EP2C20F256C6 - 18,752 LEs, 500 MHz, 256-LBGA FPGA | Intel
料号： EP2C20F256C6 ✗ 停产EP2C20F256C6 概述
A field-programmable gate array is a semiconductor in which the digital circuit is defined after manufacture. An FPGA belongs to the programmable-logic hierarchy, where configurable logic, block memory, and programmable I/O replace a fixed combination of gates, counters, interfaces, and memory. The Cyclone II architecture provides a practical alternative to custom ASICs when logic must be revised quickly, prototypes must be produced in small volumes, or board-level parallelism is needed.
The EP2C20F256C6 combines a 500 MHz device operating point with 18,752 logic elements and 152 user I/O in a 256-LBGA package. Its 234 kbit of embedded memory supports data buffering, lookup tables, packet handling, and state-machine storage. The 1.2 V core supply supports modern FPGA clocking and logic operations, while 152 I/O provide substantial connectivity for buses, memory interfaces, clock inputs, control signals, and external data acquisition.
Cyclone II devices use programmable logic technology for flexible hardware implementation. Engineers can configure parallel datapaths, protocol bridges, state machines, counters, and control logic in one integrated device. The EP2C20F256C6 is positioned for designs requiring more logic and I/O than small CPLDs while retaining a relatively compact 256-ball package for board integration.
Typical uses include industrial control and automation, communications infrastructure, test and measurement, embedded instrumentation, audio and signal-processing front ends, and general-purpose digital prototyping. Its 18,752 logic elements can distribute independent functions across parallel channels, while embedded memory can support buffering and lookup operations close to the logic that consumes the data.
Design planning should account for the 256-LBGA footprint, ball assignment, power distribution, decoupling, clock routing, and programmed I/O constraints. Existing Quartus II-compatible designs and tool flows should be checked against the exact device speed grade and package before production release. Because the Cyclone II family has reached end of production, long-term availability and redesign planning require particular attention.
This page consolidates device specifications, lifecycle considerations, same-package alternatives, comparison parameters, and practical replacement guidance. It is intended to help engineers evaluate EP2C20F256C6 sourcing, board compatibility, and migration planning without overlooking device-speed, temperature, or package distinctions.
直接替换替代料： EP2C20F256C6 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2C20F256C6 （相同外形与封装尺寸） ——差异在于 Process Technology, Package, Total RAM Bits, Speed Grade, Mounting Type.
EP2C20F256C6N
✅ 直接替换联系询价
查看数据手册 →EP2C20F256C7
✅ 直接替换联系询价
查看数据手册 →EP2C20F256C7N
✅ 直接替换联系询价
查看数据手册 →EP2C20F256C8
✅ 直接替换联系询价
查看数据手册 →EP2C20F256I8
✅ 直接替换联系询价
查看数据手册 →EP2C20F256I8N
✅ 直接替换联系询价
查看数据手册 →EP2C20F256C6 最大额定值与电气特性
| Device Type | Cyclone II field-programmable gate array (FPGA) |
| Logic Elements | 18,752 LE |
| Maximum Frequency | 500 MHz |
| Embedded Memory | 234 kbit (239,616 bit) |
| User I/O | 152 I/O |
| Core Supply Voltage | 1.2 V |
| Process Technology | 90 nm |
| 封装 | 256-LBGA (FBGA-256) |
| Total Terminals | 256 terminals |
| Package Shape | Square |
| Terminal Form | Ball |
| 安装类型 | Surface mount |
| Programmable Logic | 18,752 configurable logic elements |
| Product Series | Cyclone II (EP2C20) |
| Device Classification | Field-programmable gate array |
EP2C20F256C6 square 引脚配置指南
EP2C20F256C6（square 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2C20F256C6.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2C20F256C6 适用于 6 应用s: Industrial Control and Automation, Communications and Protocol Bridging, Test and Measurement Instrumentation, Signal Processing Front Ends, Embedded Data Acquisition, Legacy System Modernization.
Industrial Control and Automation
The EP2C20F256C6 fits industrial control systems that combine parallel logic, clocked state machines, and multiple external interfaces. Its 18,752 logic elements can host sequencing logic, interlocks, counters, and data-processing functions, while 234 kbit of embedded memory supports local buffering and lookup tables. The 152 I/O provide substantial connectivity for sensors, actuators, operator interfaces, and communications. The 256-LBGA package also supports compact board layouts, although power, thermal, and signal-integrity planning remain essential in industrial equipment.
推荐
Communications and Protocol Bridging
The EP2C20F256C6 can implement protocol converters, framing logic, packet filters, and multi-channel interface controllers when deterministic parallel processing is valuable. Its 18,752 logic elements can support transmit and receive state machines concurrently, and the 234 kbit embedded memory can hold descriptors, buffers, or lookup data. With 152 I/O, the device can connect multiple buses and clock domains on one FPGA. Designers must still verify protocol timing against the 500 MHz device limit and review I/O standards supported by the exact package and speed grade.
推荐
Test and Measurement Instrumentation
The EP2C20F256C6 is suitable for programmable counters, timing engines, acquisition sequencers, waveform logic, and embedded measurement controllers. Parallel logic can coordinate several acquisition channels, while embedded memory can capture intermediate samples before transfer to a host interface. Its 500 MHz maximum frequency is useful for timing-oriented logic, but actual performance depends on routing, I/O standards, and the design’s timing closure. The 256-LBGA footprint requires careful ball escape routing and a multilayer power and ground plan.
推荐
Signal Processing Front Ends
The EP2C20F256C6 can implement digital filtering, correlation, decimation, peak detection, and data-conditioning pipelines because 18,752 logic elements support parallel datapaths. The 234 kbit embedded memory can hold coefficient, history, or sample data close to the processing logic, reducing pressure on external memory for moderate workloads. Its 152 I/O allow several converters or sensors to feed parallel processing channels. Clock-domain crossings, pipeline latency, I/O timing, and resource-sharing decisions must be evaluated in the target design.
推荐
Embedded Data Acquisition
The EP2C20F256C6 can act as a central acquisition controller by coordinating sensors, memory interfaces, digital filters, and host communication paths. The device provides 152 I/O for parallel sensor channels and control signals, while 234 kbit of embedded memory can serve as line buffers, descriptor storage, or intermediate sample storage. A 500 MHz maximum frequency supports demanding control logic, although sustained system throughput still depends on external memory bandwidth and pin-rate limitations. Board-level decoupling and trace routing are especially important around the 1.2 V core supply.
推荐
Legacy System Modernization
The EP2C20F256C6 is relevant when maintaining a legacy Cyclone II board whose programmed logic, 256-LBGA layout, and Quartus-era interfaces cannot be changed immediately. It provides 18,752 logic elements, 234 kbit of embedded memory, and 152 I/O for reproducing existing control, interface, and timing behavior. A same-package grade change can simplify procurement only after pin, timing, temperature, and ordering checks. For long-lived new products, migration to a supported FPGA family should also be evaluated because Cyclone II production has ended.
推荐
推荐产品汇总
工程参考数据： EP2C20F256C6 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2C20F256C6N | EP2C20F256C7 | EP2C20F256C8 | EP2C20F256I8 | EP2C20F256I8N | |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | |
| Package | 256-LBGA (FBGA-256) | 256-LBGA (FBGA-256) | 256-LBGA (FBGA-256) | 256-LBGA (FBGA-256) | 256-LBGA (FBGA-256) | 256-LBGA (FBGA-256) | |
| Series | Cyclone II EP2C20 | Cyclone II EP2C20 | Cyclone II EP2C20 | Cyclone II EP2C20 | Cyclone II EP2C20 | Cyclone II EP2C20 | |
| Logic Elements | 18,752 LE | 18,752 LE | 18,752 LE | 18,752 LE | 18,752 LE | 18,752 LE | |
| Ordering Grade | C6 | C6N lead-free ordering code | C7 speed grade | C7N speed and lead-free ordering code | C8 speed grade | I8 industrial temperature grade | I8N industrial temperature and lead-free ordering code |
关键差异点
- C6 grade provides the stated 500 MHz device operating point （对比 EP2C20F256C7)
- Same 18,752 LE and 234 kbit resource base supports design-specific grade changes （对比 EP2C20F256C6N)
- Industrial-grade option addresses environmental requirements （对比 EP2C20F256C6)
设计说明
Treat the 256-LBGA footprint as a complete escape-routing problem rather than an edge-connected package. Assign power, ground, configuration, clock, and user I/O according to the manufacturer pin-description table before schematic capture. Use multiple layers for high-speed or parallel buses, avoid splitting ground planes beneath the device, and preserve the manufacturer’s ball and via recommendations so signal and power return paths remain continuous.
Plan the 1.2 V core rail as a dedicated power domain and decouple it according to the manufacturer’s recommended capacitance and placement. Separate noisy external I/O supply paths from sensitive core distribution where the board architecture permits. Check voltage tolerance, sequencing, configuration behavior, and power-loss requirements in the device documentation before finalizing the regulator and load-switch design for this 256-ball package.
Do not treat a same-package suffix change as automatically safe. Compare EP2C20F256C6 against the candidate’s speed grade, temperature grade, timing tables, I/O limits, and ordering code. Re-run synthesis, place-and-route, and timing analysis with the exact device selected, and inspect all configuration pins after substitution. A successful schematic and footprint comparison does not by itself establish timing equivalence.
Estimate junction temperature from the device’s actual core and I/O dissipation rather than the 500 MHz headline frequency alone. Use the manufacturer thermal model and the package thermal data for the exact assembly and board construction. An FPGA’s activity level, I/O switching, and core utilization can materially change heat, so maintain copper spreading paths and avoid enclosing the 256-LBGA device without a verified thermal strategy.
Assign clocks and high-speed interfaces according to the Cyclone II device and package recommendations, and review timing closure for every affected clock domain. Keep external clock inputs and sensitive interfaces away from aggressive switching outputs where practical. If migrating from another FPGA family, preserve equivalent I/O standards and impedance control because a shared FBGA-256 outline alone does not guarantee equivalent electrical behavior.
合规信息
The EP2C20F256C6N ordering variant is identified as lead-free, but the exact declarations for EP2C20F256C6 require confirmation from current manufacturer or authorized-channel documentation. No AEC-Q100 qualification is indicated for this industrial FPGA.
