EP2AGX65DF29I3G - Arria II GX FPGA 65K LE 780-FCBGA | Intel
料号： EP2AGX65DF29I3G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1250 | $1,250.00 |
| 10 | $1180 | $11,800.00 |
| 100 | $1095 | $109,500.00 |
| 500 | $990 | $495,000.00 |
| 1,000 | $895 | $895,000.00 |
EP2AGX65DF29I3G 概述
An FPGA (Field Programmable Gate Array) is a class of programmable logic device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon blocks such as transceivers, memory controllers, and DSP slices. In the broader taxonomy, FPGAs sit alongside CPLDs as programmable logic ICs, above fixed-function ASICs in design flexibility, and form the core of high-performance digital design for communications, video, and signal processing. The Arria II GX family is the mid-range transceiver-equipped node in the Arria II lineup, between Arria II GZ (high-end) and Cyclone IV (low-cost).
Key features of the EP2AGX65DF29I3G include up to 8 integrated 3.75 Gbps transceivers, 6.4 Gbps for -1 speed grade, dedicated hard IP for PCI Express Gen1 (x1/x4/x8) and a 2.5/3.125 Gbps external memory interface. The device supports DDR3, DDR2, DDR, QDRII+, and RLDRAMII memory standards, allowing high-bandwidth external memory integration. It also embeds hard IP for high-speed serial protocols.
Technically, the device is built on a 40nm process and uses 0.85V/1.1V core operation, with the I3 speed grade denoting an industrial temperature range. Configuration can be performed via JTAG, passive serial, fast passive parallel, or through Altera-supported EPCS/EPCQ configuration flash. The 780-FCBGA package provides 364 user I/Os and is a thermally enhanced fine-pitch BGA.
Typical applications include wireless baseband processing, high-speed serial protocol bridging, video broadcast equipment, and high-performance DSP. Designers select the EP2AGX65DF29I3G when they need integrated multi-gigabit transceivers with mid-range logic density and industrial temperature operation.
When designing, ensure proper PCB layout for BGA fan-out, thermal vias under the package, and a multi-rail decoupling network. Quartus II design software is required for synthesis, place-and-route, and bitstream generation. The I3 speed grade at industrial temperature is appropriate for thermally constrained environments where the -C6 commercial speed grade would not meet reliability targets.
This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes not found in the Altera/Intel Arria II GX datasheet, helping procurement and FPGA design teams evaluate drop-in and migration options.
直接替换替代料： EP2AGX65DF29I3G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2AGX65DF29I3G （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Operating Temperature, Mounting Type, Process Technology.
快速对比工具——选择替代料号进行并排对比：
EP2AGX65DF29C6N
✅ 直接替换✓ 有现货
$218.75 / 个
查看数据手册 →EP2AGX65DF29C6G
✅ 直接替换✓ 有现货
$245.3 / 个
查看数据手册 →EP2AGX65DF29C6
✅ 直接替换✓ 有现货
$440 / 个
查看数据手册 →EP2AGX65DF29I5G
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$689.49 / 个
查看数据手册 →EP2AGX45DF29I3G
✅ 直接替换✓ 有现货
$690 / 个
查看数据手册 →EP2AGX65DF29I3G 最大额定值与电气特性
| Series | Arria II GX |
| Family | Arria II |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 60,214 |
| Embedded Memory Bits | 5,371,904 |
| User I/Os | 364 |
| 封装 | 780-BBGA, FCBGA (29mm) |
| 工作温度 | -40C to +100C (Industrial, I3 speed grade) |
| Speed Grade | I3 |
| Transceivers | Up to 8 channels, 3.75 Gbps (I3 grade) |
| Core Voltage | 0.85V / 1.1V |
| Process Technology | 40nm TSMC |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Compliant |
| Configuration Mode | JTAG / Passive Serial / Fast Passive Parallel / EPCS/EPCQ flash |
EP2AGX65DF29I3G 780-bbga, fcbga (29mm) 引脚配置指南
EP2AGX65DF29I3G（780-bbga, fcbga (29mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2AGX65DF29I3G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2AGX65DF29I3G 适用于 6 应用s: Wireless Baseband Processing, High-Speed Serial Protocol Bridging, Video Broadcast Equipment, High-Performance DSP Pipelines, Industrial Control and Factory Automation, Software Defined Radio Front-End.
Wireless Baseband Processing
The EP2AGX65DF29I3G's 8 integrated 3.75 Gbps transceivers and 60,214 logic elements make it well-suited to wireless baseband processing in small-cell and picocell base stations. The device handles CPRI/OBSAI links to remote radio heads and runs the PHY/MAC layer logic in fabric. The 5.37 Mbit embedded memory buffers data between the transceiver and DSP slices, while the I3 industrial temperature grade supports outdoor and uncontrolled-environment deployments. Paired with a TI DAC38J84 or ADI AD9129 RF DAC and an RF front-end, the EP2AGX65DF29I3G forms the digital core of a multi-standard small-cell base station. Design tip: use the hard PCIe Gen1 IP for backhaul and reserve fabric for baseband.
推荐
High-Speed Serial Protocol Bridging
With up to 8 multi-gigabit transceivers, the EP2AGX65DF29I3G bridges high-speed serial protocols such as Serial RapidIO, Aurora, 10G Ethernet MAC, and CPRI. The 60,214 LEs provide the logic resources for protocol stacks, while the 364 user I/Os allow multiple parallel-side interfaces to ASICs, ASSPs, or backplane connectors. Industrial temperature operation makes the device suitable for telecom and industrial protocol-conversion cards. Typical deployment bridges between legacy RapidIO ASICs and modern 10G Ethernet switches in test and measurement backplanes.
推荐
Video Broadcast Equipment
The EP2AGX65DF29I3G's combination of 60,214 LEs, 5.37 Mbit embedded memory, and 364 I/Os handles HD/3G-SDI video processing pipelines, including de-interlacing, scaling, and frame-rate conversion. The transceivers carry SDI signals at 2.97 Gbps (3G-SDI) directly, eliminating external SDI PHY chips. Industrial temperature supports the broadcast equipment thermal envelope. The DF29 package provides sufficient I/O for parallel video bus interfaces (BT.1120, BT.656) and control plane. Common in broadcast routers, frame synchronizers, and up/down/cross-converters in studio and outside-broadcast (OB) vans.
推荐
High-Performance DSP Pipelines
The EP2AGX65DF29I3G includes dedicated DSP blocks that deliver high multiply-accumulate throughput for radar, medical imaging, and test/measurement DSP pipelines. With 60,214 LEs and 5.37 Mbit embedded memory, the device is sized for moderate-density fixed-point and floating-point DSP flows. Industrial temperature and the robust 40nm process technology make it suitable for harsh-environment DSP such as sonar beamforming and software-defined radio front-ends. Design tip: use the hard memory controller IP for external DDR3 buffer memory and reserve DSP blocks for FFT and FIR primitives.
推荐
Industrial Control and Factory Automation
The I3 industrial temperature grade (-40C to +100C) and 364 user I/Os make the EP2AGX65DF29I3G suitable for industrial control applications, including multi-axis motor controllers, PLCs, and machine vision processors. The transceiver channels handle EtherCAT, PROFINET IRT, or SERCOS III industrial Ethernet, while the fabric implements real-time motion control and safety logic. The BGA package and 0.85V/1.1V core operation are appropriate for sealed industrial enclosures with limited airflow. Common in servo drives, robotic controllers, and high-speed packaging machinery.
推荐
Software Defined Radio Front-End
The EP2AGX65DF29I3G's combination of 8 multi-gigabit transceivers and DSP blocks is well-suited to software-defined radio (SDR) front-end processing, including digital down-conversion (DDC), digital up-conversion (DUC), and channelization for wideband receivers. The 60K logic elements implement the DDC/DUC and packet processing, while the transceivers interface to high-speed ADCs and DACs. Industrial temperature supports outdoor and vehicle-mounted SDR deployments such as tactical communications and electronic warfare testbeds.
推荐
推荐产品汇总
工程参考数据： EP2AGX65DF29I3G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2AGX65DF29C6N | EP2AGX65DF29C6G | EP2AGX65DF29C6 | EP2AGX65DF29I5G | EP2AGX45DF29I3G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-BBGA, FCBGA (29mm) | 780-BBGA, FCBGA (29mm) - same | 780-BBGA, FCBGA (29mm) - same | 780-BBGA, FCBGA (29mm) - same | 780-BBGA, FCBGA (29mm) - same | 780-BBGA, FCBGA (29mm) - same |
| Logic Elements | 60,214 | 60,214 | 60,214 | 60,214 | 60,214 | 42,959 |
| Speed Grade | I3 | C6 | C6 | C6 | I5 | I3 |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| User I/Os | 364 | 364 | 364 | 364 | 364 | 364 |
| Transceivers | 8 ch, 3.75 Gbps (I3) | 8 ch, 3.75 Gbps (C6) | 8 ch, 3.75 Gbps (C6) | 8 ch, 3.75 Gbps (C6) | 8 ch, 3.75 Gbps (I5) | 8 ch, 3.75 Gbps (I3) |
关键差异点
- Industrial temperature operation with same pinout as commercial speed grade （对比 EP2AGX65DF29C6N)
- Higher logic density with same package and pin compatibility （对比 EP2AGX45DF29I3G)
- Integrated multi-gigabit transceivers eliminate external PHY chips （对比 CPLD-based solutions)
设计说明
The 780-FCBGA DF29 package uses 1.0mm ball pitch and requires 6+ layer PCB with 0.5 oz copper outer layers and 1 oz inner power/ground planes. Use a 0.2mm via-in-pad with filled and plated-over copper for the BGA breakouts. Place a continuous ground plane on layer 2 directly under the BGA to provide a low-impedance return path for high-speed transceivers. Add a thermal via array (0.3mm drill, 1.0mm pitch) under the die-attach pad to reduce junction-to-ambient thermal resistance. The 364 user I/Os and 8 transceiver channels generate significant simultaneous switching noise, so power-isolated (PI) and high-speed (HS) I/O bank placement must follow the Arria II GX pinout guidelines from the handbook.
Estimated thermal performance: with a 6-layer JEDEC-compliant test board, the FCBGA DF29 package has a theta-JA of approximately 8-10 C/W without airflow. At maximum core power of around 8W typical for an EP2AGX65 with 60K LEs and 8 transceivers at 3.75 Gbps, the junction temperature rise above ambient is about 64-80C. Industrial-grade operation (-40C to +100C junction) requires the ambient temperature to stay below 20-35C with no airflow, or 50-70C with 1.5 m/s forced airflow. For sealed enclosures, attach a heatsink via a thermal interface material to the package top and use a heat spreader if needed.
Common pitfalls: (1) Do not assume the C6 commercial speed grade can replace the I3 industrial grade in factory-floor designs; the operating temperature ranges differ and the C6 device will fail reliability screening above +85C. (2) The DF29 780-FCBGA and DF25 780-FCBGA are NOT drop-in compatible - they share the same pin count and family but have different ballmaps. Verify the PCB is laid out for the exact DF29 footprint before ordering. (3) When migrating from the EP2AGX45 (42,959 LEs) to the EP2AGX65 (60,214 LEs), the bitstream is incompatible; full re-synthesis and place-and-route in Quartus II is required. (4) Do not exceed the absolute maximum transceiver data rate at the I3 speed grade; 3.75 Gbps is the I3 ceiling, while the I5 and I6 grades support higher rates.
合规信息
RoHS compliant per Altera/Intel Arria II GX product page. Not AEC-Q100 qualified; the I3 industrial grade supports -40C to +100C operation but does not carry automotive PPAP documentation. Halogen-free status not explicitly stated in public datasheet - marked as unknown.
