EP20K60EFC324-1 - 60K APEX-20KE FPGA, 196 I/O, 324-FBGA | Altera
料号： EP20K60EFC324-1 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88.5 | $885.00 |
| 100 | $85.16 | $8,516.00 |
| 500 | $81 | $40,500.00 |
| 1,000 | $76.5 | $76,500.00 |
EP20K60EFC324-1 概述
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and embedded memory blocks that can be rewired in the field to implement arbitrary digital logic. FPGAs sit within the broader hierarchy of programmable logic devices: FPGA -> programmable logic -> digital IC -> semiconductor. The APEX-20KE family is the enhanced (E-suffix) MultiCore™ architecture variant that combines look-up table (LUT)-based logic with embedded array blocks (EABs) for memory and arithmetic functions, allowing a single chip to host both glue logic and datapath/memory functions.
Key features of the EP20K60EFC324-1 include 196 maximum user I/Os, 32,768 total RAM bits distributed across embedded array blocks, a 1.8 V core supply, and the compact 19x19 mm FBGA-324 package that is footprint-compatible across the APEX 20K E-series product family. The -1 speed grade offers the standard propagation delay tier for the family, suitable for general-purpose glue logic, datapath, and bus-interface applications operating up to 250 MHz.
Technically, the APEX-20KE architecture combines fine-grained logic elements with MegaLAB™ structures that group multiple logic elements and EABs into a single high-speed interconnect domain, simplifying timing closure for wide datapath designs. The 1.8 V core supply reflects the migration to lower-voltage operation introduced in this enhanced family, reducing power consumption compared to the 2.5 V APEX-20K predecessors.
Typical applications include telecommunications line cards, peripheral bus bridging (PCI to local bus), industrial control and factory automation, networking backplane glue logic, and legacy designs that were originally captured on the Quartus II 4.x/5.x toolchain. The 324-FBGA footprint also makes the part suitable for high-density adapter cards where 196 I/Os are needed without an excessively large board footprint.
When designing with this part, note that the APEX 20KE family is supported by the legacy Quartus II design software and is no longer recommended for new designs - the family has been replaced by Cyclone and Stratix series FPGAs in current Intel FPGA roadmaps. Always verify long-term availability against your product lifecycle expectations before committing to new designs.
This page synthesizes distributor pricing, drop-in alternatives drawn from the same APEX 20KE BGA-324 footprint family, and practical design notes not found in the manufacturer datasheet. Pricing is presented in USD and reflects observed distributor data as of 2026-09-08.
直接替换替代料： EP20K60EFC324-1 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP20K60EFC324-1 （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package / Case, Process Technology, Total Gates, Family.
快速对比工具——选择替代料号进行并排对比：
EP20K60EFC324-2X
✅ 直接替换✓ 有现货
$195.5 / 个
查看数据手册 →EP20K100EFC324-1N
✅ 直接替换✓ 有现货
$108 / 个
查看数据手册 →EP20K100EF324I2XGZ
✅ 直接替换📋 参考替代料（不在目录中）
EP20K60EFC324-1N
✅ 直接替换📋 参考替代料（不在目录中）
EP20K60EFC324-1X
✅ 直接替换✓ 有现货
$198 / 个
查看数据手册 →EP20K60EFC324-1 最大额定值与电气特性
| Series | APEX-20KE® |
| Family | APEX 20K (Enhanced) |
| Logic Elements / Cells | 2560 |
| Total Gates | 60,000 (typical) |
| Total RAM Bits | 32768 |
| Number of I/O | 196 |
| Number of Logic Blocks/Elements | 2560 |
| Core Supply Voltage | 1.71 V to 1.89 V (1.8 V nominal) |
| Process Technology | 0.22 µm CMOS |
| Maximum Operating Frequency | 250 MHz |
| Speed Grade | -1 |
| 封装 / 外壳 | 324-FBGA (FineLine BGA, 19x19 mm) |
| Supplier Device Package | 324-FBGA (19x19) |
| 安装类型 | Surface Mount |
| 工作温度 | 0 °C to +85 °C (commercial) |
| RoHS 状态 | Non-compliant (legacy) |
| Lead Free Status | Contains lead (legacy) |
EP20K60EFC324-1 324-fbga (19x19) 引脚配置指南
EP20K60EFC324-1（324-fbga (19x19) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP20K60EFC324-1.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP20K60EFC324-1 适用于 7 应用s: Telecommunications Line Cards, PCI / Local-Bus Bridge Designs, Industrial Control and Factory Automation, Networking Backplane Glue Logic, Legacy Adapter Cards and I/O Expansion, ASIC Prototyping and Logic Emulation, Military / Aerospace Legacy Systems.
Telecommunications Line Cards
The EP20K60EFC324-1's 60K-gate capacity, 196 user I/Os, and 32 kbit of embedded memory make it well suited for legacy telecom line-card glue logic where it sits between a network processor and PHYs, performing bus conversion, framing, and time-slot management. The 1.8 V core supply reduces power across densely populated shelves, while the 324-FBGA footprint places 196 I/Os in a 19x19 mm body - critical for line cards that must fit 8-16 ports on a single PCB. Compared with a CPLD solution, the FPGA's 32 kbit of EAB memory allows on-chip packet buffering for small cells, removing an external SRAM. Designers should note the APEX 20KE family is obsolete; new designs should evaluate Cyclone IV GX or similar current parts instead.
推荐
PCI / Local-Bus Bridge Designs
The APEX 20KE architecture excels at protocol-bridging applications such as PCI-to-local-bus, and the EP20K60EFC324-1 provides 60K gates and 196 I/Os - enough to implement a 32-bit/33 MHz PCI target or master with side-band logic and FIFOs in a single device. The 32 kbit of embedded memory can be partitioned into transmit and receive FIFOs, eliminating an external SRAM in many bridging scenarios. The -1 speed grade meets the 33 MHz PCI clock period with comfortable timing margin at the 1.8 V core. Engineers porting PCI designs to this device should still validate against the PCI Local Bus Specification 2.2 electrical and protocol requirements.
推荐
Industrial Control and Factory Automation
Factory-automation controllers frequently integrate multi-protocol glue logic between sensor buses (RS-485, RS-232, CAN, SPI, I2C) and an industrial CPU, and the EP20K60EFC324-1 is a fit for this role because of its 196 I/Os - sufficient to fan-out several UARTs, SPI masters, and parallel sensor interfaces from one device. The 32 kbit of embedded memory supports small lookup tables for protocol translation, while the 1.8 V core draws less power on the factory floor than the older 2.5 V APEX 20K. Industrial users should note the part is specified for the commercial 0 °C to +85 °C range; for true -40 °C to +85 °C industrial operation, the EP20K100EF324I2XGZ industrial variant is preferred.
推荐
Networking Backplane Glue Logic
Backplane-interface cards in legacy switches and routers rely on FPGAs to perform bus-width conversion, parity generation, and address decoding between line cards and a central switch fabric, and the EP20K60EFC324-1 is sized for such glue roles with 60K gates and 196 I/Os in a 19x19 mm BGA. The 250 MHz internal logic performance supports 100 Mbps and lower-speed backplane buses with margin. Compared with discrete TTL or 5-V CPLDs, this part reduces board area and BOM count while adding reprogrammability for late-stage bug fixes. Long-term availability should be qualified with a drop-in BGA-324 alternative from the APEX 20KE family.
推荐
Legacy Adapter Cards and I/O Expansion
Adapter cards that expand legacy parallel buses (VME, ISA, PMC) to modern peripherals use the EP20K60EFC324-1 as a translation and buffering engine, leveraging its 196 I/Os to fan-out 16- or 32-bit buses with spare I/Os for status LEDs and control signals. The 32 kbit of embedded memory buffers transactions between the two buses, eliminating external FIFOs in many designs. The 324-FBGA footprint allows the entire adapter to fit a PMC or VME daughter-card outline. Designers should plan for end-of-life and qualify the EP20K60EFC324-2X or EP20K100EFC324 in the same BGA-324 footprint as drop-in second sources.
推荐
ASIC Prototyping and Logic Emulation
The EP20K60EFC324-1 is well suited as a building block in multi-FPGA ASIC prototyping, where multiple APEX 20KE parts are tiled on a logic-emulation board to validate ASIC RTL before tape-out. With 60K gates per device, several parts together can hold multi-million-gate ASIC designs, and the 1.8 V core allows dense placement without thermal issues. The 324-FBGA footprint exposes 196 I/Os per device - enough for high-fanout inter-FPGA traces on a multi-FPGA prototyping board. Emulation users should use the Quartus II 4.x/5.x compiler, which supports the APEX 20KE family natively.
推荐
Military / Aerospace Legacy Systems
Long-life military and aerospace programs often retain the EP20K60EFC324-1 in production designs because the qualification artifacts and board layouts are already approved. The 60K gates and 196 I/Os handle avionics databus interfaces, weapons-system controllers, and ground-equipment front panels. The -1 speed grade at 250 MHz is adequate for MIL-STD-1553 and ARINC 429 interfaces, which operate well below 1 MHz. For new aerospace designs, qualified equivalents should be sourced through the same BGA-324 APEX 20KE family - the EP20K100EFC324 is a true drop-in upgrade in the same 19x19 mm footprint.
推荐
推荐产品汇总
工程参考数据： EP20K60EFC324-1 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP20K60EFC324-2X | EP20K100EFC324 | EP20K100EF324I2XGZ | EP20K60EFC324-1N | EP20K60EFC324-1X |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 324-FBGA (19x19) | 324-FBGA (19x19) - same | 324-FBGA (19x19) - same | 324-FBGA (19x19) - same | 324-FBGA (19x19) - same | 324-FBGA (19x19) - same |
| Family / Series | APEX-20KE | APEX-20KE | APEX-20KE | APEX-20KE | APEX-20KE | APEX-20KE |
| Logic Elements / Cells | 2560 | 2560 | 4160 | 4160 | 2560 | 2560 |
| Total Gates (typical) | 60,000 | 60,000 | 100,000 | 100,000 | 60,000 | 60,000 |
| Total RAM Bits | 32,768 | 32,768 | 53,248 | 53,248 | 32,768 | 32,768 |
| Number of I/O | 196 | 196 | 256 | 256 | 196 | 196 |
| Speed Grade | -1 | -2X (faster) | -1 | -2X (industrial) | -1 | -1X (faster) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +85 °C (industrial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) |
关键差异点
- 60K gates + 196 I/Os in a compact 19x19 mm BGA-324 footprint （对比 EP20K100EFC324)
- Commercial temperature grade with broad second-source availability （对比 EP20K100EF324I2XGZ)
- -1 speed grade offers the most flexible bitstream-portability across the family （对比 EP20K60EFC324-2X)
设计说明
The 324-FBGA package has a typical theta_JA in the range of 18-25 C/W on a JEDEC JESD51-7 4-layer test board with thermal vias under the exposed die-attach pad. For a fully-utilized EP20K60EFC324-1 at 1.8 V drawing approximately 0.5-1.0 W, a 4-layer board with a small copper pour beneath the package is usually sufficient. For dense multi-FPGA designs, place thermal vias in a 1.2 mm grid directly under the die-attach pad and stitch ground/power pours on inner layers to keep the junction temperature below 100 °C.
Use a 4- or 6-layer PCB stack-up with continuous ground and power planes. The 1.0 mm ball pitch on the 324-FBGA requires laser-drilled microvias (typically 0.1 mm via pad, 0.05 mm drill) on the top layer to fan out signals to inner routing layers. Place all decoupling capacitors (one 0.1 µF plus one 10 µF bulk per VCC pin group) within 2 mm of the package. The APEX 20KE datasheet pinout section lists every BGA ball as user I/O, VCCINT, VCCIO, GND, or configuration - assign VCCIO banks to match the I/O voltage standards you actually use (3.3 V LVTTL, 2.5 V LVCMOS, etc.) and leave unused banks tied to a fixed voltage per the family datasheet.
Estimated: do not assume the APEX 20KE 1.8 V core and the I/O bank voltages are the same rail - VCCINT must be 1.8 V (range 1.71 V to 1.89 V) while VCCIO banks are independently 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on the chosen I/O standard. Power-sequencing requirement: VCCINT must reach its operating range before VCCIO reaches its operating range, and the datasheet mandates a maximum delta of 0.7 V between VCCINT and VCCIO during ramp-up. Configuration also requires a valid configuration clock and data source - if you migrate to the EP20K60EFC324-2X drop-in part, recompile the bitstream at the new speed grade, do not simply load the -1 bitstream into a -2X device.
Match-impedance length-match all high-speed LVDS or DDR interfaces per the APEX 20KE datasheet's I/O timing tables. For 100 MHz parallel buses, length-match within 50 mils (1.27 mm) and use series-termination resistors at the driver end. Place the JTAG header within 2 inches of the TDO/TDI pins to avoid signal-integrity issues on the configuration chain. The 324-FBGA has dedicated configuration balls (MSEL, nCONFIG, nSTATUS, CONF_DONE, DCLK) that must be wired per the APEX 20KE configuration handbook - miswiring these is a common prototype bring-up failure that is hard to diagnose without a Quartus II programmer attached.
Estimated: the 324-FBGA package introduces approximately 1-2 nH of lead inductance per VCC/GND ball pair, which is acceptable for the APEX 20KE's 1.8 V core but requires tight local decoupling. Use one 0.1 µF X7R 0402 ceramic capacitor per VCCIO ball cluster and one 4.7 µF X5R bulk capacitor per I/O bank. For multi-FPGA prototyping boards, isolate the clock distribution network with a dedicated clock buffer (e.g., a CDCV304) to minimize jitter accumulation across FPGAs - the APEX 20KE internal PLLs have a typical input jitter tolerance of 0.5 ns peak-to-peak per the family datasheet.
合规信息
RoHS non-compliant and contains lead per the ICComponents distributor listing retrieved on 2026-09-08. AEC-Q100 not applicable (FPGA is not an automotive-qualified part). REACH, halogen-free, and conflict-minerals status not stated by the verified web data.
