DSPIC33EP64GP506-E/MR - 16-bit DSC 64KB 60MIPS | Microchip
料号： DSPIC33EP64GP506-E/MR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $5.98 | $5.98 |
| 10 | $5.4 | $54.00 |
| 100 | $4.85 | $485.00 |
| 500 | $4.42 | $2,210.00 |
| 1,000 | $3.95 | $3,950.00 |
DSPIC33EP64GP506-E/MR 概述
A Digital Signal Controller combines the deterministic control structure of a microcontroller with the math acceleration of a DSP core. Within the semiconductor hierarchy, the dsPIC33EP family sits under Microchip's 16-bit MCU/DSC portfolio, bridging general-purpose microcontrollers and dedicated DSPs for embedded control systems that need both fast control loops and signal-processing throughput.
Key features include the dsPIC33E 16-bit core running at 60 MIPS, integrated CAN 2.0B for industrial and automotive networking, three on-chip operational amplifiers, four analog comparators, the Charge Time Measurement Unit (CTMU) for capacitive-touch and precision time measurement, and the Peripheral Trigger Generator (PTG) for autonomous, hardware-triggered peripheral sequencing. High-speed PWM outputs support motor control and digital power conversion topologies.
Architecturally, the DSP engine provides single-cycle MAC, 40-bit wide accumulators, and modulo and bit-reversed addressing, while dual source-synchronous instruction fetch from zero-wait-state Flash sustains full-speed operation. DMA and a rich interrupt vector table offload the CPU in data-intensive loops.
Typical applications include brushless DC and PMSM motor control, digital switched-mode power supplies, automotive body and comfort nodes (the -E variant is AEC-Q100 qualified), and industrial sensing with the CTMU.
Design consideration: the device operates from a 3.0 V to 3.6 V single supply; verify the 9x9 VQFN exposed pad is well grounded for thermal and signal-integrity performance.
This page synthesizes verified distributor data, drop-in alternatives, and engineering design notes not found in the manufacturer datasheet.
直接替换替代料： DSPIC33EP64GP506-E/MR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC33EP64GP506-E/MR （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Core, RoHS Status, CAN.
快速对比工具——选择替代料号进行并排对比：
DSPIC33EP64GP506-I/MR
✅ 直接替换📋 参考替代料（不在目录中）
DSPIC33EP64GP506T-I/MR
✅ 直接替换✓ 有现货
$3.95 / 个
查看数据手册 →DSPIC33EP64GP506T-E/MR
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →DSPIC33EP64GP504-E/MV
✅ 直接替换✓ 有现货
$2.85 / 个
查看数据手册 →DSPIC33EP512MC506-I/MR
✅ 直接替换📋 参考替代料（不在目录中）
DSPIC33EP512MC506T-I/MR
✅ 直接替换✓ 有现货
$4.2 / 个
查看数据手册 →DSPIC33EP64GP506-E/MR 最大额定值与电气特性
| Core | dsPIC33E 16-bit DSC |
| Max CPU Speed | 60 MIPS |
| Program Memory | 64 KB (22K x 24) Flash |
| SRAM | 8 KB |
| 电源电压 | 3 V to 3.6 V |
| I/O Ports | 51 |
| 封装 | 64-VQFN (9x9 mm) Exposed Pad (MR) |
| 工作温度 | -40C to +125C (E, extended) |
| CAN | Yes (CAN 2.0B) |
| Op Amps | 3 on-chip |
| Comparators | 4 |
| CTMU | Yes (Charge Time Measurement Unit) |
| PTG | Yes (Peripheral Trigger Generator) |
| Timers | Nine 16-bit general purpose timers |
| AEC-Q100 | Qualified (automotive) |
| 安装类型 | Surface Mount |
| 生命周期状态 | Active (In Production) |
DSPIC33EP64GP506-E/MR 64-vqfn (9x9 mm) exposed pad (mr) 引脚配置指南
DSPIC33EP64GP506-E/MR（64-vqfn (9x9 mm) exposed pad (mr) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC33EP64GP506-E/MR.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC33EP64GP506-E/MR 适用于 6 应用s: BLDC / PMSM Motor Control, Digital Switch-Mode Power Supplies, Automotive Body and Comfort Nodes, Industrial Sensing and Touch Interfaces, Digital Audio and Signal Processing Nodes, Test, Measurement and Precision Acquisition.
BLDC / PMSM Motor Control
The DSPIC33EP64GP506-E/MR is well suited to sensorless and sensored BLDC/PMSM control because its 60 MIPS dsPIC33E core executes field-oriented control loops with single-cycle MAC and 40-bit accumulators, while high-speed PWM peripherals generate complementary gate-drive signals with dead-time insertion. The three on-chip op-amps can amplify shunt current signals, and the four comparators provide hardware overcurrent trip paths that act without CPU intervention. Implemented between the rectified DC bus and the three-phase inverter gate drivers, the DSC closes current loops at tens of kHz; the extended -40C to +125C AEC-Q100 rating also permits under-hood fan, pump, and actuator drives where PCB space is constrained by the compact 9x9 mm VQFN.
推荐
Digital Switch-Mode Power Supplies
In digital power conversion, the DSPIC33EP64GP506-E/MR provides the deterministic control timing that buck, boost, and LLC stages require: the 60 MIPS core combined with the PTG (Peripheral Trigger Generator) sequences ADC sampling and PWM updates in hardware with sub-microsecond latency, independent of software jitter. The high-speed PWM module supports complementary outputs, phase-shifted topologies, and adjustable dead time, which are prerequisites for synchronous rectification and interleaved converters. Placed in the feedback path between the output sense divider and the power stage gate drivers, the DSC implements voltage- or current-mode compensators in firmware; the on-chip comparators add cycle-by-cycle current limiting, and the 3.0-3.6 V logic supply integrates cleanly with the controller bias rail of off-line supplies.
推荐
Automotive Body and Comfort Nodes
The -E/MR variant carries AEC-Q100 qualification and a -40C to +125C operating range, directly targeting automotive body electronics such as door modules, seat controllers, lighting nodes, and HVAC actuators. CAN 2.0B on-chip removes the need for an external CAN transceiver-controller pair at the protocol level, shortening BOM and board routing. The CTMU supports capacitive-touch user interfaces (switch panels, presence sensing) and precision ratiometric measurements, while the integrated op-amps condition resistive sensor bridges used in position and pressure feedback. In a typical node, the DSC reads switches and sensors, drives relays or high-side drivers through PWM, and communicates status on the vehicle CAN bus; the 51 I/O lines of the 64-pin VQFN cover channel counts of mid-complexity modules without port expanders.
推荐
Industrial Sensing and Touch Interfaces
For industrial HMI panels and sensor front ends, the DSPIC33EP64GP506-E/MR combines the CTMU charge-time measurement unit for capacitive touch keys and sliders with the three op-amps and four comparators needed for analog sensor conditioning - all on one chip, eliminating external amplifier ICs. The 60 MIPS core runs filtering (IIR/FIR) on sampled data using the DSP engine's hardware MAC, and the PTG automates ADC scan sequences so the CPU sleeps between conversions, cutting average current. Typical deployment: a control panel where the CTMU detects touch through glass overlays while the same device reads 4-20 mA or ratiometric sensors, processes thresholds, and reports over CAN or UART to the factory network. The extended temperature variant tolerates enclosures with limited ventilation.
推荐
Digital Audio and Signal Processing Nodes
The dsPIC33E DSP engine gives the DSPIC33EP64GP506-E/MR credible real-time audio capability: single-cycle MAC with dual 40-bit accumulators and bit-reversed addressing implement FFTs and biquad filters at 60 MIPS, comfortably handling multiple audio channels at 48 kHz sample rates. In intercom, PA, and voice-processing nodes, the DSC performs echo cancellation, AGC, and filter correction while managing system control tasks on the same chip. The on-chip op-amps can bias and buffer microphone or line-level signals before the ADC, and DCI (Data Converter Interface) serial ports connect directly to audio codecs. Designers should budget code space carefully, as 64 KB Flash suits fixed algorithm sets rather than large filter-coefficient libraries; the DSPIC33EP512MU814 is the migration path when memory grows.
推荐
Test, Measurement and Precision Acquisition
The CTMU on the DSPIC33EP64GP506-E/MR is a precision time-of-flight and charge-measurement engine that, with a stable reference, measures capacitance and time intervals to high resolution - useful in ultrasonic distance modules, level sensing, and resistance/capacitance instrumentation. The 60 MIPS core timestamps events from the input-capture peripherals with sub-microsecond resolution, and the DSP engine performs baseline subtraction and averaging on captured waveforms. In a typical instrument front end, the CTMU excites the sensor, the op-amps scale the response into the ADC range, and results stream over UART/SPI to a host. The JTAG boundary-scan support (IEEE 1149.2 compatible) aids board-level production test, a practical advantage in multi-board instruments.
推荐
推荐产品汇总
工程参考数据： DSPIC33EP64GP506-E/MR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC33EP64GP506-I/MR | DSPIC33EP64GP504-E/MV | DSPIC33EP512MC506-I/MR |
|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm, MR) | 64-VQFN (9x9 mm, MR) - same | 64-pin QFN family package | 64-VQFN (9x9 mm, MR) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 64 KB (22K x 24) | 64 KB | 64 KB | 512 KB |
| Core Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Operating Temperature | -40C to +125C (E, AEC-Q100) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) |
| CAN Interface | Yes (CAN 2.0B) | Yes | Yes | Yes |
关键差异点
- Extended temperature and AEC-Q100 automotive qualification （对比 DSPIC33EP64GP506-I/MR)
- Integrated analog front end (3 op-amps, 4 comparators, CTMU) （对比 DSPIC33EP512MC506-I/MR)
- Balanced memory/peripheral density in compact 9x9 mm VQFN （对比 DSPIC33EP64GP504-E/MV)
设计说明
Supply the device from a tightly regulated 3.3 V rail within the 3.0-3.6 V datasheet window. Place one 100 nF X7R capacitor at every VDD/VSS pin pair within 5 mm of the pins, plus 4.7-10 uF bulk per domain. During Flash erase/write cycles the core draws transient current bursts; undersupply here corrupts self-programming, so keep the decoupling network low-impedance at the 64-VQFN pins and verify with an oscilloscope across temperature, especially in the -E extended range.
The MR package has an exposed pad that must be soldered to a grounded thermal pad array (typically 5x5 via pattern) - do not leave it floating, as it is both the primary heat-removal path and the lowest-inductance ground return for the 60 MHz core. Follow Microchip's QFN layout application notes: solder mask-defined pad, approximately 60-70% paste coverage to avoid voiding, and stitch the pad into the ground plane with an array of vias.
Keep CAN, PWM, and analog traces separated: route PWM gate-drive lines away from the op-amp/comparator inputs feeding the ADC, and place a ground guard under analog routing. The CTMU is picocoulomb-sensitive; minimize capacitance on CTMU pins and avoid adjacent switching nets. Estimated impact: a few pF of stray capacitance can shift CTMU touch thresholds measurably, so reserve calibration headroom in firmware.
合规信息
AEC-Q100 automotive qualification and extended temperature grade confirmed via Hotenda product listing. RoHS/lead-free inferred from standard Microchip active production for this family; verify certificates on the Microchip quality portal.
