EP20K200CB356C8N - APEX 20KC FPGA, 200K Gates, BGA-356 | Altera
料号： EP20K200CB356C8N ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72 | $720.00 |
| 25 | $67.25 | $1,681.25 |
| 100 | $61.8 | $6,180.00 |
| 250 | $56.4 | $14,100.00 |
EP20K200CB356C8N 概述
A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded multipliers, dual-port RAM, and a programmable interconnect fabric. APEX 20KC sits in Altera's high-density, look-up-table (LUT) based PLD hierarchy: PLD -> CPLD -> FPGA -> SRAM-based LUT FPGA. The 20KC series added dedicated LVDS support and on-chip CAM compared with earlier APEX 20K parts, making it suitable for interface bridging, datapath, and moderate-speed DSP functions.
Key features include 8,320 logic elements distributed across MegaLAB structures, embedded system blocks providing 106,496 bits of RAM, multi-volt I/O support (1.5 V, 1.8 V, 2.5 V, 3.3 V) and LVDS differential signaling, 4 phase-locked loops (PLLs) for clock management, and JTAG-based in-system programmability via the IEEE 1149.1 boundary-scan interface. Per the Altera APEX 20K datasheet (apex_1299388.pdf), the device is configured by an industry-standard serial configuration device or via the enhanced configuration bitstream.
The APEX 20KC architecture combines fine-grained logic elements with coarse-grained ESBs (Embedded System Blocks) so that designers can implement register-rich datapaths and dual-port memories in the same fabric. With four PLLs, designers can deskew multiple clock domains, while the dedicated MultiVolt I/O ring lets a single die talk directly to 1.5 V, 1.8 V, 2.5 V and 3.3 V peripherals without external level translation.
Typical applications include telecom line-card glue logic, industrial control and factory-automation backplanes, PCI/PCI-X bridge and bus-interface controllers, low-density DSP pipelines, and legacy replacement of discrete TTL/MSI logic on dense wire-wrap or backplane designs.
When designing with this device, ensure that the 1.8 V core rail is sequenced before the I/O rails per the datasheet power-up specification, and verify that JTAG chain integrity is preserved when mixing EP20K200 with other devices on the same TCK/TMS line.
This page consolidates distributor pricing tiers, drop-in APEX 20KC family alternates, BGA-356 pinout details and practical configuration-device selection guidance - engineering context not collected in any single datasheet or distributor listing.
直接替换替代料： EP20K200CB356C8N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP20K200CB356C8N （相同外形与封装尺寸） ——差异在于 Package, Family, Operating Temperature, Process Technology, Series.
快速对比工具——选择替代料号进行并排对比：
EP20K200CB356C7N
✅ 直接替换✓ 有现货
$92 / 个
查看数据手册 →EP20K200CB356C7ES
✅ 直接替换✓ 有现货
$108.5 / 个
查看数据手册 →EP20K200CB356C8ES
✅ 直接替换✓ 有现货
$178 / 个
查看数据手册 →EP20K200BC356-2
✅ 直接替换✓ 有现货
$88.25 / 个
查看数据手册 →EP20K200BC356-3
✅ 直接替换✓ 有现货
$162 / 个
查看数据手册 →EP20K200BC356-2XV
✅ 直接替换✓ 有现货
$45 / 个
查看数据手册 →EP20K200CB356C8N 最大额定值与电气特性
| Family | APEX 20KC |
| Series | EP20K200 |
| Device Type | SRAM-based LUT FPGA |
| System Gates | 200,000 |
| Logic Elements (Cells) | 8,320 |
| Maximum Internal Frequency | 301.21 MHz |
| Process Technology | 0.15 um CMOS |
| Propagation Delay (tpd) | 1.78 ns |
| Nominal Core Supply Voltage | 1.8 V |
| Core Supply Voltage Range | 1.71 V to 1.89 V |
| Number of User I/O Pins | 263 |
| Number of Dedicated Inputs | 4 |
| Total Macrocells / Output Functions | 263 |
| Embedded Memory Bits | 106,496 bits |
| Number of PLLs | 4 |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Differential Signaling | LVDS |
| Configuration Interface | Serial / JTAG (IEEE 1149.1) |
| 封装 | 356-ball LBGA |
| Operating Temperature (commercial "C") | 0 C to +85 C (TJ) |
| Terminal Finish ("N") | Lead-free / Pb-free |
EP20K200CB356C8N 356-ball lbga 引脚配置指南
EP20K200CB356C8N（356-ball lbga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP20K200CB356C8N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP20K200CB356C8N 适用于 6 应用s: Telecom Line-Card Glue Logic, Industrial Control Backplane Bridge, PCI / PCI-X Bridge Controller, Low-Density DSP / Datapath Pipeline, Legacy TTL/MSI Logic Consolidation, JTAG-Driven In-System Programming Hub.
Telecom Line-Card Glue Logic
The EP20K200CB356C8N's 200K system gates and 263 user I/Os make it a strong fit for telecom line cards where many LVTTL or LVDS signals must be aggregated, muxed and protocol-translated between backplane and framer ASICs. With 8,320 logic elements and 4 PLLs, the part absorbs glue logic that would otherwise require multiple discrete CPLDs, while the 1.78 ns tpd (C8) keeps the datapath margin tight for STS-1 / E1 framing overhead. Its MultiVolt I/O ring (1.5/1.8/2.5/3.3 V) avoids external level shifters when bridging legacy 5 V-tolerant buses with newer 1.8 V framer I/O. Designers typically pair it with a serial configuration PROM such as EPC16 to support in-field firmware upgrades during telecom qualification cycles.
推荐
Industrial Control Backplane Bridge
In factory-automation backplanes the EP20K200CB356C8N is widely used as a programmable bus-bridge between VME, CompactPCI and custom parallel fieldbuses. Its 263 I/Os and 106,496 bits of embedded RAM (across the ESBs) allow a single device to terminate a 32-bit data bus, latch framing bytes, and buffer payload chunks in dual-port mode without external SRAM. The four PLLs regenerate clocks from recovered line-rate references, while the JTAG boundary-scan chain simplifies bed-of-nails board test on dense backplane assemblies. Industrial designers value the 0.15 um APEX 20KC process for its tolerance of continuous duty at 70 C ambient inside sealed control cabinets.
推荐
PCI / PCI-X Bridge Controller
Because of its high I/O count and fast C8 timing, the EP20K200CB356C8N is frequently chosen as a PCI-to-local-bus bridge or PCI-X load-and-store controller. The device has enough logic elements (8,320) to host the PCI target/state-machine reference design from Altera application notes, while its 263 user I/Os expose the full 64-bit PCI-X AD bus plus arbitration and interrupt signals in a single part. The 1.78 ns propagation delay supports the 66 MHz PCI-X setup/hold window, and the LVDS-capable I/O ring lets the same fabric drive both single-ended PCI signaling and a private LVDS side-channel. Designers can implement the configuration bitstream in JTAG mode to support field firmware updates.
推荐
Low-Density DSP / Datapath Pipeline
The APEX 20KC architecture's ESBs (Embedded System Blocks) deliver 106,496 bits of dual-port RAM, which the EP20K200CB356C8N can partition into FIFO, shift-register or coefficient memory for moderate-density DSP pipelines. With 8,320 logic elements and a 301.21 MHz internal frequency ceiling, the part handles FIR filters, FFT butterflies and video scaling pre-processing at pixel-clock rates. The four PLLs generate the multiple sample-rate clocks needed for parallel video chroma channels, while the dedicated LVDS receivers simplify interfacing with flat-panel serializers. Compared with a discrete TTL/MSI implementation, the APEX-based design collapses several boards into one and eases late-stage algorithm changes.
推荐
Legacy TTL/MSI Logic Consolidation
Designers maintaining long-life defense, aerospace and process-control systems often use the EP20K200CB356C8N to replace racks of 74LS/74F glue logic with a single reprogrammable device. The 8,320 logic elements are more than sufficient to absorb counters, decoders, multiplexers and small state machines that were previously scattered across dozens of discrete packages, and the 263 user I/Os drive each legacy signal at the appropriate voltage through the MultiVolt ring. Because the bitstream is stored in an external serial PROM, the design can be re-provisioned without board rework when a new IC variant is end-of-life. This dramatically reduces MTBF and stocking costs for low-volume, long-life programs.
推荐
JTAG-Driven In-System Programming Hub
When integrating the EP20K200CB356C8N onto multi-FPGA boards, its JTAG (IEEE 1149.1) TAP is often used as a centralized programming hub for several cascaded APEX 20KC devices and their companion configuration PROMs. The fabric can implement a soft JTAG controller that manages chain integrity, and the 263 user I/Os expose buffered TDO expansion to downstream devices without external logic. Quartus II programmer flows speak directly to the APEX 20KC TAP, which simplifies manufacturing test and field firmware refresh on legacy boards. The LVDS I/O ring also lets the hub drive long JTAG cables across chassis boundaries with low skew.
推荐
推荐产品汇总
工程参考数据： EP20K200CB356C8N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP20K200CB356C7N | EP20K200CB356C7ES | EP20K200CB356C8ES | EP20K200BC356-2 | EP20K200BC356-3 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 356-ball LBGA | 356-ball LBGA | 356-ball LBGA | 356-ball LBGA | 356-ball BGA | 356-ball BGA |
| System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Logic Elements (Cells) | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 |
| Speed Grade | C8 (1.78 ns tpd) | C7 (slower tpd) | C7 (slower tpd) | C8 (same tpd) | -2 (~10% slower vs C8) | -3 (~30% slower vs C8) |
| Core Voltage (nominal) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| User I/O Count | 263 | 263 | 263 | 263 | 263 | 263 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Param Match | 100% | 90% | 80% | 95% | 80% | 70% |
关键差异点
- Highest speed grade within the APEX 20KC 356-ball LBGA footprint （对比 EP20K200CB356C7N)
- Lead-free terminal finish for Pb-free assembly （对比 EP20K200BC356-2)
- On-chip MultiVolt I/O supports 1.5/1.8/2.5/3.3 V in a single die （对比 Discretes 74LVT + 74AVC bridge chips)
- Highest logic-element density within BGA-356 footprint （对比 EP20K100CB356C8 (same package, smaller die))
设计说明
Sequence the 1.8 V core rail before any MultiVolt I/O rail during power-up to avoid I/O-driving-into-an-unpowered-core latch-up; the APEX 20K datasheet specifies a VCCIO-before-VCCINT or simultaneous-rise requirement. Decouple each VCCINT ball with a 0.1 uF ceramic + 1 uF bulk cap placed within 5 mm of the ball, and provide a 4.7 uF bulk tantalum per power quadrant. If the board also supplies 3.3 V I/O, place an additional 10 uF bulk on the 3.3 V rail near the package - APEX 20KC IO current can exceed 1 A during simultaneous LVDS switching events.
Estimated: with theta_JA ~17 C/W for a 356-ball LBGA on a 1 oz 4-layer PCB and assuming 60% toggle rate at 1.8 V core, dissipation is roughly 0.9 W - well within the 4.5 W TJ=100 C envelope. Airflow of 100 LFM drops theta_JA to ~13 C/W and derates by another 20%. For sealed enclosures, add a copper heatsink pad on the package top and stitch thermal vias under the die-up flag to keep Tj below 100 C in commercial-grade builds.
Route all 4 PLL power pins (VCC_PLL) with star-grounded isolated islands and a 0.1 uF + 10 uF LC filter to the analog ground - mixing PLL and logic grounds introduces jitter above 30 ps RMS. Place the JTAG chain (TCK/TMS/TDO/TDI) on a single isolated bus with 33 ohm series termination at the driver; on multi-FPGA boards use a 74LVT125 buffer to prevent chain contention if one FPGA is unconfigured. Match LVDS pair lengths to within 150 mils to keep skew below 50 ps on the LVDS I/O ring.
Do not connect nCONFIG or nSTATUS directly to 3.3 V without a 4.7 kohm pull-up - the APEX 20K expects these pins to be actively driven by the configuration PROM during power-on. Do not assume 5 V tolerance on the I/O ring; MultiVolt I/O supports up to 3.3 V only. Do not skip the CONF_DONE pull-up - missing CONF_DONE pulls prevent the bitstream from completing and lock the device in reset. Always validate the configuration bitstream with Quartus II programmer before final board bring-up.
合规信息
Lead-free terminal finish indicated by 'N' suffix (per Verified Web Data). RoHS, REACH, halogen-free and conflict-mineral compliance status were not explicitly stated in the provided data and are marked unknown. AEC-Q100 not applicable - this is a commercial-grade FPGA.
