DSPIC33FJ64GP706A-E/MR - 16-bit DSC, 64KB Flash, 40 MIPS | Microchip
料号： DSPIC33FJ64GP706A-E/MR ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $7.27 | $7.27 |
| 10 | $6.68 | $66.80 |
| 25 | $6.35 | $158.75 |
| 100 | $5.86 | $586.00 |
| 1,000 | $5.29 | $5,290.00 |
DSPIC33FJ64GP706A-E/MR 概述
A digital signal controller is a hybrid class of embedded processor that merges the control peripherals of a microcontroller with the math acceleration of a digital signal processor. Within the embedded hierarchy, the dsPIC33F sits above basic 8-bit MCUs and beside 16-bit general-purpose MCUs such as the PIC24H, offering single-cycle MAC, DSP multiply-divide, and dual operand fetch for signal-processing workloads while retaining Flash self-programming, interrupt-driven peripherals, and low-cost development tools.
Key features include 40 MIPS maximum instruction throughput at 3.3V operation (VDD 3.0V to 3.6V), 53 general-purpose I/O pins, and the General Purpose (GP) peripheral set with advanced analog. The A revision silicon improves on the original dsPIC33FJ64GP706 errata, and the -E temperature suffix qualifies the device for -40C to +125C environments where industrial -I grade (-40C to +85C) is insufficient. The family is listed under the Automotive series with AEC-Q100 relevance in distributor data.
Technically, the dsPIC33F architecture uses a modified Harvard 16-bit core with a 40-stage-deep pipelined instruction fetch, hardware DSP engine (17x17 multiplier, 40-bit accumulator, dual fetch), and up to two on-chip oscillators with PLL for clock flexibility. Peripherals on GP variants typically include UART, SPI, I2C, ECAN, multiple 16-bit timers, output compare/input capture, and high-speed 10-bit/12-bit ADC modules - consult the 362-page manufacturer datasheet for exact channel counts on this MPN.
Typical applications include digital power conversion and UPS control, motor control (BLDC/PMSM/ACIM), sensor signal conditioning and conditioning-heavy industrial automation, and embedded control in automotive subsystems benefiting from the extended temperature range.
When designing with this DSC, budget the Flash carefully: 64 KB accommodates most control loops with a full DSP library, but the same pin-compatible family extends to 128 KB and 256 KB (DSPIC33FJ128GP706A-E/MR, DSPIC33FJ256GP706A-E/MR) if code grows, without PCB rework.
This page synthesizes distributor pricing, drop-in family alternatives, design notes, and AEO-optimized FAQs not consolidated in the manufacturer datasheet.
直接替换替代料： DSPIC33FJ64GP706A-E/MR ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC33FJ64GP706A-E/MR （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Packaging, Programmability, Series.
快速对比工具——选择替代料号进行并排对比：
DSPIC33FJ64GP706A-I/MR
✅ 直接替换✓ 有现货
$10.1 / 个
查看数据手册 →DSPIC33FJ32GP706A-E/MR
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33FJ128GP706A-E/MR
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$4.2 / 个
查看数据手册 →DSPIC33FJ256GP706A-E/MR
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33FJ64GP706-E/MR
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33FJ64GP706A-E/MR 最大额定值与电气特性
| Core Processor | dsPIC33F |
| Core Size | 16-bit |
| Architecture | RISC modified Harvard |
| Max Clock / Instruction Speed | 40 MIPS |
| Program Flash Memory | 64 KB (64K x 8) |
| SRAM | 16 KB (16K x 8) |
| Supply Voltage (VDD) | 3 V to 3.6 V |
| Number of I/O | 53 |
| 封装 | 64-VQFN (9x9 mm), exposed pad |
| Package Code | MR |
| 工作温度 | -40C to +125C (Extended, E grade) |
| 安装类型 | Surface Mount |
| Packaging | Tube |
| Series | dsPIC 33F, Automotive (AEC-Q100) |
| Silicon Revision | A (dsPIC33FJ64GP706A) |
| Product Status | Active |
| Interface Peripherals | UART, SPI, I2C, ECAN (per family datasheet) |
| Programmability | In-circuit / in-system Flash programmable |
DSPIC33FJ64GP706A-E/MR mr 引脚配置指南
DSPIC33FJ64GP706A-E/MR（mr 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC33FJ64GP706A-E/MR.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC33FJ64GP706A-E/MR 适用于 6 应用s: Motor Control (BLDC / PMSM / ACIM), Digital Power Conversion (UPS, Solar, PFC), Industrial Sensing and Automation Nodes, Automotive Body and Convenience Modules, Audio and Signal-Processing Equipment, Embedded Control and IoT Edge Nodes.
Motor Control (BLDC / PMSM / ACIM)
The DSPIC33FJ64GP706A-E/MR fits motor-control applications because its 40 MIPS 16-bit DSP core executes field-oriented control (FOC) loops fast enough for PWM frequencies in the tens of kilohertz, and its hardware DSP engine (17x17 MAC, 40-bit accumulator) accelerates the Clarke/Park transforms and PI computations. In a typical topology, the DSC generates complementary PWM pairs for the inverter bridge, samples phase currents through the high-speed ADC synchronized to the PWM, and closes the current loop in software. The extended -40C to +125C grade allows mounting in drive housings near the power stage, where ambient plus self-heating would exceed the 85C limit of the -I grade. The ECAN peripheral supports industrial motor-network communication without an external CAN controller.
推荐
Digital Power Conversion (UPS, Solar, PFC)
The DSPIC33FJ64GP706A-E/MR suits digital power conversion because its 40 MIPS core and deterministic interrupt latency sustain the tight control-loop deadlines of PFC, inverter, and UPS topologies, while the GP family's advanced analog input stage digitizes voltage and current feedback with the ADC triggered precisely by the PWM time base. In a typical design, the DSC implements average-current-mode PFC control on the front end and closed-loop inverter regulation on the output stage, using the hardware DSP multiply-accumulate engine for loop-filter arithmetic. Running from a single 3.3V rail with 3.0V to 3.6V tolerance simplifies the bias supply. The 64 KB Flash accommodates state machines, communication stacks, and compensation code with margin for firmware updates in the field.
推荐
Industrial Sensing and Automation Nodes
The DSPIC33FJ64GP706A-E/MR is well matched to industrial sensing nodes that must acquire, filter, and forward analog data. The 53 I/O pins and multiplexed UART, SPI, I2C, and ECAN peripherals let one DSC talk to ADC front ends, local displays, and a CAN or RS-485 backbone simultaneously, while the DSP engine runs windowed FFT and digital-filter code on sampled signals. Operating at 3.3V with low peripheral count reduces board BOM compared with a two-chip MCU-plus-DSP solution. The extended -40C to +125C temperature rating is valuable in cabinets mounted near drives, heaters, or outdoor equipment where panel temperatures routinely exceed the 85C industrial ceiling. The 64 KB Flash holds sensor-specific compensation tables and protocol stacks with room for OTA firmware updates.
推荐
Automotive Body and Convenience Modules
The DSPIC33FJ64GP706A-E/MR addresses automotive-adjacent electronics through its dsPIC 33F Automotive series membership, extended -40C to +125C qualification range, and ECAN peripheral for in-vehicle networking. Typical uses include lighting control, pump and fan control, sensor conditioning in engine-bay-adjacent zones, and gateway sub-functions where a 40 MIPS DSP core handles signal-conditioning tasks a standard MCU cannot. The single 3.3V supply, 53 multiplexed I/O, and in-system Flash programmability support late-stage configuration changes on the assembly line. Before release into safety-relevant programs, confirm the exact AEC-Q100/PPAP qualification status of this ordering code with Microchip, since distributor listings flag the series as automotive but per-order-code documentation should be verified for regulated programs.
推荐
Audio and Signal-Processing Equipment
The DSPIC33FJ64GP706A-E/MR works in embedded audio and instrumentation signal chains because the GP family integrates the DSP features needed for filtering, mixing, and analysis: single-cycle 17x17 multiply-accumulate, dual operand fetch, and a 40-bit accumulator that preserves dynamic range through long IIR and FIR chains. At 40 MIPS the core sustains sample-rate processing for professional-audio control tasks, effect algorithms, and acoustic sensing front ends, while UART and SPI interfaces connect to audio codecs and external converters. The 16 KB SRAM provides working buffers for block-based processing at audio frame sizes. For products whose firmware will grow toward complex DSP libraries, the pin-compatible DSPIC33FJ128GP706A-E/MR and DSPIC33FJ256GP706A-E/MR offer a no-rework upgrade path on the same PCB.
推荐
Embedded Control and IoT Edge Nodes
The DSPIC33FJ64GP706A-E/MR serves as the main controller in embedded systems and edge nodes that mix real-time control with local signal processing - for example, environmental monitors, metering front ends, and smart actuators. The 40 MIPS core handles protocol stacks and application logic concurrently with DSP-based sensor filtering, avoiding the need for a separate signal processor. Peripheral connectivity (multiple UARTs, SPI, I2C, ECAN) links the node to radios, sensors, and actuators, while in-system Flash programming supports field firmware updates. The 64-pin VQFN's 9x9 mm footprint with exposed pad delivers good thermal and grounding performance on a compact board. The extended temperature grade permits deployment in unconditioned outdoor and industrial enclosures where consumer-grade parts cannot survive.
推荐
推荐产品汇总
工程参考数据： DSPIC33FJ64GP706A-E/MR ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC33FJ64GP706A-I/MR | DSPIC33FJ32GP706A-E/MR | DSPIC33FJ128GP706A-E/MR | DSPIC33FJ256GP706A-E/MR |
|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm, MR) | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same | 64-VQFN (9x9 mm, MR) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 64 KB | 64 KB | 32 KB | 128 KB | 256 KB |
| Core Speed | 40 MIPS (16-bit) | 40 MIPS (16-bit) | 40 MIPS (16-bit) | 40 MIPS (16-bit) | 40 MIPS (16-bit) |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (E grade) |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Number of I/O | 53 | 53 | 53 | 53 | 53 |
关键差异点
- Extended -40C to +125C temperature grade （对比 DSPIC33FJ64GP706A-I/MR)
- Cost-optimized 64 KB Flash point in a 256 KB-scalable family （对比 DSPIC33FJ256GP706A-E/MR)
- A-revision silicon with corrected errata （对比 DSPIC33FJ64GP706-E/MR)
设计说明
The 64-VQFN (9x9 mm) MR package has a center exposed pad that functions as the main ground connection and thermal relief. Design the land pattern with a matched exposed-pad via array (typically a 3x3 or 4x4 grid of vias of approximately 0.3 mm diameter) stitched to the ground plane to minimize ground bounce on this 40 MIPS device. Per Microchip VQFN design guidance, keep the QFN pad solder coverage high to avoid floating-corner phenomenon during reflow; use the manufacturer-recommended land pattern from the dsPIC33FJ family datasheet rather than a generic footprint.
Decouple VDD (3.0V to 3.6V) with at least one 0.1 uF ceramic capacitor per supply pin pair placed within 2-3 mm of the pin, plus a single 10 uF bulk capacitor per board. The dsPIC33F core draws supply ripple current synchronously with instruction execution; at 40 MIPS with toggling I/O, supply transients on a poorly decoupled rail can corrupt ADC conversions. Per Microchip's dsPIC33F family reference and typical application circuits, connect all VDD/VSS pairs and use a solid ground plane; do not share the analog supply node with high-current motor or relay drivers.
Verify silicon revision before committing production firmware: this MPN is the A revision (dsPIC33FJ64GP706A), which resolves errata present in the original dsPIC33FJ64GP706. Mixing non-A stock into an A-revision-qualified build can reintroduce known peripheral errata. Also confirm peripheral pin mapping for the MR (VQFN) variant specifically - pin multiplexing tables differ between the PT (TQFP) and MR packages in the family datasheet, and copying a TQFP-based pin configuration file without review is a common source of bring-up failures. Plan for ICSP programming access on the five programming pins.
Estimated: at 3.3V and 40 MIPS with moderate I/O activity the DSC dissipates on the order of 100-200 mW. With an assumed VQFN-64 theta_JA of roughly 30-45 C/W (value depends on board copper - confirm the exact datasheet figure), junction rise above ambient is only about 3-9 C, so no heatsinking is needed. However, in enclosed designs targeting the full +125C rating, junction margin is thin: account for adjacent power-device heating in the same enclosure and verify TJ stays within the -40C to +125C qualification window with a derating analysis.
合规信息
Distributor comparison data lists the dsPIC 33F series under the Automotive category with AEC-Q100 relevance, but per-order-code qualification status should be confirmed with Microchip. RoHS/REACH status not stated in provided data.
