DSPIC33EP64GP504T-E/ML - 16-bit 60 MIPs DSC 64KB Flash | Microchip
料号： DSPIC33EP64GP504T-E/ML ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33EP64GP504T-E/ML 概述
A digital signal controller combines the deterministic control of a microcontroller with the math throughput of a DSP. In the power-management hierarchy, the dsPIC33EP family sits above basic MCUs by adding a DSP engine, high-speed ADC, and motor-control peripherals, making the category the standard choice for embedded control systems that require real-time loop execution such as digital power conversion and precision motor drives.
Key features include the 16-bit dsPIC33E core running at 60 MIPs, on-chip CAN 2.0B communication, three op amps and four comparators for analog signal conditioning, a Charge Time Measurement Unit (CTMU) for touch sensing and time measurement, and a Peripheral Trigger Generator (PTG) for autonomous peripheral sequencing. The device provides 35 I/O pins, five 16-bit timers, four DMA channels, and four external interrupt sources.
Architecturally, the dsPIC33EP core uses a modified Harvard pipeline with a barrel shifter and DSP multiply-accumulate instructions, enabling single-cycle MAC operations critical for control-law computation. The integrated analog front-end reduces external component count in closed-loop power and motor systems, while the E-grade silicon and QFN thermal pad support harsh automotive ambient environments.
Typical applications include automotive body and powertrain auxiliaries, BLDC/PMSM motor control, digital power supplies (PFC, LLC), and industrial sensing nodes that exploit the CTMU and on-chip op amps. The CAN interface makes it a natural fit for in-vehicle networking nodes.
Design consideration: the E suffix denotes the extended -40C to +150C range; the -40C to +85C industrial I-grade alternative costs less if your ambient does not exceed 85C. Route the exposed thermal pad to ground plane for best thermal and noise performance.
This page synthesizes distributor availability, drop-in temperature-grade alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： DSPIC33EP64GP504T-E/ML ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC33EP64GP504T-E/ML （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Core, Program Memory, RAM.
快速对比工具——选择替代料号进行并排对比：
DSPIC33EP64GP504T-I/ML
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →DSPIC33EP64GP504T-H/ML
✅ 直接替换📋 参考替代料（不在目录中）
DSPIC33EP64GP504-I/ML
✅ 直接替换✓ 有现货
$3.44 / 个
查看数据手册 →DSPIC33EP64GP504T-E/ML 最大额定值与电气特性
| Core | dsPIC33E, 16-bit |
| Core Speed | 60 MIPs (60 MHz clock) |
| Program Memory | 64 KB (22K x 24) FLASH |
| RAM | 8 KB (4K x 16) |
| I/O Pins | 35 |
| 封装 | 44-QFN (8x8 mm), exposed pad, 0.65 mm pitch |
| 工作温度 | -40C to +150C (E grade) |
| Automotive Qualification | AEC-Q100 qualified |
| Communication Interfaces | CAN 2.0B, UART, SPI, I2C |
| Timers | 5 x 16-bit |
| DMA Channels | 4 |
| External Interrupts | 4 |
| Analog Peripherals | 3 op amps, 4 comparators, CTMU |
| Peripheral Trigger Generator | Yes (PTG) |
| Special Features | Barrel shifter, boundary scan, low-power modes |
| 安装类型 | Surface Mount |
| Packaging | Tape and Reel (T suffix) |
DSPIC33EP64GP504T-E/ML 44-qfn (8x8 mm), exposed pad, 0.65 mm pitch 引脚配置指南
DSPIC33EP64GP504T-E/ML（44-qfn (8x8 mm), exposed pad, 0.65 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC33EP64GP504T-E/ML.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC33EP64GP504T-E/ML 适用于 6 应用s: Automotive Body and Auxiliary Control, BLDC/PMSM Motor Control, Digital Power Supplies (PFC/LLC), Industrial Sensing and Condition Monitoring, Capacitive Touch HMI Panels, Embedded Networked Control Nodes.
Automotive Body and Auxiliary Control
The DSPIC33EP64GP504T-E/ML fits automotive auxiliary nodes because its AEC-Q100 qualification and -40C to +150C E-grade rating survive under-hood and near-engine ambient conditions where standard industrial MCUs fail. The on-chip CAN 2.0B module connects the node directly to the vehicle network without an external CAN controller, while 35 I/O lines drive relays, lamps, and sensors. Three integrated op amps and four comparators condition analog feedback locally, and the CTMU supports capacitive touch interfaces for human-machine controls. Deployed between the vehicle 12V rail (via a regulator) and the actuator drivers, the 60 MIPs core executes control loops and diagnostics deterministically; the trade-off versus a simpler MCU is slightly higher quiescent consumption, acceptable in body modules powered from the main battery.
推荐
BLDC/PMSM Motor Control
The DSPIC33EP64GP504T-E/ML is a strong fit for Brushless DC and permanent-magnet synchronous motor drives because its dsPIC33E core executes single-cycle DSP multiply-accumulate instructions at 60 MIPs, sufficient for field-oriented control loops at typical 10-20 kHz PWM frequencies. The three on-chip op amps buffer shunt-resistor phase-current signals directly, and four comparators implement hardware overcurrent trip and zero-crossing detection without external analog parts. The Peripheral Trigger Generator sequences ADC sampling to PWM edges autonomously, minimizing loop jitter. Placed between the gate-driver front end and the current-sense shunts, the DSC closes the current and speed loops; the exposed-pad 44-QFN package must be grounded to the power-board ground plane to keep the analog front end quiet relative to switching noise.
推荐
Digital Power Supplies (PFC/LLC)
In digital power conversion, the DSPIC33EP64GP504T-E/ML supplies the fast, deterministic control needed for PFC and LLC converter loops. The 60 MIPs core with DSP MAC instructions computes compensator updates between PWM cycles, while the PTG and DMA move ADC results into the control loop with minimal CPU overhead, keeping loop latency low and jitter small. Four comparators provide cycle-by-cycle current limiting in hardware, independent of firmware, which is essential for fault survival. The DSC sits between the voltage/current sense dividers and the PWM gate-driver inputs; unlike analog control ICs it allows firmware-defined nonlinear compensation and soft-start profiles, at the cost of requiring careful firmware watchdog design so a code fault cannot leave the power stage uncontrolled.
推荐
Industrial Sensing and Condition Monitoring
For industrial sensing nodes, the DSPIC33EP64GP504T-E/ML leverages its Charge Time Measurement Unit (CTMU) for precise capacitance and time-interval measurement, enabling level, proximity, and humidity sensing without a dedicated analog front end. Three op amps and four comparators amplify and threshold sensor signals on-chip, and the 12-bit ADC (dsPIC33EP family ADC) samples them under PTG-triggered deterministic timing. SPI and I2C interfaces connect external precision converters or memory, while UART links the node to PLC or SCADA gateways. Operating from a 24V industrial bus through a step-down regulator, the DSC's -40C to +150C rating tolerates panel-mounted environments near heat sources; the trade-off is that on-chip op amps are adequate for conditioning but precision metrology still benefits from an external ADC.
推荐
Capacitive Touch HMI Panels
The DSPIC33EP64GP504T-E/ML serves touch-based human-machine interfaces because the CTMU peripheral measures charge time on touch pads with resolution fine enough to detect finger capacitance changes, and Microchip provides mTouch sensing libraries for the dsPIC33EP family. With 35 I/O pins, the same DSC drives LEDs, buzzers, and small segment LCD backlights directly, consolidating HMI logic into one chip. The four comparators can implement wake-on-touch thresholds that let the core sleep in low-power mode, cutting average current in battery-adjacent installations. Mounted behind a dielectric overlay, the 44-QFN's exposed pad grounds the analog domain for stable CTMU measurements; keep touch traces short and guard them with ground to prevent false triggers from switching supplies nearby.
推荐
Embedded Networked Control Nodes
As a general embedded control node, the DSPIC33EP64GP504T-E/ML combines CAN, dual UART, SPI, and I2C on one chip, letting one 60 MIPs core bridge a vehicle or industrial CAN backbone to local sensors and actuators. Four DMA channels offload serial transfers from the CPU, and five 16-bit timers generate the timebases for scheduling, measurement, and pulse-width tasks. The 64KB FLASH accommodates application code plus communication stacks (e.g., CANopen-style layers) without external memory, and the E-grade rating plus AEC-Q100 qualification allows deployment in both industrial and automotive enclosures. Designers should budget the 8KB RAM carefully - large buffers for network stacking are the main constraint - and use the exposed thermal pad tied to ground for EMC robustness on the CAN edge rates.
推荐
推荐产品汇总
工程参考数据： DSPIC33EP64GP504T-E/ML ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC33EP64GP504T-I/ML | DSPIC33EP64GP504T-H/ML | DSPIC33EP64GP504-I/ML |
|---|---|---|---|---|
| Package | 44-QFN (8x8 mm), 0.65 mm pitch | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 60 MIPs (60 MHz) | 60 MIPs | 60 MIPs | 60 MIPs |
| Program Memory | 64 KB (22K x 24) FLASH | 64 KB (22K x 24) FLASH | 64 KB (22K x 24) FLASH | 64 KB (22K x 24) FLASH |
| RAM | 8 KB (4K x 16) | 8 KB (4K x 16) | 8 KB (4K x 16) | 8 KB (4K x 16) |
| Operating Temperature | -40C to +150C (E grade) | -40C to +85C (I grade) | -40C to +150C | -40C to +85C (I grade) |
| Packaging Format | Tape and Reel | Tape and Reel | Tape and Reel | Tube |
| I/O Pins | 35 | 35 | 35 | 35 |
关键差异点
- Extended -40C to +150C automotive temperature range （对比 DSPIC33EP64GP504T-I/ML)
- Integrated analog front end reduces BOM cost （对比 DSPIC33EP64GP504T-I/ML)
- Honest trade-off: 8KB RAM limits buffering （对比 DSPIC33EP64GP504T-H/ML)
设计说明
The E-grade rating extends to +150C ambient, which leaves limited junction-temperature headroom in the 44-QFN 8x8 package. Solder the exposed thermal pad to a minimum 4x4 grid of thermal vias into the ground plane; estimate: at roughly 60-80 mA typical core+I/O supply current from 3.3V, internal dissipation is only ~0.2-0.3 W, but I/O pin drive current (up to 4 mA nominal per pin, more in parallel) adds locally. Verify junction temperature against the datasheet theta-JA with your actual copper area before committing to the +150C corner.
Place a 0.1 uF ceramic decoupling capacitor at each VDD/VDDCORE pin pair within 2 mm of the pin, plus one bulk 10 uF per supply domain. dsPIC33EP devices use an internal core regulator - follow the datasheet-recommended VDDCORE capacitor exactly, as incorrect core decoupling is the most common cause of erratic reset and brown-out behavior on this family. Keep VSS returns from the exposed pad low-impedance.
Do not substitute the /ML footprint part with the /MV (48-pin) variant - it uses a different land pattern and will not mount on a 44-QFN board. Also remember E-grade (to +150C) and I-grade (to +85C) parts are binning variants of the same die: firmware is binary compatible, so a single firmware image can serve both, but never qualify an automotive build on I-grade silicon. Use MPLAB ICD 3/4 or REAL ICE for programming and boundary-scan debug.
For the CAN interface, route CANTX/CANRX as a short pair to the transceiver and keep the CTMU touch/charge-measurement traces away from PWM and CAN lines. The integrated op amps are shared with fixed pins - check the pin-mapping table before allocating analog channels so sensor inputs land on op-amp-capable pins rather than plain ADC pins.
合规信息
AEC-Q100 qualified and classified Automotive per Microchip USA and DigiKey product data. RoHS/REACH/lead-free status not stated in the provided verified data.
