EP2S60F1020C4TT - Stratix II FPGA, 60K LE, 1020-BGA | Intel
料号： EP2S60F1020C4TT ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $980 | $980.00 |
| 10 | $920 | $9,200.00 |
| 100 | $850 | $85,000.00 |
| 500 | $790 | $395,000.00 |
| 1,000 | $720 | $720,000.00 |
EP2S60F1020C4TT 概述
A Field Programmable Gate Array (FPGA) is a programmable logic device that combines lookup-table (LUT)-based fabric, programmable interconnect, embedded memory blocks (M4K/M-RAM/M512), DSP blocks (multipliers), and high-speed I/O transceivers on a single die. Stratix II devices sit in the broader taxonomy of programmable logic devices (PLD) -> FPGA -> high-density FPGA -> system-on-chip programmable device, and historically bridged the gap between traditional FPGAs and ASIC-class compute density for DSP, packet processing, and pre-silicon ASIC prototyping.
Key parametric features for this device include: 60,440 logic elements, 2,544,192 embedded RAM bits, dedicated 18-bit × 18-bit DSP multiplier blocks for high-performance arithmetic, 718 maximum user I/O, four enhanced phase-locked loops (PLLs), up to 12 global clock networks, and a configurable high-speed memory interface supporting DDR/DDR2 SDRAM with dedicated DQS and DQ pins. The device also includes support for external memory interfaces such as QDR II/II+ SRAM and DDR/DDR2 SDRAM with on-chip termination and read/write leveling.
Typical applications include high-speed packet processing in network line cards, pre-silicon ASIC prototyping and emulation, video broadcast and image processing pipelines, DSP co-processing for wireless baseband, military/aerospace signal intelligence, and test & measurement instrumentation. The 1020-ball BGA package exposes enough user I/O to drive wide external buses and multiple high-speed serial/parallel interfaces concurrently.
When designing with EP2S60F1020C4TT, engineers should note that the part is a legacy Stratix II device: long-term supply is constrained and Intel recommends migrating to Cyclone IV/V or Arria equivalent families for new designs. A multi-layer PCB (typically 8+ layers) with controlled-impedance routing, dedicated power and ground planes, and proper decoupling is required to realize the device's high-speed serial/parallel I/O performance.
直接替换替代料： EP2S60F1020C4TT ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2S60F1020C4TT （相同外形与封装尺寸） ——差异在于 Speed Grade, Package, Operating Temperature, Family, Logic Elements.
快速对比工具——选择替代料号进行并排对比：
EP2S60F1020C4N
✅ 直接替换✓ 有现货
$67 / 个
查看数据手册 →EP2S60F1020C4
✅ 直接替换✓ 有现货
$1240 / 个
查看数据手册 →EP2S60F1020C3N
✅ 直接替换✓ 有现货
$1095 / 个
查看数据手册 →EP2S60F1020C3
✅ 直接替换✓ 有现货
$1380 / 个
查看数据手册 →EP2S130F1020C4
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2800 / 个
查看数据手册 →EP2S130F1020C4N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2850 / 个
查看数据手册 →EP2S60F1020C4TT 最大额定值与电气特性
| Family | Stratix II |
| Process Technology | 90 nm |
| Logic Elements | 60,440 |
| Equivalent Logic Elements | 60,440 |
| Embedded Memory (bits) | 2,544,192 |
| Maximum User I/O | 718 |
| 封装 | 1020-ball FineLine BGA |
| 安装类型 | Surface Mount (BGA) |
| 工作结温 | 0C to +85C (commercial, C4 speed grade) |
| Speed Grade | C4 |
| Memory Interfaces Supported | DDR/DDR2 SDRAM, QDR II/II+ SRAM |
| LE Conversion Note | 60,440 LEs is the legacy 'equivalent LE' figure; modern ALM-based naming differs |
EP2S60F1020C4TT 1020-ball fineline bga 引脚配置指南
EP2S60F1020C4TT（1020-ball fineline bga 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2S60F1020C4TT.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2S60F1020C4TT 适用于 6 应用s: ASIC Prototyping and Emulation, High-Speed Packet Processing / Networking Line Card, Wireless Baseband DSP Co-Processing, Video Broadcast / Image Processing Pipeline, Test and Measurement Instrumentation, Pre-Silicon ASIC Emulation and Reusable IP Validation.
ASIC Prototyping and Emulation
The EP2S60F1020C4TT's 60,440 logic elements and 1020-ball FineLine BGA package make it well-suited for ASIC prototyping and RTL emulation. Engineers map synthesizable blocks into Stratix II fabric using Quartus II, leveraging the device's 2,544,192 bits of embedded RAM for transaction capture and the 18x18 DSP blocks for arithmetic verification. Compared with ASIC tape-out, the EP2S60 delivers functional verification at MHz speeds while keeping debug iteration cycles short - typically minutes versus days. The 1020-ball BGA's 718 user I/O provides enough test-hookup pins for multi-clock-domain ASIC designs, and C4 commercial speed grade keeps timing margin predictable.
推荐
High-Speed Packet Processing / Networking Line Card
Stratix II EP2S60F1020C4TT is commonly used in 1G/10G Ethernet line cards and packet-processing engines where its 2,544,192 bits of embedded RAM serve as deep packet buffers and queue managers, while DSP blocks accelerate CRC, hash, and lookup operations. The 1020-ball BGA supports wide external memory interfaces (DDR/DDR2 SDRAM and QDR II/II+ SRAM) via dedicated DQS/DQ pins, sustaining multi-Gbps throughput at line rate. The C4 commercial speed grade provides the timing margin needed for 156.25 MHz DDR2 interfaces. Engineers design around the device's 718 user I/O for parallel classification buses or SPI-4.2 system interfaces.
推荐
Wireless Baseband DSP Co-Processing
The EP2S60F1020C4TT's 18x18 hardware multipliers enable high-throughput baseband DSP functions (FIR filters, FFT/iFFT, channel estimation) for 3G/4G reference designs. The 60,440 LEs plus dedicated DSP blocks deliver a cost-effective alternative to dedicated DSP processors when flexibility for evolving wireless standards is needed. The 1020-ball BGA exposes enough I/O for digital IF interfaces, ADC/DAC data buses, and ancillary control buses. C4 speed grade closes timing on 200+ MHz DSP pipelines. The commercial 0C-85C temperature range suits indoor cellular base-station and small-cell deployments.
推荐
Video Broadcast / Image Processing Pipeline
Stratix II EP2S60F1020C4TT handles real-time video processing such as SD/HD video scaling, color space conversion, motion-adaptive de-interlacing, and overlay composition. The device's embedded RAM blocks double as line buffers, while its 18x18 multipliers accelerate FIR-based scaling kernels and 2D convolution filters. With up to 718 user I/O, the 1020-ball BGA package can accept multi-channel DVI/HDMI/SDI input streams and output simultaneously. The 90 nm process and C4 speed grade comfortably hit 148.5 MHz pixel clocks required for 1080p60 video.
推荐
Test and Measurement Instrumentation
Test-and-measurement platforms use the EP2S60F1020C4TT for waveform generation, protocol decoding, and high-speed data acquisition. Its 2,544,192 bits of RAM serve as deep capture buffers, while DSP blocks accelerate FFT, FWT, and correlation operations at sample rates beyond 200 MSPS. The 1020-ball BGA's 718 user I/O accommodate parallel LVDS acquisition buses, JTAG-driven test heads, and backplane interfaces. The C4 commercial speed grade meets setup/hold margins for high-speed serial protocols like SPI-4.2 and parallel RapidIO used in ATE test heads.
推荐
Pre-Silicon ASIC Emulation and Reusable IP Validation
Pre-silicon ASIC verification teams adopt the EP2S60F1020C4TT to validate reusable IP blocks, bus fabrics, and processor subsystems before ASIC tape-out. Quartus II incremental compilation and the LogicLock flow let engineers partition designs across multiple Stratix II devices when the target ASIC exceeds 60K LEs. The 1020-ball BGA package is shared across the EP2S30 / EP2S60 / EP2S90 / EP2S130 / EP2S180 family, allowing PCB reuse for cost-optimized daughter cards. C4 commercial speed grade closes timing on standard 156.25 MHz reference designs.
推荐
推荐产品汇总
工程参考数据： EP2S60F1020C4TT ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2S60F1020C4N | EP2S60F1020C4 | EP2S60F1020C3N | EP2S60F1020C3 | EP2S130F1020C4 | EP2S130F1020C4N |
|---|---|---|---|---|---|---|---|
| Package | 1020-ball FineLine BGA | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same | 1020-ball FineLine BGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 132,540 | 132,540 |
| Speed Grade | C4 | C4 | C4 | C3 (one bin slower) | C3 (one bin slower) | C4 | C4 |
| Embedded Memory (bits) | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 6,747,840 | 6,747,840 |
| Maximum User I/O | 718 | 718 | 718 | 718 | 718 | 742 | 742 |
| Operating Junction Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
| Packaging Carrier | Tape & Reel (TT) | Tray (N) | Tray (no suffix) | Tray (N) | Tray (no suffix) | Tray (no suffix) | Tray (N) |
关键差异点
- High logic density and I/O count at a mature price point （对比 EP2S30F1020C4)
- Tape & Reel packaging variant for high-volume assembly （对比 EP2S60F1020C4N)
- Pin-compatible upgrade path to higher-density Stratix II family （对比 EP2S130F1020C4)
设计说明
Estimated: the 1020-ball FineLine BGA (33x33 mm, 1.0 mm pitch) requires a minimum 8-layer PCB stack-up with dedicated VCCINT, VCCIO, and GND planes. Use 50-ohm controlled-impedance routing for high-speed LVDS pairs, place 0.1 uF X7R bypass capacitors within 200 mil of each power pin, and add 10 uF bulk decoupling near the package corners. The 'TT' suffix indicates Tape & Reel - verify the SMT pick-and-place vendor's BGA alignment tolerance before finalizing the land pattern.
Estimated: Stratix II EP2S60 consumes approximately 5-15 W depending on logic utilization, toggle rate, and clock frequency. Designers must sequence VCCINT (1.2 V typical), VCCIO (1.5/1.8/2.5/3.3 V per bank), and PLL supplies using a controller such as the LTC3026 or TPS54xxx family with monotonic ramp-up. In-rush current on the 1.2 V rail can exceed 6 A during configuration; size input traces for at least 1 oz copper and verify the regulator's soft-start time stays within datasheet limits.
Common pitfalls include: (1) confusing the EP2S60 'equivalent LE' (60,440) metric with the modern ALM-based LE count used in Stratix V, (2) assuming Cyclone IV/V is drop-in compatible (it is not - PCB redesign required), (3) omitting MSEL pull-ups to select the configuration mode (Fast Passive Parallel, AS, JTAG, or Passive Serial), (4) not scheduling factory allocation well in advance given Last Time Buy status, and (5) using the wrong I/O bank voltage for SSTL-2/DDR memory interfaces.
Estimated: at 50% resource utilization and 100 MHz toggle rate the EP2S60 dissipates roughly 8-10 W; combined with the 1020-ball BGA's theta_JA of approximately 12-15 C/W (still-air, no heatsink), junction temperature can approach 110C with 25C ambient. Recommended mitigations: a multi-layer PCB with 1 oz copper power planes, top/bottom thermal vias under the BGA die area, optional clip-on heatsink, and air flow if the design is sealed in an enclosure.
合规信息
RoHS and REACH compliance status not present in the verified web data; the EP2S60F1020C4TT family has Pb-free ball options per the 'N' suffix variants. The part is a commercial-grade FPGA and is not AEC-Q100 qualified - choose the I-speed-grade EP2S60F1020I4 for industrial applications requiring wider temperature range. Intel/Altera has transitioned Stratix II to Last Time Buy status - designers should plan a migration to Stratix IV/V or Cyclone V/10 families for new designs.
