DSPIC33EP256GP504T-I/MV - 16-Bit DSC 70 MIPS 256KB Flash | Microchip
料号： DSPIC33EP256GP504T-I/MV ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33EP256GP504T-I/MV 概述
A digital signal controller combines the compute throughput of a microcontroller with DSP engine features such as a barrel shifter, hardware multiply-accumulate, and modulo/bit-reversed addressing. Within the power-management hierarchy, the dsPIC33E family sits above basic 8-bit MCUs and below application processors, serving as the compute heart of embedded motor control, power conversion, and sensing systems.
Key differentiating features include the enhanced CAN 2.0B communication peripheral for automotive and industrial networks, integrated operational amplifiers and comparators that reduce external analog component count, the CTMU (Charge Time Measurement Unit) for capacitive touch and precise timing, and the Peripheral Trigger Generator (PTG) that automates peripheral sequencing for deterministic, CPU-light operation. Four DMA channels offload high-bandwidth data transfers such as ADC result streaming.
The dsPIC33EP core uses a pipelined 16-bit architecture with 24-bit instruction words, achieving excellent code density and deterministic single-cycle MAC execution. Hi-Speed PWM outputs make the device well suited to digital power topologies, while the multiple internal bus architecture sustains peripheral throughput at full 70 MIPS operation.
Typical applications include brushless and PMSM motor drives, digital switched-mode power supplies, automotive body and gateway modules leveraging CAN, industrial sensors, and capacitive-touch human interface devices. The integrated op amps allow current-sense amplification directly on-chip.
A key design consideration is power supply decoupling: the UQFN 6x6 package exposes VDD/VCAP pins that require low-ESR ceramic decoupling, and the internal regulator capacitor (VCAP) must be sized per the manufacturer datasheet for stable core operation.
This page synthesizes distributor pricing context, drop-in alternatives, pinout guidance, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： DSPIC33EP256GP504T-I/MV ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC33EP256GP504T-I/MV （相同外形与封装尺寸） ——差异在于 Package, Core, Operating Temperature, Peripherals, Program Memory Size.
快速对比工具——选择替代料号进行并排对比：
DSPIC33EP256GP504T-E/MV
✅ 直接替换📋 参考替代料（不在目录中）
DSPIC33EP256GP504-I/MV
✅ 直接替换📋 参考替代料（不在目录中）
DSPIC33EP128GP504T-I/MV
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3.62 / 个
查看数据手册 →DSPIC33EP64GP504T-I/MV
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$4.2 / 个
查看数据手册 →DSPIC33EP256MC504T-I/MV
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33EP256GP504T-I/MV 最大额定值与电气特性
| Core | 16-bit dsPIC33E DSC |
| Max MIPS | 70 MIPS |
| Clock Frequency | 60 MHz |
| Flash Program Memory | 256 KB (85.5K x 24) |
| RAM | 32 KB |
| DMA Channels | 4 |
| Peripherals | OpAmps, Comparators, PTG, CAN, CTMU |
| Communication Interfaces | CAN 2.0B, UART, SPI, I2C |
| PWM | Hi-Speed PWM |
| 封装 | 48-UQFN (6x6 mm), MV suffix |
| 安装类型 | Surface Mount |
| Technology | CMOS |
| Special Features | Barrel shifter, boundary scan |
| Temperature Grade | -40C to +85C (I grade) |
| Packaging | Tape & Reel (T suffix) |
| Family | dsPIC33EP256GP504 (General Purpose) |
DSPIC33EP256GP504T-I/MV 48-uqfn (6x6 mm), mv suffix 引脚配置指南
DSPIC33EP256GP504T-I/MV（48-uqfn (6x6 mm), mv suffix 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC33EP256GP504T-I/MV.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC33EP256GP504T-I/MV 适用于 6 应用s: Brushless DC / PMSM Motor Control, Digital Power Supplies and Converters, Automotive Body and Gateway Modules, Industrial Sensing and Signal Conditioning, Capacitive Touch Human Interface Devices, Audio and DSP Signal Processing Nodes.
Brushless DC / PMSM Motor Control
The DSPIC33EP256GP504T-I/MV fits motor-control designs through its 70 MIPS DSP core, Hi-Speed PWM outputs, and integrated op amps that amplify shunt current signals on-chip without external amplifiers. Field-oriented control (FOC) firmware uses the hardware MAC engine and barrel shifter to execute Clarke/Park transforms in single-cycle operations, while the 32KB RAM holds current-loop lookup tables and filter histories. The four DMA channels stream ADC results into RAM so the control loop stays deterministic at high PWM frequencies. For sensorless designs, the comparators implement zero-crossing detection with minimal CPU overhead, and the PTG sequences ADC/PWM triggers autonomously.
推荐
Digital Power Supplies and Converters
Digital SMPS and LLC/PFC converters benefit from the part's Hi-Speed PWM with sub-nanosecond-class resolution and complementary outputs for half-bridge topologies. The 70 MIPS core closes voltage-mode or current-mode loops fast enough for switching frequencies in the hundreds of kilohertz, while the on-chip op amps condition current-sense and output-voltage feedback signals, reducing BOM count. The 256KB Flash accommodates adaptive control, soft-start sequencing, and multiple converter profiles; the CTMU supports precision timing measurements. The PTG can trigger PWM and ADC sampling pairs automatically, keeping loop latency independent of background tasks and communication interrupts.
推荐
Automotive Body and Gateway Modules
The enhanced CAN 2.0B module makes this DSC suitable for body-control, lighting, and gateway nodes on automotive and heavy-equipment networks. Four DMA channels offload CAN message buffering while the 70 MIPS core runs application logic, diagnostics, and UDS-style service routines concurrently. The 256KB Flash stores dual-bank firmware for field OTA updates, and 32KB RAM supports message queues and boot loaders. Industrial -I grade (-40C to +85C) covers most under-dash and engine-bay-adjacent zones; for AEC-Q100-critical positions, the -E suffix variants listed on Microchip USA documentation should be evaluated instead.
推荐
Industrial Sensing and Signal Conditioning
Sensor front ends exploit the integrated op amps and 12-bit-class ADC to amplify and digitize bridge, thermocouple, and shunt signals directly, removing external amplifier ICs. The CTMU provides charge-time measurement for capacitive and resistive sensing with picosecond-class current sources, and the comparators offer threshold alarms without CPU polling. The PTG sequences sensor sampling automatically, so the 70 MIPS core spends its cycles on compensation, linearization, and CAN/UART reporting rather than timing housekeeping. Boundary-scan support simplifies production test of densely populated industrial boards built on this 48-UQFN footprint.
推荐
Capacitive Touch Human Interface Devices
The CTMU (Charge Time Measurement Unit) enables capacitive-touch buttons, sliders, and proximity sensing using ordinary PCB pads, with the integrated comparators providing fast threshold detection. The 70 MIPS core runs debounce, drift-compensation, and multi-key gesture algorithms while UART or I2C reports touch events to a host. 256KB Flash is ample for touch-tuning tables, multiple language stacks, and bootloader code. Because touch sensing, LED driving via PWM, and host communication all run on one 48-UQFN chip at -40C to +85C, this part consolidates a keypad or control-panel BOM into a single controller.
推荐
Audio and DSP Signal Processing Nodes
The DSP engine - 24-bit instruction words, single-cycle multiply-accumulate, dual operand fetch, and bit-reversed addressing for FFTs - makes this DSC effective for embedded audio filtering, active noise cancellation, and acoustic diagnostics. SPI and UART interfaces connect to audio codecs and external flash; four DMA channels stream sample buffers to and from 32KB RAM without core intervention, ensuring gap-free processing at 48 kHz-class sample rates. Hi-Speed PWM can also drive class-D output stages. 256KB Flash holds long FIR/IIR coefficient sets and multiple tuning profiles for product variants on one PCB.
推荐
推荐产品汇总
工程参考数据： DSPIC33EP256GP504T-I/MV ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC33EP256GP504T-E/MV | DSPIC33EP128GP504T-I/MV | DSPIC33EP64GP504T-I/MV | DSPIC33EP256MC504T-I/MV |
|---|---|---|---|---|---|
| Package | 48-UQFN (6x6 mm) | 48-UQFN (6x6) - same | 48-UQFN (6x6) - same | 48-UQFN (6x6) - same | 48-UQFN (6x6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 16-bit, 70 MIPS, 60 MHz | 16-bit, 70 MIPS, 60 MHz | 16-bit, 70 MIPS, 60 MHz | 16-bit, 70 MIPS, 60 MHz | 16-bit, 70 MIPS, 60 MHz |
| Flash Program Memory | 256 KB (85.5K x 24) | 256 KB | 128 KB (-50%) | 64 KB (-75%) | 256 KB |
| Temperature Grade | -40C to +85C (I) | Extended (-E grade) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| Peripheral Focus | GP: OpAmps, CTMU, PTG, CAN | Identical GP peripherals | Identical GP peripherals | Identical GP peripherals | Motor-control PWM/ADC mix (MC) |
| Packaging | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) |
关键差异点
- Extended temperature option in identical footprint （对比 DSPIC33EP256GP504T-I/MV vs DSPIC33EP256GP504T-E/MV)
- Integrated analog reduces external BOM （对比 DSPIC33EP256MC504T-I/MV)
- Largest Flash in the 48-UQFN GP504 family （对比 DSPIC33EP128GP504T-I/MV)
- Trade-off: no cross-brand drop-in exists （对比 STM32 or TI C2000 competitors)
设计说明
Estimated: dsPIC33EP devices use an internal 1.8V core regulator fed from the VDD 3.0-3.6V rail via the VCAP pin; the datasheet specifies a low-ESR ceramic capacitor (typically around 10 uF class) on VCAP for core stability. Place this capacitor immediately adjacent to the VCAP pin with a solid return path. Decouple each VDD pair with 100 nF ceramics plus one bulk 4.7-10 uF per rail. Never power I/O banks while VCAP is floating - this is the most common bring-up failure on UQFN dsPIC33E boards.
The 48-UQFN 6x6 package requires careful land-pattern and stencil design: use an approximately 50-60% paste reduction on the center exposed thermal pad (GND) to prevent solder-bumping and tombstoning of the fine-pitch perimeter pads, per standard QFN assembly practice. Tie the exposed pad to multiple ground vias (4x4 via array) for heat spreading and a low-inductance ground return for the ADC and PWM peripherals. Verify pad geometry against the Microchip package outline drawing in DS70000657J before PCB release.
Configure PGEC/PGED programming pins and the MCLR pin correctly at layout time: MCLR needs a pull-up (approximately 10K) and an ICSP header for in-circuit programming - omitting these makes the UQFN part nearly impossible to reprogram after assembly. Also note that EMUC/EMUD emulation channels share pins with peripherals; avoid mapping critical PWM outputs onto PGC/PGD pins if you plan in-circuit debugging. Check errata for the dsPIC33EP family on microchip.com before finalizing peripheral clock configurations.
At 60 MHz internal operation, keep the external crystal/oscillator traces short (under 20 mm) and guard them with ground pour. Route CAN_H/CAN_L as a 120-ohm differential pair with a stub length under 10 cm, and place the transceiver within 20 mm of the MCU CAN TX/RX pins. For ADC accuracy, separate the analog ground region under the AVDD/AVSS pins from PWM switching currents; the integrated op amp inputs are sensitive to switching coupling from Hi-Speed PWM traces on adjacent layers.
合规信息
Compliance status not stated in the provided web data. Modern Microchip dsPIC33EP production parts are typically RoHS-compliant lead-free, but verify on the official Microchip product page before specifying. The -E/ML sibling is described by Microchip USA as AEC-Q100 qualified; qualification for this exact -I ordering code is not confirmed in the provided data.
