EP20K400CF672C-7 - 400K Gate APEX 20KC FPGA, 672-BGA | Altera
料号： EP20K400CF672C-7 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
EP20K400CF672C-7 概述
An FPGA (Field Programmable Gate Array) is a reprogrammable digital logic device whose logic cells, routing, and I/O are configured by a configuration bitstream rather than hardwired. APEX 20KC belongs to the APEX 20K family (1999-2003 generation), which occupies the high-density end of the SRAM-based FPGA taxonomy: logic cell array -> PLD/FPGA -> programmable logic -> digital IC -> semiconductor. The 20KC variant added 2.5 V PCI compliance and a faster interconnect fabric versus 20K, while retaining the same Quartus-compatible design flow and Look-Up Table (LUT)-based Logic Element (LE) architecture.
Key specifications include 16,640 logic elements, 212,992 RAM bits, 488 maximum user I/O pins, 4 phase-locked loops, and 1.8 V core VCCINT with MultiVolt I/O supporting 1.8 V, 2.5 V, and 3.3 V interfaces. The 672-BGA package exposes 8 dedicated clock pins, 8 dedicated inputs, and a JTAG boundary-scan port. APEX 20KC devices are configured via passive serial (PS), passive parallel asynchronous (PPA), passive parallel synchronous (PPS), or JTAG modes using an EPC configuration device or a microprocessor. Hot-socketing and Power-On-Reset (POR) sequencing are supported.
Typical applications span telecommunication line cards, PCI 64-bit/66 MHz bridge designs, high-speed DSP co-processing, network packet classification using CAM, and legacy industrial control where MultiVolt I/O bridges 5 V system logic to 3.3 V or 2.5 V PHYs. The part is rated for commercial temperature (0 °C to +85 °C junction). Please refer to the manufacturer datasheet for full electrical characteristics and AC timing.
When designing with EP20K400CF672C-7, observe MultiVolt I/O bank power sequencing: VCCIO banks must ramp before or simultaneously with VCCINT to avoid latch-up; otherwise POR may be indeterminate. Reserve at least 4 user I/O for the JTAG chain if in-system programmability is required, and verify the 672-BGA escape allows adequate fan-out for the 488 signal pins.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes beyond the manufacturer datasheet, enabling faster design-in decisions for engineers working with this legacy Altera / Intel FPGA family.
直接替换替代料： EP20K400CF672C-7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP20K400CF672C-7 （相同外形与封装尺寸） ——差异在于 Process Technology, Package, Operating Temperature, Speed Grade, Series.
快速对比工具——选择替代料号进行并排对比：
EP20K400CF672C-8
✅ 直接替换✓ 有现货
$95 / 个
查看数据手册 →EP20K400EFC672-1XN
✅ 直接替换✓ 有现货
$215 / 个
查看数据手册 →EP20K400EFI672-2X
✅ 直接替换✓ 有现货
$168 / 个
查看数据手册 →EP20K300EFC672-2X
✅ 直接替换✓ 有现货
$99.5 / 个
查看数据手册 →EP20K300EFC672-1
✅ 直接替换✓ 有现货
$92.4 / 个
查看数据手册 →EP20K300EFC672-2N
✅ 直接替换✓ 有现货
$59.2 / 个
查看数据手册 →EP20K400CF672C-7 最大额定值与电气特性
| Family | APEX-20KC |
| Logic Elements (LE) | 16640 |
| Embedded Memory Bits | 212992 |
| Maximum User I/O | 488 |
| Number of PLLs | 4 |
| Number of Logic Array Blocks (LABs) | 1664 |
| Number of ESBs (Embedded System Blocks) | 212 |
| Number of CAM Blocks | 16 |
| Core Voltage (VCCINT) | 1.8 V |
| I/O Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Process Technology | 0.15 µm CMOS, SRAM-based |
| 封装 | 672-pin FC-FBGA (FineLine BGA) |
| Speed Grade | -7 (commercial) |
| 工作温度 | 0 °C to +85 °C (commercial) |
| 安装类型 | Surface Mount (SMD/SMT) |
| PCI Support | PCI 2.2 compliant, 64-bit / 66 MHz |
| Configuration Modes | PS, PPA, PPS, JTAG |
| External Memory Support | DDR SDRAM, ZBT SRAM |
EP20K400CF672C-7 672-pin fc-fbga (fineline bga) 引脚配置指南
EP20K400CF672C-7（672-pin fc-fbga (fineline bga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP20K400CF672C-7.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP20K400CF672C-7 适用于 6 应用s: PCI 64-bit/66 MHz Bridge Design, Telecommunication Line Card Processing, High-Speed DSP Co-Processing, Network Packet Classification with CAM, Legacy Industrial Control Bridge, DDR SDRAM / ZBT SRAM Memory Controller.
PCI 64-bit/66 MHz Bridge Design
The EP20K400CF672C-7's PCI 2.2 compliance at 33/66 MHz with 32- or 64-bit bus width makes it ideal for legacy PCI bridge ASIC replacement. Its 16,640 logic elements can absorb bus state machines, scatter-gather DMA engines, and address translation logic without external glue. The 488 user I/Os in the 672-FBGA package expose enough lanes for full 64-bit PCI plus auxiliary interrupt and arbiter signals, while 4 PLLs generate the 66 MHz PCI clock and downstream local-bus clocks. Per the APEX 20KC datasheet, MultiVolt I/O at 3.3 V interfaces directly to PCI signaling levels.
推荐
Telecommunication Line Card Processing
The 16,640 LEs and 212,992 bits of embedded memory in the EP20K400CF672C-7 enable packet-header classification, traffic shaping, and ATM/Ethernet segmentation-and-reassembly (SAR) blocks. With 16 CAM blocks on-chip, the device performs high-speed address lookup without external CAM memory, ideal for line cards forwarding Layer-3 packets. The 488 I/Os route LVDS links to framer MACs and SRAM/SSRAM payloads, while 4 PLLs synthesize multiple clock domains for SONET/SDH and Gigabit Ethernet rates. The 1.8 V core VCCINT keeps junction temperature manageable in tightly-packed line-card slots.
推荐
High-Speed DSP Co-Processing
The EP20K400CF672C-7 functions as a glue-less DSP co-processor in radar, sonar, and baseband signal-processing arrays. Its 212 ESBs deliver 16-bit multiplication through dedicated arithmetic routing paths, and the 16,640 LEs implement FIR filters, FFT butterflies, and CORDIC engines alongside host-processor glue logic. The 488 user I/Os route 16-bit parallel datapaths to external SRAM or SDRAM, and MultiVolt I/O bridges 3.3 V DSP hosts to 1.8 V core voltage. Speed grade -7 supports up to ~375 MHz internal Fmax, enabling 100 MHz+ DSP data rates with deep combinational paths.
推荐
Network Packet Classification with CAM
The 16 dedicated CAM (Content Addressable Memory) blocks in the EP20K400CF672C-7 accelerate L2/L3 lookup tables for ACLs, MAC/VLAN tables, and routing prefix matching. Each CAM block stores up to 32 entries of 32-bit words, enabling 512-entry lookup tables without external TCAM chips. The 16,640 logic elements build the surrounding forwarding pipeline, while 488 I/Os route packet buses to external network processors. Per the APEX 20KC datasheet, CAM lookups complete in a single clock cycle, ideal for line-rate classification at Gigabit Ethernet speeds.
推荐
Legacy Industrial Control Bridge
The EP20K400CF672C-7 bridges legacy 5 V-tolerant industrial buses (VME, ISA, parallel I/O) to modern 3.3 V microcontrollers without external level shifters. MultiVolt I/O supports 1.8 V, 2.5 V, and 3.3 V bank voltages, while 488 user I/Os expose enough channels for parallel ADC/DAC buses, encoder counters, and PWM outputs. The 16,640 LEs absorb PLC-style ladder-logic replacement and PID-loop calculations in deterministic fabric. Speed grade -7 and 4 PLLs synchronize motor-control loops at microsecond resolution, making this device well-suited to legacy factory-automation retrofit projects.
推荐
DDR SDRAM / ZBT SRAM Memory Controller
The EP20K400CF672C-7 integrates external memory controllers for DDR SDRAM and ZBT (Zero Bus Turnaround) SRAM through dedicated I/O and clocking resources. Its 4 PLLs provide the 90° phase-shifted clocks required for DDR center-aligned data capture, while MultiVolt I/O at 2.5 V matches SSTL-2 DDR signaling directly. The 212,992 bits of internal ESB memory act as FIFO write/read buffers between the memory controller and host datapath, and 488 user I/Os expose up to 72-bit DDR data buses plus address/command. This makes the part suitable for high-throughput frame buffers and network-processor glue.
推荐
推荐产品汇总
工程参考数据： EP20K400CF672C-7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP20K400CF672C-8 | EP20K400EFC672-1XN | EP20K400EFI672-2X | EP20K300EFC672-2X | EP20K300EFC672-1 |
|---|---|---|---|---|---|---|
| Package | 672-pin FC-FBGA | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) | 672-pin FC-FBGA (same) |
| Brand | Altera (now Intel FPGA) | Altera (same brand) | Altera (same brand) | Altera (same brand) | Altera (same brand) | Altera (same brand) |
| Family | APEX 20KC | APEX 20KC | APEX 20K | APEX 20K | APEX 20K | APEX 20K |
| Logic Elements (LE) | 16640 | 16640 | 16640 | 16640 | 12000 (approx.) | 12000 (approx.) |
| Embedded Memory Bits | 212992 | 212992 | 212992 | 212992 | 150000 (approx.) | 150000 (approx.) |
| Maximum User I/O | 488 | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | -7 (commercial) | -8 (faster) | -1 (slower) | -2 (slower) | -2 (slower) | -1 (slower) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
关键差异点
- APEX 20KC family with 2.5 V PCI compliance （对比 EP20K400CF672C-8)
- Industrial-temperature drop-in option exists in same package （对比 EP20K400EFC672-1XN)
- 16 dedicated CAM blocks for high-speed lookup （对比 EP20K300EFC672-2X)
- Higher density than APEX 20K base family （对比 EP20K400EFC672-1XN)
设计说明
The EP20K400CF672C-7 requires separate VCCINT (1.8 V core) and VCCIO (1.8 V / 2.5 V / 3.3 V) rails with MultiVolt bank partitioning. Per Altera application notes, VCCIO banks must power up before or simultaneously with VCCINT; otherwise Power-On-Reset (POR) may latch indeterminate configuration state, requiring a manual re-configuration cycle. Decouple each VCCIO bank with 0.1 µF and 10 µF ceramic capacitors placed within 5 mm of the BGA balls.
Estimated: at full utilization (16640 LEs switching at 100 MHz) and 1.8 V VCCINT, the EP20K400CF672C-7 dissipates roughly 3-5 W. The 672-FBGA package thermal resistance (theta_JA) is approximately 12-15 C/W on a 4-layer PCB with thermal vias, giving a 50-70 C junction temperature rise over ambient. Provide a continuous ground plane directly beneath the BGA and an array of thermal vias (0.3 mm pitch) under the die to keep Tj below 125 C.
The 672-FBGA package has 1.0 mm ball pitch and requires 4-layer or 6-layer PCB with microvia-in-pad for inner-row escape. Per APEX 20KC layout guidelines, place decoupling capacitors on the opposite PCB side directly under BGA balls, with via-in-pad to minimize loop inductance. Maintain a continuous reference plane beneath the BGA to control characteristic impedance for LVDS and DDR signals; break the reference plane only for the boundary-scan JTAG chain to avoid return-path discontinuities.
Do not assume any 672-FBGA APEX 20K device is bitstream-compatible across the 20K vs 20KC families: APEX 20KC adds 2.5 V PCI support and minor architectural enhancements, so designs targeting 20KC features may not load on plain 20K silicon. Also note that the 'C' suffix in EP20K400CF672C-7 denotes commercial temperature, while 'I' (industrial) parts share the same pinout but use a different die bin. Always confirm speed grade timing margins before substituting.
Differential pairs (LVDS) routed from the EP20K400CF672C-7 must be length-matched within 150 mils and have 100 Ω differential impedance, with the pair traces symmetrically routed over a continuous ground plane. Place series-termination resistors within 5 mm of the driver BGA ball. For DDR SDRAM, route address/command traces on a dedicated layer and use the 4 PLLs to generate 90°-shifted clocks for center-aligned data capture per the Altera external memory interface guidelines.
合规信息
Lifecycle status obsolete. RoHS / lead-free / halogen-free status not explicitly stated in the verified web data; consult Altera / Intel FPGA product page for definitive compliance documentation. AEC-Q100 not applicable (this is an FPGA, not an automotive-grade part).
