DSPIC33FJ64GP708T-I/PT - 16-bit DSC 40 MIPS 64KB Flash | Microchip
料号： DSPIC33FJ64GP708T-I/PT ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $7.95 | $7.95 |
| 10 | $7.2 | $72.00 |
| 100 | $6.35 | $635.00 |
| 500 | $5.6 | $2,800.00 |
| 1,000 | $4.95 | $4,950.00 |
DSPIC33FJ64GP708T-I/PT 概述
A Digital Signal Controller blends the features of both microcontrollers (MCUs) and digital signal processors (DSPs) into a single-chip solution. Within the power-management hierarchy of embedded systems, the dsPIC33F family sits above basic 8-bit PIC MCUs and alongside 16-bit PIC24H devices, enabling designers to add DSP features to embedded applications without a separate DSP chip. Microchip offers two compatible Flash-based 16-bit DSC families: the 30 MIPS dsPIC30F (for 5V operation) and the 40 MIPS dsPIC33F (suited to 3.3V designs).
Key features of the DSPIC33FJ64GP708T-I/PT include a 16-bit dsPIC core operating at up to 40 MIPS, 64KB (64K x 8) of Flash program memory, 16KB of RAM, and a 3.0V to 3.6V single supply range. The device provides 21 I/O ports/peripheral signals per the digchip specification summary and integrates general-purpose (GP) analog and digital peripherals.
Technically, the dsPIC33FJ64GP708 belongs to the dsPIC33FJ64GP70x general-purpose family with seamless migration options to PIC24F, PIC24H MCUs and dsPIC30F DSCs in similar packages. The suffix T denotes tape-and-reel packaging, and /PT denotes the 80-pin TQFP with industrial temperature range; /PT devices are lead-free per the digchip package description.
Typical applications include motor control, digital power conversion, industrial automation, and digital audio or sensor-signal processing where 16-bit DSP instructions and general-purpose peripherals are both needed.
When designing with this device, verify supply decoupling on the 3.3V rail and confirm the 80-TQFP land pattern against the Microchip datasheet, since the same die is offered in other pin-count packages.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： DSPIC33FJ64GP708T-I/PT ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： DSPIC33FJ64GP708T-I/PT （相同外形与封装尺寸） ——差异在于 Core Architecture, Program Memory (Flash), Package, ADC, Max CPU Speed.
快速对比工具——选择替代料号进行并排对比：
DSPIC33FJ64GP708-I/PT
✅ 直接替换✓ 有现货
$6.35 / 个
查看数据手册 →DSPIC33FJ64GP708A-I/PT
✅ 直接替换✓ 有现货
$4.18 / 个
查看数据手册 →DSPIC33FJ128GP708-I/PT
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$5.64 / 个
查看数据手册 →DSPIC33FJ256GP708-I/PT
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
DSPIC33FJ64GP708T-I/PT 最大额定值与电气特性
| Core Architecture | 16-bit dsPIC DSC |
| Max CPU Speed | 40 MIPS (40 MHz) |
| Program Memory (Flash) | 64KB (64K x 8) |
| RAM | 16KB |
| 电源电压 | 3 V to 3.6 V |
| I/O Ports | 21 (per digchip spec summary) |
| 封装 | 80-TQFP (12x12 mm) |
| Packaging | Tape and Reel (T suffix) |
| 安装类型 | Surface Mount |
| Series | dsPIC33FJ64GP70x |
| ROM Type | Flash |
| Lead Finish | Lead-free (per digchip package description) |
| Life Cycle Stage | ACTIVE |
DSPIC33FJ64GP708T-I/PT 80-tqfp (12x12 mm) 引脚配置指南
DSPIC33FJ64GP708T-I/PT（80-tqfp (12x12 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： DSPIC33FJ64GP708T-I/PT.
请参阅 数据手册 以查看完整引脚配置。
典型应用
DSPIC33FJ64GP708T-I/PT 适用于 6 应用s: Motor Control and Drives, Digital Power Conversion, Industrial Automation and Control Panels, Digital Audio and Speech Processing, Sensor Signal Processing and Data Acquisition, Embedded Control with Seamless Migration.
Motor Control and Drives
The DSPIC33FJ64GP708T-I/PT fits motor control because its 16-bit dsPIC core executes DSP multiply-accumulate instructions at 40 MIPS, matching the loop-rate demands of field-oriented control (FOC) for PMSM and BLDC motors. Its 64KB Flash holds control firmware plus communication stacks, while 16KB RAM buffers current/voltage sampling history. In a typical drive, the DSC generates PWM outputs for the inverter bridge and reads phase currents through its general-purpose analog inputs; the 3.0V-3.6V supply integrates cleanly with 3.3V logic-level gate drivers. Compared with a discrete MCU plus DSP pair, this single-chip solution reduces BOM count and interrupt latency between sampling and PWM update, improving current-loop bandwidth. Verify PWM dead-time insertion and fault shutdown configuration against the Microchip datasheet before production.
推荐
Digital Power Conversion
Digital switched-mode power supplies, LLC converters, and PFC stages benefit from the DSPIC33FJ64GP708T-I/PT's 40 MIPS core, which sustains the high sampling-and-control rates digital power loops require. The 3.0V to 3.6V supply rail matches standard controller logic, and the 80-TQFP exposes ample I/O for PWM outputs, feedback ADC channels, and serial telemetry (I2C/SPI/UART) to a host. In a typical design the DSC closes the voltage/current loop digitally, enabling adaptive compensation and soft-start profiles impossible with fixed analog compensators. The 64KB Flash accommodates control code plus housekeeping and protection routines; 16KB RAM holds filter state variables. Designers should budget ISR execution time carefully at 40 MIPS to keep the control-loop period stable across all operating points.
推荐
Industrial Automation and Control Panels
In factory automation nodes, the DSPIC33FJ64GP708T-I/PT acts as a compact 16-bit controller combining general-purpose MCU peripherals with DSP capability for sensor conditioning. Its 21 I/O ports handle digital I/O, encoder inputs, and communication, while the 40 MIPS core executes filtering and FFT-based diagnostics on vibration or current signatures. The industrial-grade /I temperature option supports panel environments, and the 80-TQFP provides enough pins for multiple UART, SPI, and I2C channels to interface PLC-side fieldbus bridges. The 64KB Flash stores protocol stacks alongside the application; the 16KB RAM buffers network frames. Seamless migration to PIC24H or higher-memory dsPIC33FJ parts in similar packages, per Microchip documentation, protects long-term product roadmaps against memory exhaustion.
推荐
Digital Audio and Speech Processing
Audio effects, speech enhancement, and acoustic sensing applications exploit the DSP engine of the DSPIC33FJ64GP708T-I/PT: the 40 MIPS core sustains real-time FIR/IIR filtering, AGC, and codec interfacing at audio sample rates. The 16KB RAM supports frame-based processing buffers for simultaneous record and playback paths, while 64KB Flash retains coefficients, tables, and firmware. Its 3.3V operation pairs directly with common audio codecs and DACs over I2C/SPI. In a typical signal chain, an external codec streams samples to the DSC via SPI/DCI; the core applies DSP algorithms and outputs processed audio. Because the general-purpose family lacks dedicated audio co-processing, verify throughput headroom for the target algorithm at 40 MIPS; heavier workloads should consider higher-clock dsPIC33F variants.
推荐
Sensor Signal Processing and Data Acquisition
Precision sensing nodes - weigh scales, pressure transmitters, and vibration monitors - use the DSPIC33FJ64GP708T-I/PT to digitize and condition signals before transmission. The 40 MIPS core implements oversampling, averaging, notch filtering, and calibration math that a basic 8-bit MCU cannot sustain in real time. The 80-TQFP offers the pin count needed for multiple analog front-end interfaces plus UART/I2C/SPI links to radios or displays. The 64KB Flash supports compensation tables and firmware-updatable linearization curves; the 16KB RAM retains rolling data windows for event detection. Supplying the DSC from a clean 3.3V regulator and separating analog/digital ground returns preserves effective resolution. For higher channel counts, the pin-compatible 128KB/256KB Flash siblings add headroom without PCB changes.
推荐
Embedded Control with Seamless Migration
General embedded products - HVAC controllers, charging stations, instrumentation - choose the DSPIC33FJ64GP708T-I/PT where a 16-bit MCU suffices but occasional DSP work (filters, FFT) appears. Microchip explicitly offers seamless migration options to PIC24F, PIC24H MCUs and dsPIC30F DSCs in similar packages, per the official product page, so a design can start on the 64KB GP device and scale to PIC24H or higher-memory variants without board redesign. The 3.0V-3.6V supply and 80-TQFP fit standard industrial logic levels and manufacturing flows, while tape-and-reel supports automated assembly. The active lifecycle status and multi-distributor availability (DigiKey, Hotenda, Octopart-listed sources) reduce long-term supply risk for products with multi-year service commitments.
推荐
推荐产品汇总
工程参考数据： DSPIC33FJ64GP708T-I/PT ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | DSPIC33FJ64GP708-I/PT | DSPIC33FJ64GP708A-I/PT | DSPIC33FJ128GP708-I/PT | DSPIC33FJ256GP708-I/PT |
|---|---|---|---|---|---|
| Package | 80-TQFP (12x12 mm) | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same | 80-TQFP (12x12 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Max Speed | 16-bit dsPIC, 40 MIPS | 16-bit dsPIC, 40 MIPS | 16-bit dsPIC, 40 MIPS | 16-bit dsPIC, 40 MIPS | 16-bit dsPIC, 40 MIPS |
| Program Flash | 64KB (64K x 8) | 64KB (64K x 8) | 64KB (64K x 8) | 128KB | 256KB |
| RAM | 16KB | 16KB | 16KB | 16KB | 16KB |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Packaging | Tape & Reel (T suffix) | Tray | Tape & Reel | Tray | Tray |
关键差异点
- Identical die in tray packaging for prototyping （对比 DSPIC33FJ64GP708-I/PT)
- Current A-revision die availability （对比 DSPIC33FJ64GP708A-I/PT)
- Pin-compatible Flash upgrades on the same PCB （对比 DSPIC33FJ128GP708-I/PT)
设计说明
The DSPIC33FJ64GP708T-I/PT runs from a 3.0V to 3.6V single supply. Place a 0.1uF ceramic decoupling capacitor at each VDD/VSS pin pair as close to the package as possible, plus one bulk 4.7uF-10uF capacitor near the device. If the PCB also carries motor drivers or switching converters, isolate the DSC supply with a ferrite bead or local LDO to prevent PWM switching noise from coupling into the ADC reference and corrupting analog readings.
The 80-TQFP (12x12 mm) requires a land pattern per the Microchip datasheet mechanical drawings; do not reuse footprints from the 64-pin TQFP siblings, as the /PT suffix here is 80-pin. Use a 0.5 mm pitch stencil and inspect for solder bridging on fine-pitch leads. Provide an adequate ground plane under the package and keep the crystal/oscillator traces short and guarded for stable 40 MIPS operation.
Confusion exists between package options of the same die: one digchip summary cites a QFN-44-style entry, but the /PT suffix on this MPN denotes the 80-TQFP (12x12), per DigiKey and Hotenda listings. Always order by the full MPN suffix, not the base number. Also note the 710 family members use 100-pin packages and are NOT pin-compatible despite similar names; migrating memory sizes is safe only within the 708 (80-pin) family.
合规信息
Digchip package description states LEAD FREE plastic package. RoHS/REACH status not explicitly stated in provided data - verify on the Microchip product page.
