EP2S130F1020C3NRB - Stratix II FPGA, 132K LE, 742 I/O, 1020-BBGA
料号： EP2S130F1020C3NRB ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1525 | $152,500.00 |
| 500 | $1380 | $690,000.00 |
| 1,000 | $1245 | $1,245,000.00 |
EP2S130F1020C3NRB 概述
A Field Programmable Gate Array (FPGA) is a type of integrated circuit that can be configured by the customer or designer after manufacturing - hence the term 'field-programmable'. FPGAs belong to the broader category of programmable logic devices (PLDs) alongside CPLDs, and they sit within the integrated circuit hierarchy as Application-Specific ICs (ASICs) -> Programmable Logic -> FPGA. Stratix II FPGAs target high-performance applications such as digital signal processing, telecommunications, and high-speed serial I/O. The EP2S130 is the largest member of the Stratix II family, with 4 to 8x the logic capacity of mid-range Cyclone II devices.
Key features include 6,627 LABs/CLBs (Logic Array Blocks / Configurable Logic Blocks), embedded DSP blocks for high-performance arithmetic, and dedicated clock management via up to 12 PLLs. The device also integrates up to 4.5 Mbits of TriMatrix memory distributed across three block RAM sizes, configurable as RAM, ROM, shift registers, or FIFOs. Per the Stratix II Device Handbook, the architecture supports up to 12 embedded transceivers operating from 622 Mbps to 6.375 Gbps depending on speed grade.
Typical applications include high-speed data acquisition, telecom line cards implementing SERDES protocols, ASIC prototyping, military radar systems, and high-end image processing pipelines. Industrial control and test/measurement equipment leverage the parallel DSP bandwidth of Stratix II in motor control and protocol bridging.
When designing with this device, ensure the PCB layout supports the 1.0 mm-pitch BGA with matched-length impedance-controlled traces for high-speed memory and transceiver interfaces. Power supply sequencing of VCCINT, VCCA, and VCCIO must follow Altera's Power-On Reset guidelines, and JTAG programming requires a 1.5 V or 1.8 V TDO reference voltage. The device is rated for commercial temperature range (0C to +85C) per the 'C' speed grade designation.
This page synthesizes distributor pricing, drop-in Stratix II family alternatives, and practical design notes not assembled in the manufacturer datasheet alone. Engineers searching for EP2S130F1020C3NRB specs, equivalents, or current stock can use the cross-reference and FAQ sections below.
直接替换替代料： EP2S130F1020C3NRB ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2S130F1020C3NRB （相同外形与封装尺寸） ——差异在于 Speed Grade, Operating Temperature, Package, RoHS Status, Process Technology.
快速对比工具——选择替代料号进行并排对比：
EP2S130F1020C3N
✅ 直接替换✓ 有现货
$1095 / 个
查看数据手册 →EP2S130F1020C3NGA
✅ 直接替换✓ 有现货
$1395 / 个
查看数据手册 →EP2S130F1020C3
✅ 直接替换✓ 有现货
$1295 / 个
查看数据手册 →EP2S130F1020I4N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1380 / 个
查看数据手册 →EP2S130F1020C5N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1320 / 个
查看数据手册 →EP2S130F1020C3NRB 最大额定值与电气特性
| Manufacturer | Intel Corporation (formerly Altera) |
| Series | Stratix II |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements (LEs) | 132,540 |
| Total Memory | 6,748 Kbits |
| LABs/CLBs | 6,627 |
| User I/O Count | 742 |
| 封装 | 1020-BBGA (33x33 mm, 1.0 mm pitch) |
| 工作温度 | 0C to +85C (commercial, C3 speed grade) |
| Process Node | 90 nm |
| 安装类型 | Surface Mount |
| Lead Free / RoHS Status | Lead Free / RoHS Compliant |
EP2S130F1020C3NRB 1020-bbga (33x33 mm, 1.0 mm pitch) 引脚配置指南
EP2S130F1020C3NRB（1020-bbga (33x33 mm, 1.0 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2S130F1020C3NRB.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2S130F1020C3NRB 适用于 6 应用s: Telecom Line Cards and SERDES Aggregation, High-Performance Digital Signal Processing, ASIC Prototyping and Emulation, Military Radar and Image Processing, Medical Imaging Systems, Industrial Test and Measurement Equipment.
Telecom Line Cards and SERDES Aggregation
The EP2S130F1020C3NRB's 132,540 logic elements and 6,748 Kbits of embedded TriMatrix memory make it well suited for telecom line cards implementing multiple SERDES protocols such as SONET, SDH, and 10G Ethernet aggregation. The 742 user I/Os and Stratix II ALM architecture enable parallel processing of high-bandwidth data streams with deterministic latency. Up to 12 embedded transceivers (per speed grade) operating up to 6.375 Gbps handle line-side serialization. Place the FPGA as the central processing element between framer ASICs and backplane SERDES, with 742 I/Os providing ample headroom for multi-port fan-out. Compared with switching to a discrete ASIC, this FPGA-based approach accelerates development and allows field firmware updates.
推荐
High-Performance Digital Signal Processing
Stratix II's embedded DSP blocks deliver up to 38 GFLOPs in this part, making the EP2S130F1020C3NRB ideal for real-time FFT, channelization, and baseband processing. The 132K logic elements support complex state machines and control logic alongside DSP pipelines. With 6,748 Kbits of distributed + block memory, large sample buffers fit on-chip without external SRAM. Designers typically pair the FPGA with high-speed ADC front-ends and implement digital up/down conversion in firmware. Compared with a software DSP, this hardware approach achieves 10-100x throughput for fixed-precision arithmetic.
推荐
ASIC Prototyping and Emulation
With 132,540 logic elements, the EP2S130F1020C3NRB can map complex ASIC RTL blocks - including CPUs, DSP cores, and interconnect fabrics - for pre-silicon validation. The 1020-BGA's 742 I/Os emulate external device connections for system-level test. Engineers typically partition large ASICs across multiple FPGAs using TDM or pin-multiplexing techniques. Quartus II's synthesis flow supports ASIC-equivalent libraries. Compared with a real ASIC bring-up, this FPGA prototype reduces validation cycles from months to weeks and enables firmware development before tape-out.
推荐
Military Radar and Image Processing
The EP2S130F1020C3NRB's high logic density and embedded DSP throughput make it suitable for synthetic aperture radar (SAR), phased-array beamforming, and real-time image processing pipelines. The 6,748 Kbits of memory hold intermediate pixel/return buffers, and 742 I/Os interface with high-speed ADC arrays. Designers implement matched filters, MTI processing, and CFAR detection in firmware. Compared with GPU-based processing, this FPGA approach achieves deterministic low-latency responses required for radar signal chains. Industrial-temperature variants (I-grade) extend deployment to fielded systems.
推荐
Medical Imaging Systems
Ultrasound beamforming, CT reconstruction, and MRI signal processing benefit from the EP2S130F1020C3NRB's parallel processing capability and 6,748 Kbits of embedded memory. The 742 I/Os handle parallel ADC interfaces for multi-channel beamformer arrays. Designers implement FIR filters, Hilbert transforms, and tissue-doppler processing in firmware. Compared with CPU-based architectures, FPGA processing reduces latency to sub-millisecond levels needed for real-time imaging. Note: medical applications require additional FDA/IEC 60601-1 compliance not covered by the FPGA itself.
推荐
Industrial Test and Measurement Equipment
The EP2S130F1020C3NRB's high-speed I/O capability and embedded memory suit protocol analyzers, BERT testers, and arbitrary waveform generators used in semiconductor test. The 742 I/Os fan out to multiple test channels, and the Stratix II architecture supports real-time pattern generation/comparison at sub-nanosecond resolution. Designers pair the FPGA with high-speed DACs/ADCs and implement custom test vectors in firmware. Compared with discrete logic implementations, this FPGA approach reduces BOM cost and enables programmable test sequences.
推荐
推荐产品汇总
工程参考数据： EP2S130F1020C3NRB ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2S130F1020C3N | EP2S130F1020C3NGA | EP2S130F1020C3 | EP2S130F1020I4N | EP2S130F1020C5N |
|---|---|---|---|---|---|---|
| Package | 1020-BBGA (33x33 mm, 1.0 mm pitch) | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same | 1020-BBGA - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements (LEs) | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Total Memory (Kbits) | 6,748 | 6,748 | 6,748 | 6,748 | 6,748 | 6,748 |
| User I/O Count | 742 | 742 | 742 | 742 | 742 | 742 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C |
| Speed Grade | C3 (commercial, mid) | C3 | C3 | C3 | I4 (industrial) | C5 (fastest commercial) |
关键差异点
- Highest logic density in the Stratix II family （对比 EP2S90F1020C3N)
- Identical 1020-BBGA footprint to other Stratix II family members （对比 EP2S130F1020C3N)
- Three embedded RAM types for flexible buffering （对比 Cyclone II EP2C70F896C8N)
设计说明
Estimated: Stratix II EP2S130 requires multiple voltage rails - VCCINT (core), VCCA (analog/PLL), VCCPD (I/O pre-driver), and per-bank VCCIO. At 90 nm process, VCCINT is typically 1.2 V. Follow Altera's PowerPlay early power estimator to size decoupling. Place 0.1 uF X7R ceramics within 5 mm of each VCCINT ball and bulk 220 uF polymer at the FPGA's power plane entry. Power-on sequencing must follow Altera's recommended order to avoid latch-up: VCCINT first, then VCCA, then VCCIO. Estimated idle power ~3-5 W; full-utilization power can exceed 15 W requiring a copper spreader or heatsink.
The 1020-BBGA FineLine BGA uses a 1.0 mm pitch. Use a 4-layer or 6-layer PCB with microvia-in-pad (diameter 0.4 mm) for breakout. Fan-out requires HDI stack-up with buried vias. Route all 8 transceiver differential pairs with 100 ohm +/-5% differential impedance and pair-to-pair skew below 2 ps. Length-match DDR memory interfaces to within +/-25 ps across byte groups. Avoid routing signals under the BGA shadow region to prevent signal-integrity loss.
Stratix II configuration via JTAG needs a 1.5 V or 1.8 V TDO reference voltage; the TDO pin is open-drain and must be pulled up to the selected VCCIO bank - omitting the pull-up causes configuration failure. FPP (Fast Passive Parallel) mode requires the nCONFIG pin be asserted correctly with proper pull-up. Always verify the configuration file matches the silicon revision via Quartus II's 'Convert Programming Files' tool - mismatched .sof/.pof files are a common cause of FPGA boot failure. When migrating from C3 speed grade to C5, recompile the design - timing assumptions change.
Place decoupling capacitors on the BGA's underside immediately below their associated balls, using short traces or via-in-pad. Maintain continuous power planes on inner layers with mesh stitching under the BGA to minimize inductance. For differential transceiver pairs, maintain coupled routing within 2x dielectric thickness; ground isolation between pairs reduces crosstalk. JTAG pins (TCK, TMS, TDI, TDO) must be accessible at a test header for in-system programming. Avoid mixing 1.5 V and 1.8 V LVCMOS on the same I/O bank - check Quartus II pin planner for bank voltage compatibility before finalizing layout.
合规信息
RoHS compliant per 'N' suffix in part number (Altera lead-free convention). AEC-Q100 not applicable for FPGAs. REACH compliance inherited from Intel/Altera PMO. EOL notice issued 4 December 2020 per Full-Electronic listing. Halogen-free status not confirmed in verified data.
