DSPIC33CK64MP102-I/2N - 100MHz 16-bit DSC 64KB Flash | Microchip
料号： DSPIC33CK64MP102-I/2N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4.42 | $4.42 |
| 10 | $3.98 | $39.80 |
| 100 | $3.54 | $354.00 |
| 500 | $3.18 | $1,590.00 |
| 1,000 | $2.86 | $2,860.00 |
DSPIC33CK64MP102-I/2N 概述
A digital signal controller combines the computational architecture of a microcontroller with the DSP capability of a digital signal processor. In the power-management hierarchy, the dsPIC33C family sits above basic MCUs by integrating a DSP engine, high-speed PWM peripherals and fast analog-to-digital conversion on one die, making it a go-to class of device for closed-loop digital power and motor control systems.
Key features include the 100 MIPS 16-bit dsPIC core with integrated DSP instructions, on-chip operational amplifiers, comparators, a high-speed 12-bit ADC, and dedicated high-resolution PWM peripherals. The device is also flagged by Microchip for Functional Safety (FuSa) support, which shortens qualification paths in safety-relevant industrial designs.
Architecturally, the DSPIC33CK64MP102 uses a modified Harvard single-core design with 16-bit wide instructions and DSP multiply-accumulate support, plus multiple DMA channels that move ADC results without CPU intervention. This reduces interrupt latency in fast control loops such as peak current-mode power conversion, where the ADC-to-PWM path must complete within a single switching period.
Typical applications include digital switching power supplies (LLC, totem-pole PFC), brushless DC and PMSM motor drives, advanced sensing front ends, and general precision control where the integrated op amps condition shunt or sensor signals directly.
Design consideration: the 28-pin UQFN footprint with exposed pad requires a solid ground pour under the die; share one VDD plane and verify 3.3V supply sequencing per the family datasheet.
This page synthesizes verified distributor data, drop-in family alternatives, FAQs, and design guidance not found in a single manufacturer source.
直接替换替代料： DSPIC33CK64MP102-I/2N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC33CK64MP102-I/2N （相同外形与封装尺寸） ——差异在于 Package, Core, Operating Temperature, Supply Voltage, PWM.
快速对比工具——选择替代料号进行并排对比：
DSPIC33CK64MP102-H/2N
✅ 直接替换📋 参考替代料（不在目录中）
DSPIC33CK128MP202-I/2N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3.05 / 个
查看数据手册 →DSPIC33CH64MP202-I/2N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3.31 / 个
查看数据手册 →DSPIC33CK32MP102-I/2N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33CK64MP102-I/2N 最大额定值与电气特性
| Core | dsPIC33CK 16-bit DSC |
| Core Speed | 100 MHz (100 MIPS) |
| Flash Memory | 64 KB (64K x 8) |
| RAM | 8 KB |
| 电源电压 | 3.3 V |
| Number of I/Os | 21 |
| ADC Resolution | 12-bit |
| On-chip Op Amps | Yes |
| Comparators | Yes |
| PWM | High-speed PWM |
| Communication Interfaces | I2C, I2S, SPI, UART |
| Timers | 4 |
| DMA Channels | 4 |
| Functional Safety | FuSa (Functional Safety) supported |
| 工作温度 | -40C to +125C |
| 封装 | 28-UQFN (6x6x0.55 mm) with exposed pad |
| 安装类型 | Surface Mount |
| Packaging | Tube |
| RoHS 状态 | Compliant |
DSPIC33CK64MP102-I/2N 28-uqfn (6x6x0.55 mm) with exposed pad 引脚配置指南
DSPIC33CK64MP102-I/2N（28-uqfn (6x6x0.55 mm) with exposed pad 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC33CK64MP102-I/2N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC33CK64MP102-I/2N 适用于 6 应用s: Digital Switching Power Supplies, BLDC and PMSM Motor Control, Advanced Sensing and Signal Conditioning, Functional Safety Industrial Control, Embedded Communication Nodes, Portable and Low-Power Instrumentation.
Digital Switching Power Supplies
The DSPIC33CK64MP102-I/2N fits digital power conversion because its 100 MHz, 100 MIPS dsPIC33CK core closes current-mode and voltage-mode control loops well within single switching periods of LLC, totem-pole PFC, and buck/boost stages. The high-speed 12-bit ADC samples the feedback and shunt nodes at high rates, while 4 DMA channels transfer results to memory without CPU overhead, keeping loop latency low. Dedicated high-resolution PWM peripherals generate complementary outputs with fine duty and dead-time control, and on-chip comparators support fast cycle-by-cycle current limiting. Placed between the feedback divider and the power stage gate drivers, the DSC replaces analog control ICs while adding configurability, soft-start sequencing, and digital telemetry; the trade-off is firmware development effort versus a fixed-function analog controller.
推荐
BLDC and PMSM Motor Control
For brushless DC and permanent-magnet synchronous motor drives, the DSPIC33CK64MP102-I/2N provides the processing and analog integration that field-oriented control (FOC) demands. The 100 MHz core executes current-loop and speed-loop mathematics with DSP multiply-accumulate instructions, while the on-chip operational amplifiers amplify low-side shunt currents directly, eliminating external amplifier ICs and reducing board area and offset error sources. The high-speed PWM module generates six complementary outputs with programmable dead time, and the 12-bit ADC is synchronized to the PWM for mid-shunt current sampling, a technique that avoids switching-noise corruption. Compared with a general-purpose MCU, the deterministic ADC-PWM path shortens loop latency, enabling higher electrical rotation frequencies; the designer should budget code space within the 64KB Flash for the FOC stack and communication.
推荐
Advanced Sensing and Signal Conditioning
The DSPIC33CK64MP102-I/2N suits advanced sensing front ends because it combines a fast 12-bit ADC, on-chip op amps, and comparators in one 6x6 mm package. Sensor outputs such as pressure bridges, thermistor dividers, or current shunts can be amplified by the internal operational amplifiers, filtered, and digitized without leaving the die, which improves noise immunity by shortening analog traces. Microchip explicitly targets advanced sensing and control for the dsPIC33CK64MP10X family. The DSP engine applies digital filtering or FFT-type math on the sampled data at 100 MIPS, and the 21 remappable I/O pins plus I2C, SPI, and UART interfaces stream results to system hosts. Designs should verify input ranges and op-amp bandwidth in the family datasheet to confirm fit per sensor type.
推荐
Functional Safety Industrial Control
The DSPIC33CK64MP102-I/2N carries Microchip Functional Safety (FuSa) support, which matters for industrial control equipment targeting safety standards such as machinery or process-control certifications. Microchip provides safety documentation packages and diagnostic libraries for FuSa-flagged dsPIC devices, reducing the burden of developing self-test routines for the CPU, clock, RAM, and Flash. In a safety-relevant controller, the 100 MHz core runs the main control logic while built-in comparators and independent watchdog-style supervision contribute to fault detection paths. The -40C to +125C industrial rating covers cabinet-mounted and thermally stressed installations. Engineering teams should obtain the appropriate Microchip safety manual for the dsPIC33CK family and follow its diagnostic coverage guidance; certification of the end system remains the integrator's responsibility.
推荐
Embedded Communication Nodes
With UART, SPI, I2C, and I2S interfaces and 21 remappable I/O pins, the DSPIC33CK64MP102-I/2N works well as a smart communication node that also performs local signal processing. The Peripheral Pin Select feature lets designers route serial functions to optimal physical pins, easing PCB routing in dense boards. I2S support enables digital audio transport, while UART and SPI connect to modems, transceivers, and external flash. The 100 MHz DSP core adds value over plain interface MCUs by handling protocol stacking, CRC computation, and local control decisions without a second processor. In multi-node industrial networks, the DSC can bridge a fieldbus on UART to sensors on I2C while buffering traffic through its 4 DMA channels, keeping CPU load low and response times deterministic.
推荐
Portable and Low-Power Instrumentation
The 28-UQFN 6x6x0.55 mm package of the DSPIC33CK64MP102-I/2N occupies about 36 square millimeters, making it appropriate for compact instrumentation, handheld testers, and dense mixed-signal boards. The exposed pad provides a low-inductance ground that benefits analog performance of the 12-bit ADC and op amps in battery-powered instruments. The 3.3V single-supply operation simplifies power-tree design alongside other low-voltage logic, and the industrial temperature grade supports field equipment used outdoors. Designers of portable gear should exploit the integrated op amps to minimize external analog components and should review the dsPIC33CK family datasheet for low-power mode currents when specifying battery life. Code updates in the field are supported through In-Circuit Serial Programming via standard Microchip programmer tools such as the ICD and PICkit product lines.
推荐
推荐产品汇总
工程参考数据： DSPIC33CK64MP102-I/2N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC33CK64MP102-H/2N | DSPIC33CK128MP202-I/2N | DSPIC33CH64MP202-I/2N | DSPIC33CK32MP102-I/2N |
|---|---|---|---|---|---|
| Package | 28-UQFN (6x6 mm), EP | 28-UQFN (6x6 mm), EP - same | 28-UQFN (6x6 mm), EP - same | 28-UQFN (6x6 mm), EP - same | 28-UQFN (6x6 mm), EP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 100 MHz (100 MIPS) | 100 MHz | 100 MHz | 100 MHz (dual-core) | 100 MHz |
| Flash Memory | 64 KB | 64 KB | 128 KB | 64 KB | 32 KB |
| Core Type | Single-core dsPIC33CK | Single-core dsPIC33CK | Single-core dsPIC33CK | Dual-core dsPIC33CH | Single-core dsPIC33CK |
| Operating Temperature | -40C to +125C | Extended grade (H suffix) | -40C to +125C | -40C to +125C | -40C to +125C |
关键差异点
- Functional Safety (FuSa) support （对比 DSPIC33CK128MP202-I/2N)
- Balanced 64KB Flash / 8KB RAM memory point （对比 DSPIC33CK32MP102-I/2N)
- Simpler single-core development versus dual-core （对比 DSPIC33CH64MP202-I/2N)
- Cost trade-off for memory-limited firmware （对比 DSPIC33CK128MP202-I/2N)
设计说明
The 28-UQFN (6x6 mm) package has an exposed pad on the underside that must be soldered to a grounded copper pour. Create a via array (typically 4-9 vias) under the pad to tie it to the ground plane; this provides both electrical return and thermal relief for the die. The 0.55 mm profile leaves little room for rework, so verify the stencil aperture design and paste volume before first production. Follow the Microchip family datasheet land-pattern recommendation rather than generic UQFN footprints, since pad geometry for the /2N package is package-specific.
The device operates from a nominal 3.3V supply. Decouple each VDD pin with a 100 nF ceramic capacitor placed within 2 mm of the pin, plus at least one bulk capacitor (4.7-10 uF) near the device. Confirm exact VDD/VSS pin assignment in the dsPIC33CK64MP102 datasheet pinning section for the /2N package. When switching loads (gate drivers, relays) share the same 3.3V rail, add local ferrite bead filtering to prevent supply dips from resetting the DSC during ADC sampling or PWM switching events.
Do not assume pin functions from the schematic symbol alone: the dsPIC33CK family uses Peripheral Pin Select (PPS), so UART, SPI, I2C, and PWM routings are configured in firmware at reset. Verify that your PPS assignments do not conflict with analog-only pins used by the op amps and ADC channels. Also confirm configuration-bit settings (oscillator source, watchdog, code protection) early - incorrect oscillator configuration bits are the most common cause of a 'dead' first board. Flash a blink test with the internal FRC oscillator before committing to external crystal timing.
For digital power applications, keep the ADC input traces to shunt/feedback nodes short and route them away from PWM gate-drive lines. Synchronize ADC sampling to the PWM period using the family's ADC-to-PWM trigger features so that current sampling occurs in a low-noise window (e.g., mid-PWM). Use the on-chip op amps in their specified bandwidth range and add a small RC anti-aliasing filter ahead of ADC inputs when switching noise is present; typical cutoffs of a few hundred kHz preserve control-loop bandwidth while rejecting gate-drive transients.
合规信息
Distributor listings (Newark/Globalspec) describe the part as RoHS compliant. AEC-Q100 qualification is not stated in the provided data; consult Microchip's automotive catalog for automotive-grade dsPIC33 options.
