EP1M120F484I7 - Mercury FPGA 120K Gates 484-BGA | Altera
料号： EP1M120F484I7 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168.5 | $1,685.00 |
| 100 | $152 | $15,200.00 |
| 500 | $138.75 | $69,375.00 |
| 1,000 | $125 | $125,000.00 |
EP1M120F484I7 概述
What is a Mercury PLD? A Mercury programmable logic device (PLD) is a mask-programmed equivalent of an SRAM-based Altera APEX-class FPGA. Instead of being configured by an external configuration PROM at every power-up, the Mercury device is metal-mask programmed at the wafer fab, so its logic fabric is fixed for the lifetime of the part. This makes Mercury parts cheaper per unit at high volumes and instant-on at power-up, at the cost of zero field reconfigurability. Mercury devices sit in the ASIC replacement layer of the programmable logic taxonomy: programmable logic device (PLD) -> mask-programmed PLD -> Mercury family -> ASIC-equivalent structured array.
Key features include approximately 120,000 usable gates, a 484-ball FineLine BGA package, industrial-grade -40C to +85C operating temperature, mask-programmed one-time configuration, and a CMOS core optimized for low static power. The Mercury architecture shares its logic element and routing fabric with the SRAM APEX 20KE family, but converts the SRAM configuration cells into via-mask programmed connections during fabrication.
The EP1M120F484I7 is best understood as a cost-down ASIC alternative. Designers develop their logic on the equivalent SRAM-based APEX 20KE device using Quartus, then migrate to a Mercury part for volume production. The mask-programmed routing eliminates the bitstream loader, the configuration PROM, and the long SRAM-configuration power-up delay, simplifying board design.
Typical applications include high-volume consumer electronics glue logic, networking line-card control planes, industrial machine controllers, automotive body and chassis ECUs (where instant-on is required), and any high-volume product where the design is finalized and per-unit BOM cost dominates the engineering cost. The industrial temperature grade also supports outdoor telecom and building automation.
When designing with this device, plan the mask-program step at the wafer fabrication stage: any logic change after mask generation requires a new mask set and a new part number, so design verification must be fully closed on the SRAM prototype before ordering Mercury parts. Also confirm that the Quartus project targets the APEX 20KE EP1K100 or EP1K50 equivalent so the bitstream-to-mask conversion is unambiguous.
直接替换替代料： EP1M120F484I7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP1M120F484I7 （相同外形与封装尺寸） ——差异在于 Family, Operating Temperature, Package, Speed Grade, Logic Elements.
快速对比工具——选择替代料号进行并排对比：
EP1M120F484I6
✅ 直接替换✓ 有现货
$95 / 个
查看数据手册 →EP1M120F484I6N
✅ 直接替换✓ 有现货
$188 / 个
查看数据手册 →EP1M120F484I5
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$189 / 个
查看数据手册 →EP1M120F484I5N
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$180 / 个
查看数据手册 →EP1M120F484C8
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$105 / 个
查看数据手册 →EP1M120F484C7
✅ 直接替换✓ 有现货
$155 / 个
查看数据手册 →EP1M120F484C6
✅ 直接替换✓ 有现货
$198 / 个
查看数据手册 →EP1M120F484I7 最大额定值与电气特性
| Family | Altera Mercury (mask-programmed PLD) |
| Usable Gates | 120,000 |
| 封装 | 484-ball FineLine BGA |
| 引脚数量 | 484 |
| 工作温度 | -40C to +85C (industrial) |
| Temperature Grade | I (industrial) |
| Speed Grade | 7 |
| Process Technology | CMOS |
| Configuration Method | Mask-programmed (one-time) |
| Equivalent SRAM Part | APEX 20KE EP1K100 family |
| 安装类型 | Surface Mount (BGA) |
EP1M120F484I7 引脚配置
| 引脚 A1 | I/O — User I/O bank (per Mercury datasheet 484-BGA ball map) |
| 引脚 A2 | GND — Ground (per Mercury datasheet 484-BGA ball map) |
| 引脚 B1 | VCCIO — I/O supply voltage (per Mercury datasheet) |
| 引脚 B2 | VCCINT — Core supply voltage (per Mercury datasheet) |
| 引脚 C1 | I/O — User I/O bank (per Mercury datasheet 484-BGA ball map) |
| 引脚 C2 | I/O — User I/O bank (per Mercury datasheet 484-BGA ball map) |
典型应用
EP1M120F484I7 适用于 6 应用s: High-Volume Consumer Electronics Glue Logic, Telecom Line-Card Control Plane, Industrial Machine Controller, Automotive Body and Chassis ECU, High-Volume ASIC Replacement, Legacy Industrial Control System Sustainment.
High-Volume Consumer Electronics Glue Logic
The EP1M120F484I7 fits high-volume consumer glue logic because its 120,000 usable gates are sufficient for display controllers, audio/video routing matrices, and peripheral multiplexing in products shipping >10K units per year. Designers develop on the SRAM-based EP1K100FI484-2 in the same 484-ball BGA footprint, then migrate to EP1M120F484I7 to eliminate the configuration PROM (about $0.50-1.00 saved per board) and reduce FPGA power-up delay to zero. The mask-programmed routing fabric also cuts quiescent current versus the SRAM equivalent, which matters for always-on consumer devices on energy-star budgets.
推荐
Telecom Line-Card Control Plane
The EP1M120F484I7 fits telecom line-card control plane logic because its 120K gates support the register-management, framer, and pseudo-random binary sequence (PRBS) blocks of a typical SONET/SDH or Ethernet line card, and its mask-programmed fabric eliminates the configuration-PROM failure mode that is unacceptable in carrier-grade equipment. Industrial -40C to +85C operation handles outdoor cabinet temperatures, and the 484-ball FineLine BGA offers the signal-integrity margin needed for 622 MHz LVDS paths. Per-unit cost drops meaningfully versus SRAM FPGAs at 5K-50K annual volumes typical of telecom line cards.
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Industrial Machine Controller
The EP1M120F484I7 fits industrial machine controllers because 120K gates are enough for multi-axis motion timing, encoder interfacing, and PLC ladder-equivalent state machines on a single mask-programmed device. Industrial -40C to +85C operation covers factory-floor ambient, and the mask-programmed fabric guarantees deterministic instant-on at machine power-up, which is critical for safety-rated controllers that cannot tolerate the FPGA configuration delay. The 484-ball BGA also supports fine-grained I/O banking for mixed 3.3V/5V signaling to legacy industrial I/O.
推荐
Automotive Body and Chassis ECU
The EP1M120F484I7 fits automotive body and chassis ECUs where the logic is finalized at SOP and instant-on is mandatory. Body ECUs such as door-zone controllers, seat controllers, and lighting modules run deterministic glue logic that benefits from mask-programmed routing: no configuration-PROM cost, no power-on configuration delay, and reduced quiescent current for the always-on CAN wake path. The industrial -40C to +85C grade covers cabin and under-hood temperatures in non-powertrain applications, and 120K gates is sufficient for typical body-ECU register maps plus CAN-FD offload glue.
推荐
High-Volume ASIC Replacement
The EP1M120F484I7 fits high-volume ASIC replacement use cases where the NRE cost of a full custom ASIC ($1M+) cannot be justified but per-unit cost of an SRAM FPGA is still too high. With 120K usable gates and mask-programmed routing, it sits in the structured-ASIC sweet spot: Quartus-based design flow, no reticle cost, and per-unit cost approaching that of a gate-array ASIC at 50K+ annual volumes. Designers close verification on the SRAM EP1K100FI484-2, then port the bitstream to a Mercury mask for production, avoiding both the FPGA configuration overhead and the full-custom ASIC NRE.
推荐
Legacy Industrial Control System Sustainment
The EP1M120F484I7 fits legacy industrial control system sustainment because the part is still actively stocked by independent distributors (Jotrin, Kynix, VEKEMO, YIC, Ariat-Tech) for end-of-life factory-automation lines that were designed around the Mercury family in the early 2000s. Sustainment engineers can drop in EP1M120F484I6 or EP1M120F484C8 as drop-in replacements to keep 15- to 20-year-old PLC and SCADA systems running without redesigning the controller card. The 484-ball BGA footprint is unchanged across speed grades, so qualified PCB assembly lines can build replacements without rework.
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推荐产品汇总
工程参考数据： EP1M120F484I7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP1M120F484I6 | EP1M120F484I6N | EP1M120F484I5 | EP1M120F484C8 |
|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 484-ball FineLine BGA | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same |
| Usable Gates | 120,000 | 120,000 | 120,000 | 120,000 | 120,000 |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +85C (commercial) |
| Speed Grade | 7 | 6 | 6 | 5 | 8 |
| Configuration Method | Mask-programmed | Mask-programmed | Mask-programmed | Mask-programmed | Mask-programmed |
| Equivalent SRAM Part | EP1K100FI484-2 | EP1K100FI484-2 | EP1K100FI484-2 | EP1K100FI484-2 | EP1K100FC484-2 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Speed grade 7 with industrial -40C to +85C （对比 EP1M120F484C8)
- Faster timing margin than EP1M120F484I6 （对比 EP1M120F484I6)
- Same Mercury die as the entire EP1M120 family （对比 EP1K100FI484-2)
设计说明
Designers must close all verification on the SRAM-based EP1K100FI484-2 prototype before committing to a Mercury mask NRE. According to the Mercury datasheet, mask changes after wafer fab start cost the full mask set again plus a new part number, so any post-mask logic bug blocks production for several months. Plan a Quartus regression on the EP1K100 prototype against a comprehensive testbench, then run the mask conversion tool only after sign-off.
The 484-ball FineLine BGA requires 0.8 mm pitch ball land pads and a 4-6 layer PCB stack-up with continuous ground planes under the package. Decoupling requires at least 8 low-ESL ceramic capacitors (one per VCCINT/VCCIO ball group), with bulk tantalum or polymer capacitors on the 3.3V and 2.5V rails. Per Mercury datasheet PCB guidelines, all decoupling must be placed within 5 mm of the package to suppress simultaneous-switching noise on the LVDS I/O banks.
Because Mercury parts are mask-programmed and never reconfigure, the JTAG (IEEE 1149.1) boundary-scan pins remain active in production and should be routed to a test header for in-system board test. The Mercury datasheet recommends tying unused I/O banks to VCCIO through a 10 kohm resistor to prevent floating-input supply currents, and recommends series-termination resistors on high-speed LVDS outputs placed within 3 mm of the BGA ball.
合规信息
EP1M120F484I7 pre-dates widespread RoHS adoption; many date codes contain lead-bearing solder balls. RoHS, REACH, lead-free, halogen-free, and conflict-minerals status should be verified per specific date code with the distributor before placing into a RoHS-restricted product.