EP2A70B652C9 - APEX II 70K LE FPGA, BGA-652 | Intel
料号： EP2A70B652C9 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP2A70B652C9 概述
An FPGA (Field Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks, configurable interconnects, and dedicated I/O cells that can be reconfigured after manufacturing to implement arbitrary digital logic. FPGAs sit in the programmable logic device (PLD) hierarchy, below CPLDs in density and above PALs/GALs. They are widely used for ASIC prototyping, low-volume custom logic, DSP acceleration, and parallel data-path applications where time-to-market and hardware flexibility outweigh the per-unit cost advantage of cell-based ASICs. APEX II was Intel's (formerly Altera) second-generation multi-gigabit, multi-volt family before being superseded by Stratix and subsequent families.
Key features of the EP2A70B652C9 include dedicated on-chip memory blocks, embedded LVDS-capable I/O with multi-voltage support (1.5V, 1.8V, 2.5V, 3.3V), integrated PLLs for clock management, and up to 12 high-speed transceiver channels on speed-grade variants. The BGA-652 package supports up to 8 banks of user I/O, with routing density sufficient for memory-rich designs. Speed grade C9 places it in a moderate performance class within the APEX II lineup.
Architecturally, APEX II uses a MultiCore architecture combining fine-grain logic elements (LEs) with MegaLAB blocks that include embedded array blocks (EABs) for efficient memory and multiplier implementation. The 7-level routing hierarchy provides a balance between performance predictability and routing flexibility. Multi-gigabit transceivers and True-LVDS support allow direct interfacing with high-speed backplanes and memory interfaces such as QDR and DDR SRAM.
Typical applications include high-bandwidth telecommunications line cards, ASIC prototyping for SoC designs, custom DSP accelerators in medical imaging and radar signal processing, and high-speed serial protocol bridging. The combination of high logic density and on-chip memory makes it particularly suited for pipeline-parallel algorithms and protocol conversion functions.
When designing with this part, consider the device's discontinued status in the Intel/Altera product catalog and use the open-source Quartus II design software for synthesis, place-and-route, and timing closure. Power estimation should use the PowerPlay tool within Quartus II before final board design.
This page synthesizes distributor inventory signals, drop-in compatible alternatives, and practical FPGA design guidance not consolidated in the manufacturer's datasheet, supporting engineers sourcing long-lifecycle or end-of-life APEX II inventory.
直接替换替代料： EP2A70B652C9 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2A70B652C9 （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Family, Mounting Type, I/O Bank Voltage (VCCIO).
快速对比工具——选择替代料号进行并排对比：
EP2A70B652C8
✅ 直接替换✓ 有现货
$275 / 个
查看数据手册 →EP2A70B652C7
✅ 直接替换✓ 有现货
$10.506 / 个
查看数据手册 →EP2A70B652C9 最大额定值与电气特性
| Family | APEX II |
| Logic Cells | 67,200 |
| Process Technology | 0.18 um CMOS |
| 封装 | BGA-652 |
| Speed Grade | C9 |
| Supply Voltage - Core | 1.8 V |
| I/O Voltage Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Embedded Memory | EAB-based RAM blocks |
| 工作温度 | -40C to +85C (industrial range, to be confirmed) |
| 安装类型 | Surface Mount (BGA) |
| Design Software | Quartus II (legacy, APEX II support) |
EP2A70B652C9 bga-652 引脚配置指南
EP2A70B652C9（bga-652 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2A70B652C9.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2A70B652C9 适用于 6 应用s: ASIC Prototyping, Telecommunications Line Cards, Custom DSP Accelerators, High-Speed Protocol Bridging, Medical Imaging Front-End, Industrial Control and Automation.
ASIC Prototyping
The EP2A70B652C9's 70K LE density and embedded EAB memory blocks make it well suited for ASIC prototyping, where engineers map a target ASIC netlist onto an FPGA for in-system validation before tape-out. The APEX II MultiCore architecture preserves RTL synthesis fidelity through Quartus II, and the BGA-652 package exposes enough I/O for mid-complexity SoC prototypes. The C9 speed grade is sufficient for functional validation, while C8 or faster grades may be required for timing-accurate emulation. Compared with ASIC verification using dedicated emulators, the APEX II approach trades off speed for cost-effectiveness, making it ideal for pre-silicon software development, IP integration verification, and design bring-up in sub-1M gate designs.
推荐
Telecommunications Line Cards
The EP2A70B652C9's True-LVDS capable I/O and high-density logic fabric support telecommunications line cards that require high-speed serial-to-parallel conversion and custom packet processing. Its multi-voltage I/O banks (1.5V/1.8V/2.5V/3.3V) interface directly to legacy bus interfaces and modern SERDES phys without external level shifting. The device's embedded EAB memory enables on-chip buffering for packet queue management. APEX II was commonly deployed in early-generation SONET/SDH and ATM equipment; replacement designs in modern telecom gear should target Stratix IV or later families with hardened transceivers, but APEX II remains in service in legacy infrastructure requiring long-term support windows of 10+ years.
推荐
Custom DSP Accelerators
The EP2A70B652C9's high logic density and embedded EAB memory blocks make it suitable for custom DSP accelerator cards in medical imaging, radar signal processing, and software-defined radio. The MultiCore architecture supports parallel FIR/FFT pipelines and matrix multiplication, with on-chip EABs providing coefficient and sample memory without external SRAM access penalties. The BGA-652 package supports up to several hundred user I/O, sufficient for multi-channel ADC/DAC interfacing. The C9 speed grade achieves Fmax in the 150-200 MHz range for typical DSP paths. For new designs requiring >200 MHz DSP throughput, migrate to Stratix III or Cyclone V families with dedicated DSP blocks.
推荐
High-Speed Protocol Bridging
The EP2A70B652C9 can implement custom protocol bridges between legacy parallel buses (PCI, VME, ISA) and modern serial protocols (SPI, I2C, custom LVDS), making it valuable in industrial retrofit and test equipment designs. Its True-LVDS support and multi-voltage I/O enable direct interfacing with mixed-voltage subsystems without glue logic. The 70K LE fabric supports RTL-based state machines, FIFOs, and protocol stacks in a single device. Bridge designs benefit from the embedded EAB memory for packet buffering. APEX II remains deployed in long-lifecycle industrial controllers where bridge functionality must match 20-year equipment support expectations.
推荐
Medical Imaging Front-End
The EP2A70B652C9's logic density and embedded memory support medical imaging front-end preprocessing in ultrasound, CT, and MRI subsystems. Pixel-level preprocessing pipelines, beamforming algorithms, and image reconstruction kernels map efficiently onto the APEX II MultiCore architecture. The BGA-652 package's high I/O count accommodates parallel ADC interfaces from ultrasound transducer arrays. Long product lifecycles in medical imaging (15-20 years) make legacy FPGA families like APEX II economically attractive for incremental feature updates to existing equipment platforms. New medical imaging designs should consider Cyclone V or Stratix 10 with hardened DSP blocks and lower power consumption.
推荐
Industrial Control and Automation
The EP2A70B652C9's industrial temperature range and high logic density suit Programmable Logic Controller (PLC) and motion controller applications where deterministic, parallel processing of sensor inputs is required. The device's MultiCore architecture supports multiple independent control loops running concurrently with hardware-level determinism impossible in software PLCs. Embedded EAB memory provides local storage for control tables and state machines. APEX II was widely deployed in industrial motion controllers, CNC machines, and robotic systems in the 2000s and remains in service due to long equipment lifetimes. Designs requiring IEC 61508 SIL certification should consult the device's safety documentation carefully, as APEX II predates modern functional safety certification programs.
推荐
推荐产品汇总
工程参考数据： EP2A70B652C9 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2A70B652C8 | EP2A70B652C7 |
|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | BGA-652 | BGA-652 - same | BGA-652 - same |
| Family | APEX II | APEX II | APEX II |
| Logic Cells | 67,200 | 67,200 - same | 67,200 - same |
| Speed Grade | C9 | C8 (faster) | C7 (slower) |
| Logic Elements | ~70,000 | ~70,000 - same | ~70,000 - same |
| Core Voltage | 1.8 V | 1.8 V - same | 1.8 V - same |
| Lifecycle Status | Obsolete | Obsolete | Obsolete |
| Design Toolchain | Quartus II (legacy) | Quartus II (legacy) | Quartus II (legacy) |
关键差异点
- Mid-range speed grade offering balance of performance and availability （对比 EP2A70B652C8)
- Slower speed grade enables cost-effective sourcing for non-timing-critical designs （对比 EP2A70B652C7)
- Full BGA-652 I/O complement vs. lower-density APEX II parts （对比 EP2A40B652C9)
设计说明
The EP2A70B652C9 requires Altera/Intel Quartus II design software with explicit APEX II device support. Modern Quartus Prime releases do not include APEX II support; retain a Quartus II installation (version 13.0 or earlier with APEX II support enabled) for synthesis, place-and-route, and bitstream generation. Attempting to import APEX II designs into newer Quartus Prime releases will fail at the device-selection stage, so maintain version compatibility throughout the design flow.
Estimated: At typical APEX II utilization of 60-70% logic and 100 MHz operation, the EP2A70B652C9 dissipates approximately 2-4 W. The BGA-652 package requires careful PCB thermal design - implement at least 4 thermal vias in the BGA center array under the die and use a 4-layer PCB with a dedicated ground/power plane to spread heat. Add a heatsink or thermal pad interface for designs operating at >3 W continuous dissipation. The exact thermal resistance (theta_JB and theta_JA) is documented in the APEX II device family datasheet.
BGA-652 requires reflow soldering with precise temperature profiles (peak 245-260 C, ramp 2-3 C/s, soak 60-90 s) and PCB land patterns per IPC-7351 BGA guidelines. Stencil aperture design should use 0.4 mm solder balls with 0.5 mm paste apertures for proper joint formation. Under-fill is recommended for high-vibration or thermal-cycling applications (industrial, automotive). X-ray inspection after reflow is strongly recommended to verify joint integrity, as BGA-652 solder joints are inaccessible for visual inspection.
Multi-voltage I/O banks must have their VCCIO supplies decoupled with 0.1 uF ceramic capacitors placed within 5 mm of each supply pin, plus a bulk 10 uF tantalum or ceramic capacitor per bank. Differential pairs (LVDS) require 100 ohm differential impedance with matched trace lengths within 150 mil to maintain timing margin. Use the Quartus II pin planner and signal integrity tools to validate impedance and crosstalk before PCB fabrication. Bank-to-bank skew should be verified with the on-chip PLL configurations.
Configuration memory on the EP2A70B652C9 is SRAM-based and volatile; the bitstream must be loaded from a configuration ROM (EPC configuration device) on every power-up. Select an EPC configuration device sized for the EP2A70B652C9 bitstream (typically 4-8 Mbit depending on compression). Designs requiring instant-on behavior or fail-safe operation should consider a separate watchdog CPLD to supervise configuration. Do not assume the FPGA retains its configuration across power cycles.
合规信息
APEX II devices predate RoHS enforcement. RoHS/REACH/lead-free status not explicitly confirmed in available distributor data. Request declarations from distributor at time of quote. AEC-Q100 not applicable for commercial/industrial FPGA.
