DSPIC33EP64GP503-E/M5 - 16-bit 60 MIPS DSC, 64KB Flash | Microchip
料号： DSPIC33EP64GP503-E/M5 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33EP64GP503-E/M5 概述
A digital signal controller combines the computational architecture of a digital signal processor (DSP) with the peripheral integration and ease of use of a microcontroller (MCU). Within the power management hierarchy of embedded systems, the dsPIC33E family sits between general-purpose MCUs and dedicated DSPs, offering single-cycle MAC, barrel shifting, and hardware divide alongside familiar peripherals such as UART, SPI, I2C, and CAN.
Key features of the DSPIC33EP64GP503-E/M5 include an integrated CAN 2.0B module for industrial and automotive networking, three on-chip operational amplifiers (OpAmps) that reduce external analog component count, four analog comparators, a Charge Time Measurement Unit (CTMU) for capacitive touch and precise time measurement, and a Peripheral Trigger Generator (PTG) for autonomous peripheral sequencing. Hi-Speed PWM outputs make it well suited for power conversion and motor control topologies.
The dsPIC33E core provides a 16-bit modified Harvard architecture with a 24-bit instruction word, four DMA channels that move data without CPU intervention, and five 16-bit timers. These resources enable deterministic real-time behavior in control loops running at multi-kilohertz update rates.
Typical applications include industrial motor control (BLDC, PMSM, AC induction), digital power supplies and power factor correction, CAN-based automotive and industrial sensor nodes, and touch-sensing interfaces leveraging the CTMU.
Design consideration: the -E temperature variant supports extended ambient operation to +125C, but thermal design of the exposed-pad UQFN package is critical at 60 MIPS operation; solder the thermal pad to a copper pour for reliable junction temperatures.
This page synthesizes distributor pricing context, drop-in alternative analysis, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： DSPIC33EP64GP503-E/M5 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC33EP64GP503-E/M5 （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Core, RAM, Supply Voltage.
快速对比工具——选择替代料号进行并排对比：
DSPIC33EP64GP503-I/M5
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3.32 / 个
查看数据手册 →DSPIC33EP64GP503-H/M5
✅ 直接替换📋 参考替代料（不在目录中）
DSPIC33EP32GP503-E/M5
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2.9 / 个
查看数据手册 →DSPIC33EP128GP503-E/M5
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33EP64MC503-E/M5
✅ 直接替换✓ 有现货
$2.89 / 个
查看数据手册 →DSPIC33EP64GP503-E/M5 最大额定值与电气特性
| Core | dsPIC33E 16-bit DSC |
| Core Speed | 60 MIPS (60 MHz) |
| Program Memory (Flash) | 64 KB (22K x 24) |
| RAM | 8 KB |
| 电源电压 | 3.3 V |
| CAN Module | Yes (CAN 2.0B) |
| On-chip Op Amps | 3 |
| Analog Comparators | 4 |
| CTMU | Yes (Charge Time Measurement Unit) |
| Peripheral Trigger Generator (PTG) | Yes |
| Timers | 5 x 16-bit |
| DMA Channels | 4 |
| PWM | Hi-Speed PWM |
| 工作温度 | -40C to +125C (E grade) |
| 封装 | 36-VTLA (UQFN, 5x5 mm, exposed pad) |
| 安装类型 | Surface Mount |
| Technology | CMOS |
| Production Status | In Production |
DSPIC33EP64GP503-E/M5 36-vtla (uqfn, 5x5 mm, exposed pad) 引脚配置指南
DSPIC33EP64GP503-E/M5（36-vtla (uqfn, 5x5 mm, exposed pad) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC33EP64GP503-E/M5.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC33EP64GP503-E/M5 适用于 6 应用s: Industrial Motor Control, Digital Power Supplies and PFC, CAN-Based Automotive and Industrial Nodes, Capacitive Touch and CTMU Measurement, Portable and Battery-Powered Instruments, Embedded Sensing and IoT Edge Nodes.
Industrial Motor Control
The DSPIC33EP64GP503-E/M5 fits motor-drive designs because its 60 MIPS DSP core executes field-oriented control (FOC) inner loops at multi-kilohertz rates with deterministic latency, while three on-chip op amps amplify shunt current feedback without external amplifiers and four comparators provide hardware overcurrent trip paths that act faster than any software loop. The Hi-Speed PWM peripheral generates complementary outputs with dead-time insertion for three-phase inverters driving BLDC, PMSM, and AC induction machines. In use, the DSC reads phase currents through the internal op amps into the ADC, computes the control loop, and updates PWM duty cycles within one PWM period, while the -40C to +125C temperature range suits drives mounted near hot power stages. The trade-off versus a dedicated MC-series dsPIC is that some PWM-specific features differ, so verify the GP PWM module meets your inverter topology requirements.
推荐
Digital Power Supplies and PFC
Digital switching power supplies benefit directly from this DSC's Hi-Speed PWM with high resolution and dead-time control, its 60 MIPS core for executing average-current-mode or voltage-mode control laws, and its on-chip op amps that condition current-shunt and voltage-divider feedback signals. The CTMU supports precise time-based measurements useful in resonant converter supervision, and comparators implement cycle-by-cycle current limiting in hardware, protecting the power stage even if firmware stalls. A typical topology places the DSC between the feedback divider network and the gate drivers of a boost PFC or LLC stage, updating duty cycle every switching cycle at tens to hundreds of kilohertz. The four DMA channels offload ADC sample transfer, keeping the CPU free for supervisory tasks such as CAN-based telemetry. Consider the MC-series variant if your control scheme requires the motor-control-class PWM enhancements such as advanced phase shifting.
推荐
CAN-Based Automotive and Industrial Nodes
With an integrated CAN 2.0B module and -40C to +125C operation, the DSPIC33EP64GP503-E/M5 is a strong fit for body-control, sensor, and actuator nodes on automotive and industrial CAN networks. The CAN peripheral handles message buffering and error management largely in hardware, while four DMA channels move CAN payloads and ADC data without CPU intervention, and 64KB of Flash accommodates protocol stacks such as CANopen or J1939 application layers. The three op amps and four comparators allow local analog conditioning of sensor signals (position, current, pressure) before transmission, reducing external component count on space-constrained nodes. The extended temperature grade is essential for under-hood or high-vibration industrial enclosures where ambient temperatures exceed +85C. Designers should budget the exposed thermal pad of the 36-pin UQFN package to a solid ground pour to keep junction temperature within limits at full core speed.
推荐
Capacitive Touch and CTMU Measurement
The Charge Time Measurement Unit (CTMU) on this DSC enables capacitive touch sensing and precision time-of-flight or current measurement without a dedicated touch controller. The CTMU sources a calibrated constant current into external sense pads; the time to charge each pad's capacitance is measured with the ADC, and firmware applies oversampling and drift compensation for stable touch detection through overlays up to several millimeters thick. Because the touch engine runs on the same 60 MIPS core that handles application logic, a single DSPIC33EP64GP503-E/M5 can replace a separate touch IC plus MCU, cutting BOM cost and board area in appliance control panels, industrial HMI buttons, and sealed consumer interfaces. The -E temperature grade maintains touch threshold stability across automotive and outdoor temperature extremes. Design guidance from Microchip's CTMU application notes recommends guarding traces and grounding planes around sense pads to maximize signal-to-noise ratio.
推荐
Portable and Battery-Powered Instruments
Handheld instruments, data loggers, and battery-powered test devices benefit from the DSC's DSP acceleration for FFT-based analysis, filtering, and sensor fusion at 60 MIPS while the 16-bit architecture keeps code density high in 64KB Flash. The Peripheral Trigger Generator (PTG) sequences ADC sampling, PWM updates, and other peripherals autonomously, allowing the CPU to sleep between measurement bursts and extend battery life; the four DMA channels similarly eliminate per-sample CPU overhead. The 3.3V single-supply operation and compact 5x5 mm UQFN-36 package support miniaturized layouts, while the three op amps condition bridge or electrode signals from the analog front end directly on-chip. Typical products include portable vibration analyzers, handheld medical measurement pods, and environmental loggers communicating over UART or SPI radios. The extended -E temperature option suits instruments left in vehicles or used outdoors across seasons.
推荐
Embedded Sensing and IoT Edge Nodes
As an edge node, the DSPIC33EP64GP503-E/M5 aggregates analog sensors through its integrated op amps, comparators, and ADC, performs local DSP (filtering, thresholding, feature extraction) on the 60 MIPS core, and reports results over its hardware CAN interface or via external UART/SPI radio modules. The 64KB Flash holds both the application and a modest communication stack, while 8KB RAM buffers sensor windows for DSP processing. The PTG automates periodic sampling sequences so the CPU can remain in low-power idle between wakeups, extending battery life in wirelessly powered or energy-harvesting nodes common in factory condition monitoring. The -40C to +125C temperature range and CMOS process make the part robust on unconditioned industrial machinery. A practical consideration: the heavily multiplexed Peripheral Pin Select mapping provides layout flexibility but requires careful pin assignment verification in the datasheet before routing the PCB.
推荐
推荐产品汇总
工程参考数据： DSPIC33EP64GP503-E/M5 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC33EP64GP503-I/M5 | DSPIC33EP64GP503-H/M5 | DSPIC33EP32GP503-E/M5 | DSPIC33EP128GP503-E/M5 | DSPIC33EP64MC503-E/M5 |
|---|---|---|---|---|---|---|
| Package | 36-VTLA (UQFN, 5x5 mm, EP) | 36-VTLA (UQFN, 5x5 mm, EP) - same | 36-VTLA (UQFN, 5x5 mm, EP) - same | 36-VTLA (UQFN, 5x5 mm, EP) - same | 36-VTLA (UQFN, 5x5 mm, EP) - same | 36-VTLA (UQFN, 5x5 mm, EP) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Flash Memory | 64 KB (22K x 24) | 64 KB (22K x 24) | 64 KB (22K x 24) | 32 KB | 128 KB | 64 KB (22K x 24) |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | H-grade screening | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) |
| Peripheral Set | GP: CAN, 3 OpAmps, 4 Comp, PTG, CTMU, Hi-Speed PWM | Identical GP set | Identical GP set | Identical GP set | Identical GP set | MC set (motor-control PWM emphasis) |
| Primary Trade-off | Extended temp GP DSC, balanced analog + CAN | Lower cost, reduced temp range | Alternate screening flow | Lower cost, half Flash | Higher cost, double Flash | Motor-control PWM, GP peripherals differ |
关键差异点
- Extended -40C to +125C operation in the same footprint （对比 DSPIC33EP64GP503-I/M5)
- Three integrated op amps reduce analog BOM （对比 DSPIC33EP64MC503-E/M5)
- Scalable Flash within a fixed footprint （对比 DSPIC33EP128GP503-E/M5)
设计说明
The 36-pin VTLA/UQFN 5x5 mm package dissipates heat primarily through its exposed pad. Estimated: at 60 MIPS with CAN and analog peripherals active, core current is on the order of tens of milliamps from a 3.3V rail, yielding power dissipation of roughly 0.1-0.3 W; with the package's typical junction-to-ambient resistance this gives a junction rise well under 30C, but at +125C ambient the margin narrows. Solder the exposed pad to a minimum 2x2 via-array copper pour connected to the ground plane, and verify junction temperature against the datasheet absolute maximum with your actual firmware current profile.
Decouple each VDD pin with a 100 nF ceramic capacitor placed within 2 mm of the pin, plus one bulk 4.7-10 uF capacitor near the device. The exposed pad is the primary ground connection - do not treat it as optional - and connect it through an array of thermal vias to the ground plane. Route the OSC1/OSC2 crystal traces short and guarded by ground. Because analog op-amp inputs share pins with digital I/O via Peripheral Pin Select, keep analog routing away from PWM and CAN traces to limit switching noise coupling into the ADC front end.
The dsPIC33E peripheral pin select (PPS) remaps many digital functions, so a schematic that looks correct on paper may still need PPS register verification before layout sign-off. MCLR must be pulled up (typically 10 k-ohm) and kept accessible for ICSP programming; locking it out makes field rework difficult. When substituting Flash-size or temperature-grade family variants, confirm the configuration words and the voltage operating range in the datasheet, since -I grade parts are not characterized above +85C even if the board happens to work at room temperature.
合规信息
FindIC lists this MPN as automotive-category 36-Pin UQFN EP. RoHS/lead-free status follows Microchip standard environmental policy for active dsPIC33E parts; obtain formal certificates from Microchip's environmental portal.
