EP2AGX95DF25C6G - Arria II GX FPGA 89K LE 572-FCBGA | Intel
料号： EP2AGX95DF25C6G ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $395 | $3,950.00 |
| 100 | $355 | $35,500.00 |
| 500 | $320 | $160,000.00 |
| 1,000 | $290 | $290,000.00 |
EP2AGX95DF25C6G 概述
A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, programmable I/O, and (in transceiver families such as Arria II GX) hardened multi-gigabit transceivers. Unlike a microcontroller, which executes sequential instructions, an FPGA realizes parallel digital logic through user-defined configuration bitstreams loaded into SRAM cells, with a hierarchy that places FPGAs as a class of programmable logic devices (PLD) within the broader semiconductor landscape.
Key technical features of the EP2AGX95DF25C6G include up to 6.375 Gbps transceiver data rate, 8-input adaptive logic module (ALM) architecture, dedicated on-chip memory blocks (M9K and M144K), variable-precision DSP blocks, and support for external memory interfaces including DDR3, DDR2, and QDRII+. The 'C' speed grade (commercial, 0C to 85C junction temperature range) and '6' speed bin make it the fastest commercial variant in the family.
Typical applications span high-speed serial interface bridging, telecom baseband processing, video broadcast and imaging pipelines, industrial control with real-time DSP, and military/aerospace subsystems where mid-range density and proven transceiver performance are required. The C6 grade is preferred over I6 when the design operates within commercial temperature and maximum clock/transceiver rates are required.
When designing with the EP2AGX95DF25C6G, careful attention must be paid to PCB layout for the 572-ball FCBGA: use microvia stack-up (typically 6 to 8 layers), controlled-impedance routing for transceiver channels, and decouple every VCC/VCCPD pin with 0.1 uF plus 10 uF bulk capacitance. Configuration can be loaded from an external flash via Active Serial (AS) or Fast Passive Parallel (FPP) modes.
This page synthesizes distributor pricing, drop-in same-family alternatives, application contexts, and PCB-layout design notes that go beyond the manufacturer datasheet, helping engineers decide whether the EP2AGX95DF25C6G is the correct Arria II GX speed grade and package for their design.
直接替换替代料： EP2AGX95DF25C6G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2AGX95DF25C6G （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Speed Grade, Embedded Memory Bits, Logic Elements.
快速对比工具——选择替代料号进行并排对比：
EP2AGX95DF25C5G
✅ 直接替换✓ 有现货
$768.9 / 个
查看数据手册 →EP2AGX95DF25C4G
✅ 直接替换✓ 有现货
$360 / 个
查看数据手册 →EP2AGX95DF25C6
✅ 直接替换📋 参考替代料（不在目录中）
EP2AGX95DF25C6G 最大额定值与电气特性
| Family | Arria II GX |
| Logic Elements (LE) | 89,178 |
| Adaptive Logic Modules (ALM) | 35,600 (estimated) |
| Embedded Memory Bits | 6,839,296 bits |
| Embedded Memory Type | M9K + M144K blocks |
| DSP Blocks | Variable-precision (estimated 88 to 176) |
| User I/O | 260 |
| Transceivers | Up to 12 channels |
| Transceiver Data Rate | Up to 6.375 Gbps |
| Hard Memory Controller | Yes (DDR3, DDR2, QDRII+) |
| PLL | Up to 8 (per family datasheet) |
| Process Node | 40 nm |
| 封装 | 572-ball FCBGA, 25x25 mm |
| Speed Grade | -6 (fastest commercial) |
| 工作温度 | 0C to 85C (commercial, junction) |
| Configuration Modes | AS, AP, FPP, PS, JTAG |
| RoHS 状态 | Compliant |
EP2AGX95DF25C6G 572-ball fcbga, 25x25 mm 引脚配置指南
EP2AGX95DF25C6G（572-ball fcbga, 25x25 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2AGX95DF25C6G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2AGX95DF25C6G 适用于 6 应用s: Telecom Baseband and Backhaul, PCIe Gen2 Endpoint Card, Industrial Video Broadcast and Imaging, High-Speed Test and Measurement Instrumentation, Military and Aerospace Ruggedized Subsystems, DSP-Intensive Signal Processing Front-End.
Telecom Baseband and Backhaul
The EP2AGX95DF25C6G's 12 hardened 6.375 Gbps transceivers and 89,178 logic elements make it well suited for telecom baseband processing and backhaul aggregation nodes. The C6 speed grade supports tight timing closure on CPRI (up to 4.915 Gbps) and OBSAI protocols, while the FCBGA-572 package exposes enough transceivers to fan out multiple SFP+ or QSFP cages. The on-chip DDR3 controller (up to 800 MHz) provides low-latency memory access for packet buffering. Designers typically pair the FPGA with a network processor or SoC, placing the EP2AGX95 between the SERDES PHYs and the host data plane. Transmit pre-emphasis and receive equalization are configurable per channel, enabling clean eye diagrams over FR-4 backplanes up to 30 cm at 6.375 Gbps.
推荐
PCIe Gen2 Endpoint Card
The EP2AGX95DF25C6G includes a hard PCIe Gen2 IP block that supports x1, x2, x4, and x8 lane configurations at 5 Gbps per lane. Combined with 89K logic elements, the device can implement a custom endpoint controller plus substantial user logic, such as a protocol accelerator, frame grabber front-end, or data-acquisition state machine. Designers typically route the PCIe lanes to a x8 edge-finger connector, providing 4 GB/s of host bandwidth. The C6 speed grade closes timing for x8 Gen2 designs comfortably. The FCBGA-572 package is pin-compatible across the EP2AGX45, EP2AGX65, EP2AGX95, and EP2AGX125 family members, enabling a single PCB layout to cover multiple SKUs based on density and cost targets.
推荐
Industrial Video Broadcast and Imaging
The 260 user I/O, 6.839 Mbit embedded memory, and variable-precision DSP blocks of the EP2AGX95DF25C6G are well matched to multi-channel SDI/HD-SDI/3G-SDI broadcast routers, medical imaging pre-processors, and machine-vision pipelines. Each 3G-SDI link requires about 3 Gbps of transceiver bandwidth; the 12 transceivers support 4 simultaneous 3G-SDI channels with headroom for audio/data embedding. The C6 speed bin enables real-time color space conversion and scaling at 1080p60. The commercial junction temperature range (0C to 85C) is adequate for indoor broadcast equipment but not for outdoor industrial installations; for those, choose the I-speed-grade variant. The FCBGA-572 package requires microvia HDI PCB technology, typically a 6 to 8 layer stack-up with controlled-impedance routing for the SDI traces.
推荐
High-Speed Test and Measurement Instrumentation
The EP2AGX95DF25C6G's 12 multi-gigabit transceivers and 89K logic elements fit naturally into protocol-aware test equipment such as 10 Gigabit Ethernet pattern generators, SATA/SAS analyzers, and custom serial-bus exercisers. Engineers can use the FPGA to capture multiple lanes simultaneously into external DDR3 memory, then post-process the traces in the on-chip DSP blocks. The C6 speed bin closes timing for 6.375 Gbps BERT patterns with margin. The commercial junction temperature is adequate for laboratory environments; for production-line fixtures, the I-speed grade may be preferred. JTAG-based configuration allows rapid bitstream swap during test bring-up, reducing iteration time during validation.
推荐
Military and Aerospace Ruggedized Subsystems
Arria II GX devices are widely used in military and aerospace subsystems, and the EP2AGX95DF25C6G is qualified for many vendor ruggedized SBCs. The 40 nm process and 572-ball FCBGA with underfilled solder balls support the mechanical shock and vibration profiles of MIL-STD-810. The 12 transceivers at 6.375 Gbps enable ARINC 818, SpaceWire, and custom high-speed serial links to FPGAs on adjacent cards. Designers typically select the EP2AGX95DF25C6G as the C6 commercial speed grade for ground-based systems; for airborne or space applications, the corresponding I- or M-grade parts are chosen. Conformal coating and underfill on the FCBGA are standard at the board-assembly level for harsh environments.
推荐
DSP-Intensive Signal Processing Front-End
The variable-precision DSP blocks in the EP2AGX95DF25C6G support 9x9, 18x18, and 27x27 multiplier modes, enabling efficient implementation of FIR filters, FFTs, and digital downconverters. The 89K logic elements plus the embedded memory allow multi-channel digital pre-distortion (DPD) paths in small-cell base stations, or multi-antenna beamforming in phased-array radar pre-processors. The C6 speed grade supports up to 300 MHz DSP block operation, which is sufficient for LTE 20 MHz channel bandwidth. The 6.839 Mbit of on-chip memory is split between M9K (small, distributed) and M144K (large, block) resources, allowing designers to balance lookup tables and line buffers efficiently.
推荐
推荐产品汇总
工程参考数据： EP2AGX95DF25C6G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2AGX95DF25C5G | EP2AGX95DF25C4G | EP2AGX95DF25C6 |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 572-ball FCBGA (25x25 mm) | 572-ball FCBGA (25x25 mm) - same | 572-ball FCBGA (25x25 mm) - same | 572-ball FCBGA (25x25 mm) - same |
| Logic Elements | 89,178 | 89,178 | 89,178 | 89,178 |
| Speed Grade | C6 (fastest commercial) | C5 (mid-tier commercial) | C4 (slowest commercial) | C6 (fastest commercial) |
| Transceivers | Up to 12 | Up to 12 | Up to 12 | Up to 12 |
| Transceiver Data Rate | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
| User I/O | 260 | 260 | 260 | 260 |
| Embedded Memory | 6.839 Mbit | 6.839 Mbit | 6.839 Mbit | 6.839 Mbit |
| Operating Temperature | 0C to 85C (commercial) | 0C to 85C (commercial) | 0C to 85C (commercial) | 0C to 85C (commercial) |
| Approx. Unit Price (USD, qty 1) | 425.00 | 370.00 | 320.00 | 425.00 |
关键差异点
- Fastest commercial speed grade in the same 25x25 mm FCBGA-572 footprint （对比 EP2AGX95DF25C5G)
- Pin-compatible upgrade path to higher-density EP2AGX125 in the same FCBGA-572 （对比 EP2AGX125DF25C6G)
- RoHS-compliant / lead-free Pb-free finish （对比 EP2AGX95DF25C6 (non-RoHS suffix))
设计说明
The 572-ball FCBGA (25x25 mm) package uses 1.0 mm ball pitch, which requires microvia HDI PCB technology. Use a 6- to 8-layer stack-up with laser-drilled microvias for inner-row escape. Assign dedicated ground and power planes directly under the BGA, and stitch them with a via grid (one ground via per 2-3 signal vias) to provide low-inductance return paths. Maintain 50 ohm single-ended or 100 ohm differential controlled impedance for the transceiver channels; use an EM field solver (Si9000, Polar Si8000) to compute trace geometry rather than relying on rule-of-thumb numbers.
Estimated: at 50% resource utilization and 6.375 Gbps transceiver operation, the EP2AGX95DF25C6G core current is approximately 3-4 A from a 0.9V VCCINT rail, plus 1-2 A from the 1.5V and 1.8V VCCPD rails, plus transceiver analog supplies. Decouple every VCC/VCCPD pin with a 0.1 uF MLCC placed within 50 mil of the via, and place 4-8 bulk 47-100 uF polymer or ceramic capacitors on the back side of the BGA. Sequence the rails with a multi-rail power controller such as the LTC2977 to avoid latch-up during ramp.
Transceiver channel length matching must be within 25 mil for 6.375 Gbps to meet the Altera Arria II GX channel skew budget. Route each TX/RX pair as broadside-coupled differential strips, with a continuous reference plane on layer 2 and 5; avoid routing across plane splits or voids. Place the MGT reference clock buffer within 1000 mil of the FPGA clock pins, and route the reference clock as a 100 ohm differential pair with length matched to the data lanes to within 50 mil. The PLL decoupling (0.1 uF + 0.01 uF at the PLL supply pin) is critical for jitter performance.
Do not use the EP2AGX95DF25C6G for new production designs in 2026 or beyond - Intel has placed the Arria II GX family on NRND and recommends migrating to Cyclone V GX or Arria V GX. For new designs, the Cyclone V GX family offers a 28 nm process, lower static power, and pin-compatible upgrade paths via the 5CGXFC7C7F23C8N footprint. Existing in-production designs should secure a multi-year inventory buffer from authorized distributors and a last-time-buy commitment before the family reaches EOL.
合规信息
RoHS compliance indicated by 'G' suffix in MPN per Altera/Intel datasheet. Reach compliance per EU SVHC declarations. Not AEC-Q100 qualified - this is a commercial-grade FPGA. Halogen-free status not explicitly stated in the provided datasheet excerpt.
