MIPS) |
| Program Memory Size | 32 KB FLASH (with ECC) |
| Data RAM Size | 8 KB SRAM (with MBIST) |
| Supply Voltage Range | 3.0 V to 3.6 V |
| 工作温度范围 | -40C to +125C |
| 封装 | 28-UQFN (4x4 mm) |
| 安装类型 | Surface Mount |
| Architecture | Modified Harvard, 16-bit, 24-bit instruction width |
| DSP Engine | Integrated DSP with single-cycle MAC |
| DMA Channels | 4 |
| ADC Resolution | 12-bit high-speed ADC |
| Analog Peripherals | On-chip op amps, comparators, high-speed PWM |
| Functional Safety Features | Flash ECC, fault injection testing, SRAM MBIST |
| Series | dsPIC33CK32MC10X |
| Typical Applications | Motor control, digital power, advanced sensing, touch |
DSPIC33CK32MC102-I/M6 28-uqfn (4x4 mm) 引脚配置指南
DSPIC33CK32MC102-I/M6（28-uqfn (4x4 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC33CK32MC102-I/M6.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC33CK32MC102-I/M6 适用于 6 应用s: BLDC/PMSM Motor Control, Digital Power Conversion (LLC, Totem-Pole PFC), Advanced Sensing and Signal Conditioning, Touch Sensing Interfaces, Lighting Control and Electronic Ballasts, Embedded Industrial Control and Communication Nodes.
BLDC/PMSM Motor Control
The DSPIC33CK32MC102-I/M6 fits sensorless and sensored brushless DC and PMSM drives because its 100 MHz core executes field-oriented control loops deterministically at switching frequencies well above audibility, while the high-speed PWM module provides high-resolution duty updates needed for low torque ripple. On-chip op amps condition shunt current signals, and the 12-bit high-speed ADC samples phase currents synchronized to the PWM center. The flash ECC supports the functional-safety expectations of industrial drives. Placed as the single inverter controller with external gate drivers, the device offloads ADC sampling via DMA, keeping CPU cycles free for the control law; the main trade-off is the 3.0-3.6 V supply, which requires a 3.3 V rail in 5 V or 12 V drive systems.
推荐
Digital Power Conversion (LLC, Totem-Pole PFC)
Digital power supplies benefit from the DSPIC33CK32MC102-I/M6's high-resolution PWM, fast 12-bit ADC, and on-chip comparators with programmable slew, which enable cycle-by-cycle current limiting in hardware independent of CPU latency. The 100 MIPS core runs compensator math for LLC or totem-pole PFC loops at 100-500 kHz switching frequencies, while four DMA channels stream ADC results without interrupt overhead. Flash ECC and SRAM MBIST support reliability targets in server and telecom power. The controller is used as the single supervisory and modulating device with an isolated gate-driver front end; designers should budget the 3.3 V rail and verify comparator trip latency in the datasheet when implementing hardware protection paths.
推荐
Advanced Sensing and Signal Conditioning
The DSPIC33CK32MC102-I/M6 serves advanced sensing nodes where an ADC, amplification, and DSP post-processing must coexist in one chip. Its integrated op amps amplify small sensor signals (pressure bridges, current shunts, thermocouple front ends) before the 12-bit high-speed ADC samples them, and the DSP engine applies single-cycle MAC filtering (IIR/FIR) directly in C or assembly, eliminating an external analog-filter stage. MBIST and flash ECC add diagnostic coverage for measurement integrity. Typical implementation uses the op amps in external-gain configuration, ADC triggered by a timer for coherent sampling, and results moved via DMA; the trade-off versus a discrete AFE is lower analog precision but significantly lower BOM count and board area.
推荐
Touch Sensing Interfaces
Microchip lists touch as a target application for the dsPIC33CK family, and the DSPIC33CK32MC102-I/M6 implements capacitive touch using ADC-based charge-transfer measurement on its 12-bit ADC with CPU-driven scanning. The 100 MHz core provides headroom for oversampling and drift-compensation algorithms while simultaneously running application control, and 32 KB flash holds the touch library plus application firmware. Typical products include appliance panels, light switches, and industrial HMI buttons where the same chip also drives LEDs or relays through the PWM and GPIO. Implementation uses dedicated touch channels via the ADC multiplexer with the Microchip touch library; the trade-off is fewer simultaneous touch channels than dedicated touch controllers, which suits small to medium key counts.
推荐
Lighting Control and Electronic Ballasts
Dimmable LED drivers and HID/electronic ballast topologies map well onto the DSPIC33CK32MC102-I/M6: the high-resolution PWM generates phase-shifted or frequency-modulated gate waveforms with fine dimming resolution, the 12-bit ADC monitors output current and bus voltage for closed-loop regulation, and comparators implement fast overcurrent protection in hardware. The 100 MHz core handles DALI/DMX or PWM-dimming protocol decoding concurrently with the control loop. With ECC-protected flash, field reliability in sealed luminaires with high ambient temperatures up to +125C rating is supported. Designers should note the 3.0-3.6 V supply requirement and plan isolated gate drive for offline stages; overall BOM is lower than MCU-plus-dedicated-ballast-controller solutions.
推荐
Embedded Industrial Control and Communication Nodes
As a general 16-bit embedded controller, the DSPIC33CK32MC102-I/M6 handles industrial control nodes combining sensing, actuation, and serial communication. UART peripherals (with DMA support) implement Modbus RTU or custom protocols, timers generate actuator drive signals, and the DSP engine performs local signal analysis such as vibration or current-signature monitoring. The -40C to +125C industrial rating, flash ECC, and MBIST fit factory-floor reliability expectations, while the compact 4x4 mm UQFN suits dense control boards. Software is developed in MPLAB X with XC16 and debugged with SNAP/ICD hardware; the constraint versus larger MP-series parts is 32 KB flash and no CAN FD on the MC10X subfamily, so CAN-based nodes should select a 5XX variant instead.
推荐
推荐产品汇总
工程参考数据： DSPIC33CK32MC102-I/M6 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC33CK32MC102-H/M6 | DSPIC33CK64MC102-I/M6 | DSPIC33CK32MC101-I/M6 | DSPIC33CK64MC101-I/M6 |
|---|---|---|---|---|---|
| Package | 28-UQFN (4x4 mm) | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 100 MHz (100 MIPS) | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Program Flash | 32 KB (ECC) | 32 KB (ECC) | 64 KB (ECC) | 32 KB (ECC) | 64 KB (ECC) |
| Data SRAM | 8 KB (MBIST) | 8 KB | 8 KB | 8 KB | 8 KB |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Analog Feature Set | Op amps + comparators + 12-bit HS ADC | Same as MC102 | Same as MC102 | Reduced (MC101 tier) | Reduced (MC101 tier) |
关键差异点
- Full MC102 analog feature set in the smallest UQFN-28 footprint （对比 DSPIC33CK32MC101-I/M6)
- Same pinout with double the code headroom available （对比 DSPIC33CK64MC102-I/M6)
- Cost-optimized single-core solution （对比 DSPIC33CH64MP202-I/2N)
设计说明
The 28-UQFN 4x4 mm package has a center exposed pad that must be connected to a grounded copper pour with an array of thermal vias. This pad is often the primary ground return for the die, so omitting it can cause unreliable operation and poor thermal performance even at modest clock rates. Use a 0.1 mm stencil aperture reduction (about 80% coverage) on the exposed pad paste to avoid solder voiding during reflow.
The device requires a 3.0 V to 3.6 V supply; it is not 5 V tolerant as a rail. Decouple each VDD pin with 0.1 uF ceramics placed within 2 mm of the pin, plus a 4.7-10 uF bulk capacitor near the package. If the design derives 3.3 V from a 5 V or 12 V rail, select an LDO or buck with adequate transient response for the 100 MHz core's load steps. Verify VDD ramp rate against datasheet power-up requirements, and use MCLR with an external RC or supervisor if brownout behavior must be deterministic.
Peripheral register maps on dsPIC33CK differ from older dsPIC33F/CH families - UART, timer, and PWM drivers ported without review will fail. Also, the MC10X subfamily lacks CAN FD; if the project later needs CAN, a PCB respin to a 5XX part (different package) will be required, so confirm communication interfaces early. Finally, when substituting the 64 KB variant for code growth, confirm the exact M6 package code and pinout in the datasheet before reusing the footprint.
合规信息
RoHS/lead-free status based on current active Microchip commercial product offering; REACH, halogen-free and conflict-minerals statements not present in retrieved distributor data - verify on the Microchip product page.
