EP2A15F672C7N - APEX II FPGA 16,640 Cells 672-FBGA | Intel
料号： EP2A15F672C7N ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
EP2A15F672C7N 概述
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and I/O cells on a single die, allowing engineers to implement custom digital circuits after manufacturing. APEX II sits at the upper end of the multi-level hierarchy: programmable logic device -> CPLD/FPGA -> high-density SRAM-based FPGA -> APEX II family. The APEX II family supports up to 1 Gbps True-LVDS signalling and offers MultiCore Interconnect routing that maps logic elements to four distinct interconnect regions, which is why this 672-pin BGA variant is commonly used in high-bandwidth communication and processing subsystems.
Key features include 16,640 logic elements, 425,984 RAM bits, 492 user I/Os, LVDS support at 1 Gbps per channel, embedded PLLs for clock management, and dual-configuration schemes supporting JTAG and Passive Serial configuration. The device also includes dedicated hardware for digital signal processing (DSP) blocks and memory interfaces including DDR SDRAM controllers, making it suitable for data-pipeline and datapath-intensive designs that exceed the resources of smaller CPLD and FPGA families.
Architecturally, the APEX II family integrates Logic Array Blocks (LABs), Embedded System Blocks (ESBs) for RAM and ROM, FastTrack Interconnect, and I/O Elements (IOEs) supporting LVTTL, LVCMOS, SSTL, HSTL, LVDS, and LVPECL standards. The 0.15 µm copper process allows denser integration while keeping power manageable for high-density designs.
Typical applications include high-speed telecommunication switching, ASIC prototyping, DSP co-processing, and PCI/PCI-X bus interfacing. The 672-FBGA package with 492 user I/Os accommodates high-pin-count parallel buses and multi-channel LVDS links.
When designing with this FPGA, plan BGA fanout for the 672-pin FC-FBGA, use controlled-impedance routing for LVDS pairs, and plan thermal dissipation for sustained high toggle rates. Altera Quartus II is the supported toolchain for compilation and configuration image generation.
This page synthesizes distributor pricing, parametric data, and engineering design context not found on the standalone manufacturer datasheet, providing a single decision-ready reference for procurement and design teams.
直接替换替代料： EP2A15F672C7N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2A15F672C7N （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Process Technology, Speed Grade, Embedded Memory.
快速对比工具——选择替代料号进行并排对比：
EP2A15F672C7
✅ 直接替换✓ 有现货
$98 / 个
查看数据手册 →EP2A15F672C7AA
✅ 直接替换✓ 有现货
$215 / 个
查看数据手册 →EP2A15B724C9
✅ 直接替换✓ 有现货
$268.5 / 个
查看数据手册 →EP2A15B652C8
✅ 直接替换✓ 有现货
$99.5 / 个
查看数据手册 →EP2A15B652C7
✅ 直接替换✓ 有现货
$82.4 / 个
查看数据手册 →EP2A15F672C7N 最大额定值与电气特性
| Family | APEX II |
| Logic Elements (Cells) | 16,640 |
| Embedded Memory Bits | 425,984 |
| User I/Os | 492 |
| Process Technology | 0.15 µm all-layer copper CMOS |
| Metal Layers | Up to 8 |
| Core Voltage | 1.5 V |
| Maximum Internal Frequency | 500 MHz |
| Speed Grade | -7 |
| 封装 | 672-ball FC-FBGA (FineLine BGA) |
| 工作温度 | Commercial (0C to +85C) |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) |
| Configuration Methods | JTAG, Passive Serial |
| 安装类型 | Surface Mount (BGA) |
EP2A15F672C7N 672-ball fc-fbga (fineline bga) 引脚配置指南
EP2A15F672C7N（672-ball fc-fbga (fineline bga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2A15F672C7N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2A15F672C7N 适用于 6 应用s: High-Speed Telecom Switching, ASIC Prototyping, DSP Co-Processing, PCI/PCI-X Bus Interface, DDR SDRAM Memory Controller, Legacy Industrial Control.
High-Speed Telecom Switching
The EP2A15F672C7N's 16,640 logic elements and 425,984 bits of embedded memory make it well-suited for high-speed telecom switching fabrics where parallel cell-based forwarding tables must be implemented. The 672-ball FC-FBGA package exposes 492 user I/Os, which is sufficient for multi-channel LVDS links and parallel bus aggregation. True-LVDS support up to 1 Gbps per channel enables serialiser/deserialiser aggregation of low-speed backplane traffic without external SERDES chips. Embedded PLLs and DDR SDRAM controller hardware allow direct connection to external TCAM and RLDRAM, which are common in line-card designs. Compared with smaller Cyclone-family FPGAs, the APEX II device delivers the LUT count needed for full table lookups at wire speed, though new designs should evaluate current Arria II GX parts for power efficiency.
推荐
ASIC Prototyping
Engineers use the EP2A15F672C7N as an ASIC prototyping platform because its 16,640 logic cells map the majority of mid-complexity ASICs (typical 100k-200k gate equivalents) onto a single programmable die. The 1.5V core and 0.15 µm copper process deliver predictable timing closure in pre-silicon validation, while 492 user I/Os accommodate ASIC-style pad rings and external memory buses. JTAG and Passive Serial configuration support rapid bitstream reload during iterative bring-up, and embedded ESB blocks emulate SRAM/ROM macros in the ASIC. Quartus II provides gate-level synthesis that closely tracks ASIC timing, making this FPGA a workhorse for ASIC emulator labs.
推荐
DSP Co-Processing
The EP2A15F672C7N integrates embedded Multiplier blocks and ESB memory that suit FIR/IIR filter chains and FFT co-processing in radar, imaging, and baseband signal paths. Its 500 MHz internal fabric combined with 425 kbit embedded memory allows moderate-complexity DSP algorithms (256-point FFT, 64-tap FIR at sample rates up to 100 MHz) to run without external DSP chips. The 672-FBGA package exposes 492 user I/Os, which supports parallel LVDS ADC/DAC interfacing and high-throughput DMA channels to a host processor. Designers should use Quartus II's DSP Builder blocks to map math operations and verify timing closure at the -7 speed grade.
推荐
PCI/PCI-X Bus Interface
The EP2A15F672C7N delivers sufficient I/O count (492 pins) and logic capacity (16,640 cells) to implement full PCI 32/64-bit or PCI-X bus master controllers in telecom and embedded computing cards. Its 3.3V LVCMOS I/O bank capability allows direct PCI signalling without external transceivers, and the embedded PLLs generate the 33 MHz / 66 MHz / 133 MHz PCI reference clocks. Quartus II includes pre-verified PCI and PCI-X mega-function IP cores that map directly onto APEX II resources. This application is one of the most documented legacy uses of the APEX II family and remains in service in industrial PCs and legacy telecom chassis.
推荐
DDR SDRAM Memory Controller
The EP2A15F672C7N's 425,984-bit embedded memory and dedicated SSTL I/O banks enable full DDR SDRAM controller implementations at data rates up to 266 MHz per the APEX II family datasheet. The 672-FBGA package provides the signal integrity needed for controlled-impedance SSTL traces to external DDR DIMMs, while the 1.5V core reduces switching noise coupling into the analogue domain. Designers commonly use APEX II devices in networking line cards and high-end test equipment for custom memory subsystems that cannot be addressed by off-the-shelf controllers. Quartus II's DDR mega-functions automatically place read/write FIFOs in ESB blocks for optimum timing.
推荐
Legacy Industrial Control
The EP2A15F672C7N is widely deployed in legacy industrial control systems (machine vision, motor drives, test and measurement) where long-term field serviceability requires continued spare-part availability. Its 1.5V core, commercial temperature grade, and 672-ball BGA footprint have been qualified in many OEM platforms since 2000, so designs in service for 15+ years still rely on this part for emergency replacements. The 16,640 logic cells support closed-loop control algorithms, encoder interfaces, and real-time Ethernet MACs alongside customer-specific logic. With the APEX II family now obsolete as of 2026-09-08, system integrators should design migration paths toward Cyclone IV/V or Arria II GX devices for new production builds.
推荐
推荐产品汇总
工程参考数据： EP2A15F672C7N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2A15F672C7 | EP2A15F672C7AA | EP2A15B724C9 | EP2A15B652C8 | EP2A15B652C7 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-ball FC-FBGA | 672-ball FC-FBGA (same) | 672-ball FC-FBGA (same) | 724-ball FC-BGA (different) | 652-ball FC-BGA (different) | 652-ball FC-BGA (different) |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Embedded Memory (bits) | 425,984 | 425,984 | 425,984 | 425,984 | 425,984 | 425,984 |
| Speed Grade | -7 | -7 | -7 | -9 | -8 | -7 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete (2026-09-08) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Closest true drop-in alternate in inventory （对比 EP2A15F672C7)
- Wider supply resilience via second packaging variant （对比 EP2A15F672C7AA)
- Higher speed grade at similar density （对比 EP2A15B724C9)
- Logic density and embedded memory for telecom ASIC prototyping （对比 Lattice ECP2-50 (cross-brand, NOT drop-in))
设计说明
The 672-ball FineLine BGA with 1.0 mm ball pitch requires HDI PCB stack-up (typically 1+6+1 or 2+4+2) with laser-drilled microvias for inner-row fanout. Use a single ground reference plane beneath the BGA footprint and stitch vias around the perimeter to suppress simultaneous switching noise. Keep LVDS pairs length-matched to within 5 mils and reference to a continuous ground plane; avoid routing LVDS across plane splits.
Estimated: at typical APEX II utilization (~60% logic, ~30% memory, all 492 I/Os toggling), VCCINT = 1.5 V, VCCIO = 3.3 V, the device can draw 2.5-3.5 A on the core rail and up to 1 A per I/O bank. Provide at least 6 low-impedance 220 µF tantalum + 0.1 µF ceramic decoupling capacitors distributed around the BGA perimeter, with bulk capacitance on a dedicated power plane. Power sequencing must follow the APEX II datasheet's recommended order to avoid latch-up.
The FC-FBGA package has a junction-to-ambient thermal resistance theta_JA in the range of 15-20 C/W with adequate airflow; sustained high toggle rates can push junction temperature beyond 100 C. Use thermal vias under the die-expose pad area and ensure at least 100 LFM airflow across the device. Industrial users should evaluate the I-temp variant (not currently stocked in this part number) for -40C to +100C operation.
Do not confuse the APEX II family with the APEX 20K family; they have different LVDS capabilities, ESB sizes, and configuration bitstream formats. Always use Quartus II 9.x or earlier because newer Quartus Prime releases have dropped APEX II support. Configuration images generated for APEX II are not compatible with APEX 20K or any Cyclone/Arria family.
LVDS signalling at 1 Gbps requires 100-ohm differential impedance with intra-pair skew below 5 ps; inter-pair skew should be within 50 ps for source-synchronous interfaces. SSTL-2/HSTL memory interfaces need on-die termination (ODT) at the SDRAM side and series resistors at the FPGA driver. Always perform post-route signal-integrity simulation in Quartus II's SignalTap or HyperLynx before tape-out.
合规信息
Compliance status for the EP2A15F672C7N was not present in the verified web data; the -N suffix historically indicated lead-free terminal finish on Altera parts but this is not authoritative. AEC-Q100 not applicable (FPGAs are not automotive-qualified in this family). Users must confirm RoHS/REACH directly with Intel/Altera documentation.