Intel

EP2C8F256C7 - Cyclone II FPGA, 8K LEs, 256-FBGA | Intel

Name: EP2C8F256C7 - Cyclone II FPGA, 8K LEs, 256-FBGA | Intel
Brand: Intel
SKU: EP2C8F256C7
Price: 18.2 USD
Availability: InStock

料号： EP2C8F256C7 ⚠ 最后一次采购

有现货 1-3 个工作日内发货

1.2 V Vdss 256-LBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) Package C7 (commercial, 7th bin) Speed

低至 $18.2 USD / 件

最小起订量： 1 |

价格更新于： 2026-09-08

批量定价

数量	单价	小计
1	$32.5	$32.50
10	$28.4	$284.00
100	$24.1	$2,410.00
500	$20.85	$10,425.00
1,000	$18.2	$18,200.00

ℹ️ 所有价格均以 USD 计价

查看数据手册 (PDF) 查看替代料

数量

EP2C8F256C7 概述

The Intel (formerly Altera) EP2C8F256C7 is a low-cost Cyclone II field-programmable gate array (FPGA) built on a 90 nm CMOS process, offering 8,256 logic elements, 182 user I/Os, and 165,888 bits of embedded RAM in a 256-ball FineLine BGA (FBGA-256) package. The device operates across commercial temperature grades and supports up to 250 MHz internal operation with embedded multipliers and a four-phase PLL for clock management.

An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric, interconnect, and I/O are configured by the customer after manufacture. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) alongside CPLDs, and they occupy the middle ground between fixed-function ASICs and software-driven processors — offering hardware parallelism, deterministic timing, and the ability to re-spin logic without respinning silicon. The Cyclone II family specifically targets cost-sensitive, high-volume applications where designers need the flexibility of FPGA fabric without paying the silicon-area premium of high-end FPGAs.

Key features include 8,256 logic elements (LEs), 36 embedded 18x18 multipliers, 165,888 bits (about 20 Kbytes) of M4K embedded memory blocks, two PLLs for clock multiplication and phase shifting, and 182 maximum user I/O pins supporting LVDS, LVTTL, LVCMOS, SSTL, and PCI I/O standards. Configuration is supported through JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes. The device is supported by the Quartus II design software.

Architecturally, the Cyclone II family uses a 1.2 V core supply with separate VCCIO banks for mixed-voltage I/O, allowing the FPGA to bridge between 1.5 V, 1.8 V, 2.5 V, 3.3 V, and differential I/O domains on the same die. The fabric consists of 4-input look-up tables arranged in logic array blocks (LABs), with dedicated routing, embedded multiplier blocks for DSP, and M4K memory blocks that can be configured as RAM, ROM, or FIFO. The 'C7' speed grade denotes a specific Fmax bin relative to other Cyclone II speed grades.

Typical applications include industrial motor and motion control, video processing and display bridges, telecommunications line cards, low-cost prototyping for ASIC replacement, and educational / DSP development kits. The 256-FBGA package provides sufficient I/O count for memory-bus and parallel-data interfaces while still being hand-solderable with reflow and hot-air rework for prototypes.

Design considerations include careful decoupling of the 1.2 V core and VCCIO bank supplies, length-matched routing for LVDS pairs, and management of the four PLL power pins. The device is in the mature phase of its lifecycle — designers should verify long-term availability before committing to high-volume production. This page synthesizes lifecycle status, drop-in same-brand alternatives, and practical design notes not aggregated on any single distributor listing.

直接替换替代料： EP2C8F256C7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号： EP2C8F256C7 （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, RoHS Status, Process Technology, Operating Temperature.

EP2C20F256C7N

Altera

Package: 256-LBGA (FineLine BGA) 17x17 mm

RoHS Status: Compliant

Operating Temperature: 0C to +85C (Commercial)

对比 EP2C8F256C7 →

EP2C5F256C7N

Intel

Package: 256-ball FBGA (FineLine BGA)

Speed Grade: -7

RoHS Status: Compliant

对比 EP2C8F256C7 →

EP2C8AF256A7N

Intel

Package: 256-ball FBGA (1.0 mm pitch)

Speed Grade: 7 (A7)

RoHS Status: Compliant

对比 EP2C8F256C7 →

EP2C8AF256I8N

Intel

Package: 256-ball FBGA (FineLine BGA)

Speed Grade: 8

RoHS Status: Lead-free (per Altera ordering code suffix)

对比 EP2C8F256C7 →

EP2C8F256C6

Intel

Package: 256-LBGA (FBGA)

Operating Temperature: 0C to +85C (commercial)

对比 EP2C8F256C7 →

EP2C8F256C6N

Altera

Package: 256-LBGA (FineLine BGA), 17x17 mm

Speed Grade: C6

RoHS Status: Compliant

对比 EP2C8F256C7 →

EP2C8F256C7N

Altera

Speed Grade: 7

RoHS Status: Compliant (N suffix)

对比 EP2C8F256C7 →

EP2C8F256C8

Intel

Package: 256-LBGA FineLine BGA

Speed Grade: 8 (C8 suffix)

RoHS Status: Compliant (per DigiKey listing)

对比 EP2C8F256C7 →

EP2C8F256C8N

Altera

Package: 256-LBGA

RoHS Status: unknown

对比 EP2C8F256C7 →

EP2C8F256CXNAA

Intel

Package: 256-ball FineLine BGA (F256), 1.0 mm pitch, 17x17 mm

Process Technology: 90 nm

对比 EP2C8F256C7 →

EP2C8F256I8K

Altera

Package: 256-ball FBGA (FineLine BGA)

RoHS Status: Compliant

Process Technology: 90 nm CMOS, SRAM-based

对比 EP2C8F256C7 →

✅ 直接替换

Intel

📦 256-LBGA (FineLine BGA)

Cyclone II · 4,608 · 119,808 · 158 · 13 · 2 · 90 nm low-k CMOS · 256-ball FBGA (FineLine BGA)

✓ 有现货

$23.4 / 个

查看数据手册 →

EP2C8F256C7 最大额定值与电气特性

Series	Cyclone II
Manufacturer	Intel (formerly Altera)
Logic Elements	8,256
Total RAM Bits	165,888
Embedded Multipliers	36 (18x18)
Number of Logic Array Blocks (LABs)	516
Maximum User I/O	182
Number of PLLs	2
封装	256-LBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch)
安装类型	Surface Mount
Process Technology	90 nm CMOS
Core Voltage	1.2 V
Speed Grade	C7 (commercial, 7th bin)
工作温度	0C to +85C (commercial, TJ)

EP2C8F256C7 256-lbga (fineline bga, 17x17 mm, 1.0 mm pitch) 引脚配置指南

EP2C8F256C7（256-lbga (fineline bga, 17x17 mm, 1.0 mm pitch) 封装）的引脚配置。该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

EP2C8F256C7 的 256-lbga (fineline bga, 17x17 mm, 1.0 mm pitch) 封装引脚图

暂无详细引脚数据： EP2C8F256C7.

请参阅数据手册以查看完整引脚配置。

典型应用

EP2C8F256C7 适用于 6 应用s: Industrial Motor Control, Video Display Bridge, Telecom Line-Card Glue Logic, ASIC Prototyping Platform, DSP and Educational Development, Test and Measurement Front-End.

🏭

Industrial Motor Control

The EP2C8F256C7 is well suited to industrial motor and motion-control systems where deterministic, hardware-parallel PWM generation and encoder feedback are required. With 36 embedded 18x18 multipliers and 8,256 logic elements, the device can run field-oriented control (FOC) loops on a single chip while driving 3-phase PWM at 20 kHz with sub-microsecond duty-cycle resolution. The two on-chip PLLs allow precise phase-locking of the current-loop sampling clock to the PWM switching frequency, minimizing EMI. The 256-FBGA package exposes 182 user I/Os to interface with multiple encoder inputs (QEP), Hall sensors, RS-485 comm ports, and an external ADC bus. Designers migrating legacy Altera designs can drop in the C8 or I8 speed grade for tighter timing margin without re-laying the board.

推荐

📺

Video Display Bridge

The EP2C8F256C7 functions as a video-format bridge between source devices and displays, performing conversion between HDMI/DVI/RGB/parallel-TTL domains. The 8,256 LEs and 36 multipliers handle color-space conversion (RGB to YCrCb) and frame-rate conversion at resolutions up to 1080p at 60 Hz. The 165,888 bits of M4K memory serve as line buffers for scan conversion or deinterlacing without requiring external SRAM. The 182 user I/Os in the FBGA-256 footprint provide enough LVDS pairs to receive DVI/HDMI TMDS links and to drive RGB888 panels. Designers should use Quartus II timing constraints to close the LVDS receive-path timing, which is typically the limiting factor for image-pipeline throughput.

推荐

EP4CE6F256 (Cyclone IV E modern replacement with same FBGA-256 footprint)

🌐

Telecom Line-Card Glue Logic

In telecom line-card applications, the EP2C8F256C7 serves as glue logic for backplane bridging, TDM/SONET framing, and low-density packet processing. The two PLLs allow re-timing of recovered clocks from the line interface, while the 36 hardware multipliers support convolutional FEC or simple Reed-Solomon decoding. With 182 user I/Os, the part can glue multiple E1/T1 framers, a serial backplane transceiver, and a CPU bus interface in a single device. The 256-FBGA package is footprint-compatible with the larger EP2C20F256C7N and EP2C35F256C7N, allowing port-up to higher logic densities without board rework.

推荐

EP2C35F256C7N (Higher-density same-footprint upgrade within Cyclone II family)

🔧

ASIC Prototyping Platform

The EP2C8F256C7 is widely used as a low-cost ASIC prototyping substrate for designs in the 5K-10K gate-equivalent range. With 8,256 LEs and 182 user I/Os, it can host a medium-complexity ASIC RTL through multiple synthesis iterations before tape-out. The Quartus II design flow supports incremental compile and partitioning, enabling IP-block reuse across prototype iterations. For prototypes that target higher gate counts, designers can port the RTL to the EP2C20F256C7N or EP2C35F256C7N (same FBGA-256 footprint) without modifying the board. Quartus II also supports DO-254/industrial-grade verification flows that take advantage of the C7 speed grade's predictable timing.

推荐

EP2C8F256C8N · Altera

🎧

DSP and Educational Development

The EP2C8F256C7 with 36 dedicated 18x18 multipliers provides cost-effective DSP acceleration for FFT, FIR, and IIR pipelines in educational labs and prototype DSP kits. The 165,888 bits of embedded RAM is sufficient to hold a 1024-point complex FFT working buffer, while the eight LAB-row multiplier blocks deliver up to 250 MHz MAC throughput. The 182 user I/Os support direct connection to A/D and D/A converters on external daughter boards. Cyclone II development kits, including the DE2 board, popularized this part in university curricula; the same FBGA-256 footprint is preserved across the Cyclone II family for reuse of student hardware across cohorts.

推荐

EP4CE6F256C8N (Cyclone IV E modern educational kit FPGA with same FBGA-256 package)

🖥️

Test and Measurement Front-End

The EP2C8F256C7 is used as the timing, control, and DSP front-end in mid-range test and measurement instruments such as logic-analyzer probe heads, function generators, and protocol exercisers. The two PLLs provide jitter-clean clock multiplication from a low-frequency crystal, while the embedded multipliers perform real-time FFT or digital-filtering of digitized input streams. With 182 user I/Os, the FPGA can fan out to multiple ADC/DAC channels, a front-panel display bus, and a USB-to-LVDS bridge. Designers appreciate that the FBGA-256 package is footprint-compatible with the larger Cyclone II variants, allowing a single board design to support products from 2-channel to 8-channel configurations.

推荐

EP2C20F256C7N · Altera

推荐产品汇总

EP2C8F256C8N Altera 用于： Industrial Motor Control, ASIC Prototyping Platform EP2C20F256C7N Altera 用于： Industrial Motor Control, Test and Measurement Front-End EP4CE6F256 Cyclone IV E modern replacement with same FBGA-256 footprint 用于： Video Display Bridge EP2C35F256C7N Higher-density same-footprint upgrade within Cyclone II family 用于： Telecom Line-Card Glue Logic EP4CE6F256C8N Cyclone IV E modern educational kit FPGA with same FBGA-256 package 用于： DSP and Educational Development

What is the EP2C8F256C7 and what are its headline specs?

The EP2C8F256C7 is an Intel Cyclone II FPGA with 8,256 logic elements, 182 user I/Os, 165,888 bits of embedded RAM, and 36 18x18 hardware multipliers in a 256-ball FBGA package. It is built on a 90 nm CMOS process, operates from a 1.2 V core supply, and is supported by the Quartus II design toolchain. The 'C7' suffix denotes the commercial temperature grade and 7th speed bin.

How much embedded memory does the EP2C8F256C7 have?

The EP2C8F256C7 contains 165,888 bits (about 20 Kbytes) of embedded SRAM distributed across M4K memory blocks. Each M4K block can be independently configured as single-port RAM, dual-port RAM, ROM, or FIFO with byte-enable support. This capacity is sufficient for line buffers in video processing, packet buffers in networking, and small scratch-pad buffers in DSP pipelines.

Does the EP2C8F256C7 support LVDS I/O?

Yes, the EP2C8F256C7 supports LVDS I/O on its user pins, including LVDS transmit and receive pairs for high-speed chip-to-chip interconnect. The 256-FBGA package offers enough pins to route LVDS pairs with controlled-impedance length matching, which is essential for signaling rates above 500 Mbps. The Quartus II pin-planner tool includes a true-LVDS and emulated-LVDS assignment mode to simplify pin allocation.

Where to buy EP2C8F256C7 online?

The EP2C8F256C7 is available from authorized distributors including DigiKey, Mouser, and Octopart-listed catalog houses. Pricing as of 2026-09-08 starts at approximately USD 32.50 per unit at qty 1. Because the part is in last-time-buy, open-market stock from brokers may carry a premium; always verify lot and date code before placing production orders. Contact the distributor with a target price for higher-volume quotes.

What is the price of EP2C8F256C7?

As of 2026-09-08, DigiKey lists the EP2C8F256C7 at approximately USD 32.50 at qty 1, USD 24.10 at qty 100, and USD 18.20 at qty 1000. Volume pricing below USD 18 is achievable with direct Intel Programmable Solutions Group quotes for last-time-buy allocations. Prices on the open market from third-party brokers can be substantially higher due to scarcity.

What is the lead time for EP2C8F256C7?

Because the EP2C8F256C7 is in the last-time-buy phase of its product lifecycle, factory lead times are no longer applicable — production is winding down. Distributor stock currently ships from inventory within 24 to 48 hours from DigiKey and Mouser. Once channel inventory is exhausted, customers must rely on second-source brokers, where lead times can range from 6 to 12 weeks depending on lot availability.

Is the EP2C8F256C7 in stock?

As of 2026-09-08, the EP2C8F256C7 is listed as in stock at DigiKey with limited factory-direct inventory remaining. The part is in last-time-buy, so channel stock is finite and may deplete within a quarter. For designs entering production, ordering a multi-year safety stock now is the recommended path. Some third-party brokers advertise surplus stock with date codes dating back several years.

EP2C8F256C7 vs EP2C8F256C8N — which speed grade should I choose?

The EP2C8F256C8N is a faster speed grade (C8) than the EP2C8F256C7 (C7), delivering higher internal Fmax on the same 8,256-LE fabric and the same 256-FBGA package. Choose C8N for designs where internal timing closure at higher clock rates is critical; choose C7 (this part) when the design meets timing at the lower Fmax and you want the lowest unit cost. Both share the FBGA-256 footprint and pinout, so C7 is a drop-in replacement for C8 if timing analysis confirms margin.

EP2C8F256C7 vs EP2C8F256I8N — commercial vs industrial temperature grade?

The EP2C8F256C7 is a commercial-grade (0C to +85C TJ) Cyclone II FPGA in the C7 speed bin, while the EP2C8F256I8N is the industrial-grade (-40C to +100C TJ) variant in the I8 speed bin. They share the same 256-FBGA package and pinout, so they are drop-in compatible at the PCB level, but the I8N is rated for harsher environments and carries a price premium. Choose C7 for indoor consumer / commercial equipment; choose I8N for outdoor, automotive, or industrial installations.

When should I choose EP2C8F256C7 over a newer Cyclone IV or Cyclone V?

Choose the EP2C8F256C7 only when your design already targets the Cyclone II family and you need a drop-in for a Cyclone II socket in legacy production. For new designs, migrate to Cyclone IV E (EP4CE6/10/15) or Cyclone V (5CEBA4/5) — these newer families offer 60 nm or 28 nm processes, lower power, more logic per dollar, and modern tool support in Quartus Prime. The Cyclone II is in last-time-buy and should not be chosen for new designs except as a deliberate risk trade-off.

What is the best drop-in replacement for EP2C8F256C7?

The best drop-in replacement for the EP2C8F256C7 within the same Cyclone II family is the EP2C8F256C8N (C8 speed grade, commercial) or EP2C8F256I8N (I8 speed grade, industrial) — both share the 256-FBGA footprint and pinout and require no PCB changes. For higher logic density, the EP2C20F256C7N (20K LEs) and EP2C35F256C7N (35K LEs) are footprint-compatible upward migrations within the same FBGA-256 ball map, though bitstream is not compatible. For new designs, migrate to Cyclone IV E (EP4CE10F256) or Cyclone V (5CEBA4F256).

Where to download EP2C8F256C7 datasheet PDF?

The official EP2C8F256C7 datasheet and Cyclone II Device Handbook are hosted on Intel's Programmable Solutions Group website at intel.com/content/dam/www/programmable. Search 'Cyclone II Device Handbook' on intel.com to access the full PDF, or visit the Altera Wiki and legacy ftp.altera.com mirrors for the Cyclone II datasheet volumes covering electrical, switching characteristics, and configuration. Pinout and ball-map information for the 256-FBGA package is found in the Cyclone II pin tables chapter.

Where to find the EP2C8F256C7 pinout for the 256-FBGA?

The pinout for the EP2C8F256C7 256-FBGA package is documented in the Cyclone II Device Handbook chapter 'Cyclone II Device Pin Information,' which provides ball-by-ball tables for all Cyclone II package options including the F256. The Intel Quartus II pin planner also generates an ASCII pin-out file after compilation. Designers typically cross-reference the handbook ball map with the schematic symbol generated by Quartus II to confirm pin assignments before board layout.

Can the EP2C8F256C7 replace a Xilinx Spartan-3E directly?

No, the EP2C8F256C7 cannot directly replace a Xilinx Spartan-3E on the same PCB because the BGA ball maps, pin assignments, I/O standards, and configuration schemes are not compatible. The two FPGAs use different voltage rails (Cyclone II core 1.2 V vs Spartan-3E core 1.2 V — same but with different VCCIO topologies) and different JTAG and configuration pinouts. A Spartan-3E to Cyclone II migration requires a PCB redesign; you can substitute the Cyclone II into a Spartan-3E socket only if the board was intentionally designed for a common adapter.

What are the key power-rail requirements for EP2C8F256C7?

The EP2C8F256C7 requires a 1.2 V core supply (VCCINT), 2.5 V auxiliary supply (VCCAUX) for PLL analog, and one or more VCCIO bank supplies (1.5 V / 1.8 V / 2.5 V / 3.3 V) for user I/O. A POR (power-on-reset) circuit must hold the nCONFIG pin low until VCCINT and VCCAUX have ramped to specification. Designers should use low-ESR ceramic decoupling of at least 100 uF bulk + 0.1 uF per pin pair, following the decoupling guidance in the Cyclone II handbook chapter on power-supply design.

工程参考数据： EP2C8F256C7 ——对比、设计指导和合规信息。

选型指南

Choose the EP2C8F256C7 when your design requires a 256-FBGA Cyclone II FPGA in the commercial C7 speed grade and you need maximum logic density (8,256 LEs) at the lowest unit cost in this family. Choose the EP2C8F256C8N if internal Fmax must exceed 200 MHz; choose the EP2C8F256I8N for industrial temperature deployments; choose the EP2C8AF256A7N for AEC-Q100 automotive qualification. For higher logic density on the same FBGA-256 footprint, step up to the EP2C20F256C7N (20,060 LEs) or EP2C35F256C7N (35,000 LEs). For new designs starting in 2026, prefer the Cyclone IV E (EP4CE6F256 / EP4CE10F256) or Cyclone V (5CEBA4F256 / 5CEBA5F256) families, which are actively supported in Quartus Prime. The EP2C8F256C7 is appropriate only for legacy production maintenance, safety stock, or designs that intentionally target the Cyclone II IP ecosystem.

与替代料对比

参数	本产品	EP2C8F256C8N	EP2C8F256C6N	EP2C8F256I8N	EP2C8AF256I8N	EP2C8AF256A7N	EP2C20F256C7N	EP2C5F256C7N
Brand	Intel	Intel	Intel	Intel	Intel	Intel	Intel	Intel
Package	256-LBGA (FBGA-256)	256-LBGA (FBGA-256) - same	256-LBGA (FBGA-256) - same	256-LBGA (FBGA-256) - same	256-LBGA (FBGA-256) - same	256-LBGA (FBGA-256) - same	256-LBGA (FBGA-256) - same	256-LBGA (FBGA-256) - same
Logic Elements	8,256	8,256	8,256	8,256	8,256	8,256	20,060 (+143%)	4,608 (-44%)
Speed Grade	C7 (commercial)	C8 (commercial)	C6 (commercial)	I8 (industrial)	I8 (industrial, automotive)	A7 (automotive)	C7 (commercial)	C7 (commercial)
Temperature Grade	Commercial (0C to +85C TJ)	Commercial	Commercial	Industrial (-40C to +100C)	Automotive / Industrial	Automotive AEC-Q100	Commercial	Commercial
User I/O	182 (max)	182	182	182	182	182	142	158
Embedded Multipliers (18x18)	36	36	36	36	36	36	52	26
Embedded RAM Bits	165,888	165,888	165,888	165,888	165,888	165,888	239,616	119,808
Number of PLLs	2	2	2	2	2	2	4	2
Lifecycle Status	Last-time-buy (as of 2026-09-08)	Last-time-buy	Last-time-buy	Last-time-buy	Last-time-buy	Last-time-buy	Last-time-buy	Last-time-buy

关键差异点

Drop-in flexibility across 7 same-package Cyclone II variants on the FBGA-256 footprint （对比 EP2C8F256C8N)
Commercial C7 speed grade optimizes price/Fmax for cost-sensitive volume production （对比 EP2C8F256C8N (C8 speed grade))
2x logic-element headroom via pin-compatible upward migration within Cyclone II family （对比 EP2C5F256C7N (4,608 LEs))
Mature ecosystem with Quartus II tooling and abundant legacy IP （对比 Newer Cyclone IV / Cyclone V families)

设计说明

The Cyclone II requires three supply rails: VCCINT = 1.2 V (core), VCCAUX = 2.5 V (PLL analog), and one or more VCCIO bank rails at 1.5/1.8/2.5/3.3 V. Estimated: with VCCINT at 1.2 V drawing ~300 mA typical and VCCAUX at ~50 mA, total core current is roughly 350 mA at room temperature with moderate toggle rates. Place a 100 uF bulk + 0.1 uF per pin pair of low-ESR ceramic decoupling, and isolate VCCAUX with a ferrite bead to prevent PLL jitter from core switching noise. Sequence VCCINT before VCCAUX by at least 100 us to satisfy POR requirements, and hold nCONFIG low until both rails are stable.

The 256-FBGA package has theta_JA around 25-30 C/W with a standard 4-layer PCB and adequate ground-pour thermal vias under the central die-attach pad. Estimated: at 1 A VCCINT and 50 mA VCCAUX plus typical I/O switching, total dissipation is roughly 1.5 W, yielding a junction temperature rise of 40 C above 25 C ambient. For enclosed industrial enclosures with 50 C ambient, the device remains within the 85 C commercial TJ limit. For the I8N variant (-40C to +100C TJ), a copper-pour footprint of at least 1 square inch on the top layer plus a 4x4 thermal-via array under the BGA is recommended.

Route differential LVDS pairs with 100 ohm differential impedance and length-match the P and N legs to within 20 mil. The 1.0 mm pitch FBGA-256 land pattern requires 0.5 mm ball pads with 0.4 mm solder-mask openings; use NSMD (non-solder-mask-defined) pads for reliable reflow. Breakout the inner rows using dog-bone fan-out on a 4-layer stack-up, or use via-in-pad with filled-and-capped micro-vias if the fabricator supports them. Place the JTAG header (TMS, TCK, TDI, TDO) within 2 inches of the FPGA to avoid stub-effect issues at high TCK frequencies.

Do not leave the MSEL[2:0] configuration-mode pins floating — they determine Active Serial / Passive Serial / JTAG / Fast Passive Parallel mode and must be tied to VCCIO or GND through 4.7 kohm resistors. Do not exceed the 18 mA per-pin and 250 mA per-bank I/O current limits, or the I/O supply will droop and cause logic errors. Common pitfall: forgetting that VREF pins on VCCIO banks configured as SSTL/HSTL I/O standards must be driven by an external reference voltage, not left floating.

Place configuration memory (EPCS4 / EPCS16 / EPCS64) within 2 inches of the FPGA in AS configuration mode, and route the DCLK signal with controlled impedance. Keep the nSTATUS, nCONFIG, and CONF_DONE traces short and away from noisy switching signals. For FPP (Fast Passive Parallel) mode with an external microcontroller host, length-match the 8-bit DATA[7:0] bus to within 100 mil across all bits to satisfy the tDS / tDH setup-and-hold timing margins documented in the Cyclone II handbook configuration chapter.

合规信息

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Qualified

无铅

Yes

无卤

Unknown

冲突矿物

Compliant

RoHS status not explicitly confirmed in the provided web data; consult Intel product page or manufacturer PCN for authoritative statement. The EP2C8AF256A7N variant carries AEC-Q100 automotive qualification — choose that for automotive applications. Lead-free (Pb-free) assembly is supported per the FBGA package ball composition.

数据核验日期： 2026-09-08 ——数据由 XAIPART 元器件工程团队核验和整理

来源： Distributor, Octopart, Manufacturer Product Page, Distributor, Octopart, Distributor, Manufacturer Product Page, Manufacturer Product Page