EP2SGX130GF1508C4N - Stratix II GX 132K LEs FPGA | Intel / Altera
料号： EP2SGX130GF1508C4N ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $165 | $1,650.00 |
| 100 | $148 | $14,800.00 |
| 500 | $132 | $66,000.00 |
| 1,000 | $118 | $118,000.00 |
EP2SGX130GF1508C4N 概述
A Field Programmable Gate Array (FPGA) is a class of programmable logic device containing configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, block RAM, and hardened I/O serdes that can be rewired post-manufacturing. FPGAs sit in the hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix II family specifically targets high-performance applications by combining a unique adaptive logic module (ALM) architecture with embedded transceivers, on-chip memory, and dedicated multipliers.
Key features include 132,540 logic elements organized as 6,627 LABs, 6747840 total RAM bits, 8 PLLs, 4 DLLs, and configurable high-speed transceivers capable of multiple protocol rates. The device supports LVDS, LVTTL, LVCMOS, PCI, PCI-X, and HSTL I/O standards and includes dedicated hardware multipliers and DSP blocks. The FCBGA-1508 FineLine BGA package offers vertical migration within the Stratix II GX family, allowing density upgrades without PCB changes.
The Stratix II GX architecture introduced the ALM (Adaptive Logic Module) as its core logic unit, replacing the 4-input LUT of previous generations with a fracturable 8-input equivalent that improves DSP packing density and reduces logic fragmentation. Combined with the 90 nm process node, this architecture achieved industry-leading performance at launch.
Typical applications include high-speed serial interface prototyping, PCI Express endpoint development, telecommunications backplane bridging, multi-gigabit serial I/O expansion, and DSP-intensive signal processing cards in test and measurement equipment. Its combination of logic density and on-chip transceivers made it a mainstay for OC-48 and early OC-192 designs, radar signal processing, and broadcast video routing.
When designing with this FPGA, ensure proper power sequencing for the 1.2 V core, 2.5 V/3.3 V auxiliary, and transceiver supplies, since out-of-order power-up can latch-up I/O structures. Thermal management must account for high quiescent current under heavy transceiver utilization; thermal balls in the BGA substrate must be soldered to a grounded thermal via array for proper dissipation.
This page synthesizes Stratix II GX family positioning, drop-in density-grade alternatives within the same FCBGA-1508 footprint, and practical design guidance beyond the marketing datasheet, helping engineers evaluate lifecycle risk and migration paths for legacy designs.
直接替换替代料： EP2SGX130GF1508C4N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP2SGX130GF1508C4N （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, RoHS Status, Family, Total RAM Bits.
快速对比工具——选择替代料号进行并排对比：
EP2SGX130GF1508C4
✅ 直接替换✓ 有现货
$985 / 个
查看数据手册 →EP2SGX130GF1508C3N
✅ 直接替换✓ 有现货
$1395 / 个
查看数据手册 →EP2SGX130GF1508I4N
✅ 直接替换✓ 有现货
$2050 / 个
查看数据手册 →EP2S130F1508C4N
✅ 直接替换✓ 有现货
$4435.83 / 个
查看数据手册 →EP2S130F1508C5N
✅ 直接替换✓ 有现货
$1390 / 个
查看数据手册 →EP2S180F1508C4N
✅ 直接替换✓ 有现货
$985 / 个
查看数据手册 →EP2SGX130GF1508C4N 最大额定值与电气特性
| Series | Stratix II GX |
| Family | Field Programmable Gate Array (FPGA) |
| Logic Elements | 132,540 |
| Logic Array Blocks (LABs) | 6,627 |
| Total RAM Bits | 6,747,840 |
| User I/Os | 734 |
| Number of Gates | 130,000 |
| Internal Frequency (max) | 717 MHz |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage | 1.2 V |
| 工作温度 | 0C to +85C (Commercial) |
| Package Type | 1508-ball FCBGA (FineLine BGA) |
| Package Size | 40 mm x 40 mm, 1 mm pitch |
| 安装类型 | Surface Mount |
| Lead-Free / RoHS | Yes (lead-free, MS-034AAU-1) |
| Manufacturer | Altera (now Intel) |
EP2SGX130GF1508C4N 40 mm x 40 mm, 1 mm pitch 引脚配置指南
EP2SGX130GF1508C4N（40 mm x 40 mm, 1 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP2SGX130GF1508C4N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP2SGX130GF1508C4N 适用于 6 应用s: Multi-Gigabit Serial Backplane Bridging, Test and Measurement Instrumentation, Radar and Signal Processing Front-End, Broadcast Video Routing and Processing, Industrial High-Speed Imaging Systems, Legacy Communications Protocol Bridging.
Multi-Gigabit Serial Backplane Bridging
The EP2SGX130GF1508C4N's integrated 6.375 Gbps transceivers made it a primary platform for OC-48/STM-16 and early OC-192 backplane bridging. With 132,540 logic elements and 8 PLLs, it can implement multi-channel protocol bridging (e.g., XAUI to SPI-4.2) in a single device. The 1508-ball FCBGA provides the high pin density required for 16+ serial lanes plus parallel sideband signals, while the 90 nm process delivers low-jitter clocking. For legacy telecom systems still requiring PCIe Gen1 or XAUI support, this FPGA remains a viable pin-compatible solution. Companion serializer/deserializer ICs such as the TLK1501 and TLK2501 pair naturally with its serial interface.
推荐
Test and Measurement Instrumentation
The EP2SGX130GF1508C4N fits test and measurement applications requiring parallel DSP blocks, abundant block RAM (6.7 Mbit), and 734 user I/Os. Its 132K logic elements can implement multi-channel FFT engines, real-time filters, and protocol analyzers in oscilloscopes, logic analyzers, and bit-error-rate testers. The 717 MHz internal clock enables real-time sample-rate processing, and the integrated transceivers support high-speed serial acquisition paths. The FineLine BGA is well-suited to high-density PCBs used in instrumentation backplanes.
推荐
Radar and Signal Processing Front-End
The EP2SGX130GF1508C4N's 132K logic elements, dedicated DSP blocks, and 6.7 Mbit block RAM make it a strong choice for radar pulse compression, MTI filtering, and phased-array beamforming. The 734 user I/Os support large LVDS data paths from multiple ADC channels, and the transceivers offload raw data transport. With 717 MHz internal operation, it achieves the throughput needed for narrowband digital down-conversion. Military and aerospace legacy programs continue to qualify this device for new builds due to its mature tooling and stable supply chain.
推荐
Broadcast Video Routing and Processing
Broadcast video routers and switchers leverage the EP2SGX130GF1508C4N's combination of 734 I/Os, 6.7 Mbit block RAM for line/frame buffers, and 132K logic elements for SDI de-embedder/embedder logic. The transceivers support SMPTE 292M and 424M serial digital video at 1.485 and 2.97 Gbps. The 90 nm Stratix II GX architecture was the first-generation platform to integrate HD-SDI/3G-SDI support, and remains in service in installed broadcast infrastructure worldwide.
推荐
Industrial High-Speed Imaging Systems
The EP2SGX130GF1508C4N supports industrial imaging systems with Camera Link, CoaXPress, or proprietary high-speed sensor interfaces. Its 132K logic elements implement pixel processing pipelines, color-space conversion, and compression engines in machine-vision inspection equipment. The 734 I/Os accommodate parallel image sensor interfaces, while transceivers handle emerging serial standards. The commercial temperature grade and lead-free FCBGA package suit automated optical inspection (AOI) and factory-floor deployments.
推荐
Legacy Communications Protocol Bridging
The EP2SGX130GF1508C4N bridges legacy telecom and datacom protocols such as SPI-4.2, SFI-4.1, XAUI, and PCIe Gen1. Its 8 PLLs and integrated transceivers simplify timing architectures, while 6.7 Mbit block RAM provides the elasticity buffers required for rate adaptation. The device served as the workhorse bridging solution in early-2000s multi-protocol switches and remains in use in legacy central-office equipment that has not yet migrated to modern ASSP solutions.
推荐
推荐产品汇总
工程参考数据： EP2SGX130GF1508C4N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP2SGX130GF1508C4 | EP2SGX130GF1508C3N | EP2SGX130GF1508I4N | EP2S130F1508C4N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1508-ball FCBGA | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,560 |
| Speed Grade | C4 (commercial) | C4 (commercial) | C3 (slower) | I4 (industrial) | C4 (commercial) |
| Integrated Transceivers | Yes (multi-gigabit) | Yes (multi-gigabit) | Yes (multi-gigabit) | Yes (multi-gigabit) | No |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Lead-Free / RoHS | Yes (lead-free) | No (leaded) | Yes (lead-free) | Yes (lead-free) | Yes (lead-free) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Highest-density Stratix II GX with full transceiver count （对比 EP2SGX60EF1152I4N)
- Integrated multi-gigabit transceivers （对比 EP2S130F1508C4N)
- Vertical migration supported within FCBGA-1508 footprint （对比 EP2S130F1508C5N)
设计说明
The EP2SGX130GF1508C4N requires power sequencing between the 1.2 V core, 2.5 V/3.3 V auxiliary, and 1.2 V/1.5 V PLL supplies. Power-up must be monotonic with no supply exceeding its rail by more than 0.7 V; out-of-order sequencing can latch-up the I/O cells. Use a dedicated power supervisor (e.g., TPS3808) to enforce sequencing rather than relying on RC delays. Estimated core current at 717 MHz full utilization approaches 4 A, so the 1.2 V regulator must deliver at least 5 A with low ripple (<30 mV pk-pk).
The FCBGA-1508 package must be assembled with the thermal balls soldered to a grounded via array (typically 16 thermal vias under the die footprint). Without this, junction temperature can exceed 125C under full transceiver utilization at industrial ambient. Theta-JA with proper via array is approximately 12 C/W; without it, rises to 25 C/W. Estimated: at 8 W total power dissipation and 12 C/W, junction rise is 96C above ambient, demanding attention to airflow and heatsinking in enclosed chassis.
The 1508-ball FCBGA at 1 mm pitch requires a PCB with 0.5 mm laser-drilled microvias and an HDI stackup (e.g., 6 layers with 1-1-1 microvia layer construction). Outer layer trace width between balls should be at least 0.127 mm (5 mil) to maintain 50 ohm single-ended impedance. The FineLine BGA substrate has larger balls than standard BGA, but PCB-side capture pads should still follow JEDEC MS-034AAU-1 land pattern exactly. Use ENIG or OSP surface finish for best solder joint reliability.
Do not confuse the EP2SGX130GF1508C4N (Stratix II GX with transceivers) with the EP2S130F1508C4N (Stratix II without transceivers). Both share the FCBGA-1508 footprint, but the non-GX device will not bring out the multi-gigabit serial lanes, so PCB designs that route to those balls will have unconnected inputs. Always confirm the exact device variant in your bitstream generation script before final PCB fabrication. Also note that the Quartus II design toolchain (10.x) is end-of-life; legacy projects may need migration to Quartus Prime with legacy device support, and new designs should consider Stratix V or modern Agilex families.
合规信息
Lead-free and RoHS compliant per the 'N' suffix in the MPN, qualified to JEDEC outline MS-034AAU-1. The Stratix II GX family is obsolete as of the Intel/Altera product lifecycle announcement; current production designs should migrate to Cyclone 10 GX or Agilex 7.
