EP3C10M164I7N - 10,320 LEs, 164-Ball Cyclone III FPGA | Altera
料号： EP3C10M164I7N ✓ 量产中EP3C10M164I7N 概述
A field-programmable gate array is a semiconductor device whose digital logic is configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic elements, embedded memory, programmable I/O, and dedicated clock resources on one integrated circuit. Cyclone III devices are positioned as low-cost FPGAs for control, communications, signal-processing, and embedded-system designs where deterministic logic and flexible post-build configuration are valuable.
The EP3C10M164I7N combines 10,320 logic elements with 423,936 kbit of embedded memory, providing a compact implementation platform for control logic, protocol handling, state machines, and small data-processing pipelines. Its 106 user I/Os support connections to external memory, converters, transceivers, and digital peripherals. The 437.5 MHz maximum operating frequency gives designers substantial timing headroom for synchronous control logic and moderately parallelized datapaths.
The 1.15 V to 1.25 V operating supply range places this device in the low-voltage domain typical of modern programmable logic. Configuration data determines the implemented circuit, allowing design revisions, field updates, and product differentiation without changing the PCB. The combination of embedded memory and logic elements is particularly useful when the design benefits from hardware-resident lookup tables, packet buffers, or parallel arithmetic pipelines.
Typical uses include industrial control modules, network interface controllers, data-acquisition front ends, embedded communications equipment, and compact test systems. In these applications, the FPGA can merge sampling, filtering, protocol conversion, and supervisory control into one device while keeping the external component count and board area relatively low.
Board design should preserve clean power distribution to the 1.2 V core domain and provide suitable decoupling around the FPGA. Signal-integrity and timing work should include controlled clock routing, series termination for external high-speed links, and I/O-standard selection that matches each connected device. The 164-ball BGA also requires a PCB footprint and assembly process capable of fine-pitch ball inspection and soldering.
This product overview combines the verified electrical, environmental, packaging, and sourcing attributes with application guidance, package considerations, and drop-in replacement analysis. It is intended to help engineers determine whether the Cyclone III resource set, industrial temperature grade, and 164-ball package fit a specific programmable-logic design before detailed FPGA design and PCB review begin.
直接替换替代料： EP3C10M164I7N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3C10M164I7N （相同外形与封装尺寸） ——差异在于 Embedded Memory, Package, Temperature Grade.
EP3C10M164C8N
✅ 直接替换📋 参考替代料（不在目录中）
EP3C10M164I7N 最大额定值与电气特性
| Device Type | Cyclone III field-programmable gate array |
| Logic Elements | 10,320 LE |
| Embedded Memory | 423,936 kbit |
| Maximum Operating Frequency | 437.5 MHz |
| Number of I/Os | 106 I/O |
| 工作电源电压 | 1.15 V to 1.25 V |
| Nominal Core Supply | 1.2 V |
| Minimum Operating Temperature | -40 °C |
| Maximum Operating Temperature | 100 °C |
| Temperature Grade | Industrial |
| 封装 | 164-TFBGA |
| Package Type | MBGA-164 |
| Terminal Count | 164 terminals |
| 安装方式 | SMD/SMT |
| Packaging | Tray |
| Logic Architecture | Adaptive Logic Modules |
EP3C10M164I7N mbga-164 引脚配置指南
EP3C10M164I7N（mbga-164 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3C10M164I7N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3C10M164I7N 适用于 6 应用s: Industrial Control and Automation, Data-Acquisition Front Ends, Network Interface and Protocol Control, Embedded Communications Equipment, Test and Measurement Equipment, Programmable Signal Conditioning.
Industrial Control and Automation
The EP3C10M164I7N fits compact industrial controllers that combine sequencing, monitoring, and communications in one FPGA. Its 10,320 logic elements can implement control state machines and interface logic, while 423,936 kbit of embedded memory supports local data buffers and parameter tables. The 106 I/Os provide connections for sensors, actuators, and digital interfaces, and the -40 °C to 100 °C industrial temperature range suits equipment operating beyond consumer-temperature conditions. The 1.2 V core domain should be isolated carefully from noisy external signals, while I/O standards should be selected to match each attached device.
推荐
Data-Acquisition Front Ends
The EP3C10M164I7N can consolidate sampling control, digital filtering, and data organization in a compact data-acquisition module. Its 10,320 logic elements support parallel datapaths and timing-control logic, while 423,936 kbit of embedded memory can buffer samples between acquisition and transfer stages. A maximum operating frequency of 437.5 MHz provides substantial timing margin for synchronous pipelines, although actual throughput depends on the selected architecture and I/O timing. The 106 available I/Os allow connection to converters and memory, and the industrial temperature range supports factory-floor instrumentation.
推荐
Network Interface and Protocol Control
The EP3C10M164I7N is appropriate for dedicated packet handling, framing, and protocol-conversion functions in embedded communications equipment. The FPGA's 10,320 logic elements can implement finite-state machines and parallel word processing, while 423,936 kbit of embedded memory provides on-chip packet buffering and descriptor storage. The 106 I/Os can be divided among network physical layers, local memories, and supervisory logic. At a 437.5 MHz maximum operating frequency, the device can support synchronous processing, but timing closure, I/O standards, clock quality, and protocol-specific verification remain essential design tasks.
推荐
Embedded Communications Equipment
The EP3C10M164I7N can consolidate link management, framing, encryption control, and host interfacing in embedded communications hardware. Its 10,320 logic elements provide enough parallel resources for dedicated transport functions, and its 423,936 kbit of embedded memory can support transmit and receive queues. The 106 I/Os are useful for connecting transceiver devices, local memories, and configuration or status signals. The 164-ball TFBGA keeps the device compact but requires a fine-pitch PCB layout and assembly process; maintain continuous power planes and use the manufacturer's guidance for decoupling and configuration pins.
推荐
Test and Measurement Equipment
The EP3C10M164I7N can implement pattern generation, acquisition sequencing, timing control, and data formatting within a compact FPGA-based test instrument. The 10,320 logic elements support parallel test channels and finite-state-machine control, while 423,936 kbit of embedded memory can hold samples, vectors, and calibration data. Its 437.5 MHz maximum operating frequency allows deeply pipelined operations when timing closure permits. The 106 I/Os offer flexible connections to converters, memories, and trigger circuitry. Precision analog performance remains the responsibility of external components, so the FPGA should be paired with suitable reference and converter circuits.
推荐
Programmable Signal Conditioning
The EP3C10M164I7N is suitable for programmable digital signal conditioning when the required algorithm fits 10,320 logic elements and 423,936 kbit of embedded memory. FIR filters, interpolation stages, data validators, and parallel correction logic can be mapped into the available resources, with the 437.5 MHz maximum frequency supporting pipelined implementations. Its 106 I/Os provide interfaces for converter data, control signals, and synchronization. Designers should evaluate coefficient storage, multiplier inference, and timing closure in the FPGA toolchain rather than assuming the headline frequency determines final sample rate.
推荐
推荐产品汇总
工程参考数据： EP3C10M164I7N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3C10M164C8N |
|---|---|---|
| Brand | Altera | Altera |
| Package | 164-TFBGA | 164-TFBGA |
| Device Family | Cyclone III | Cyclone III |
| Temperature Grade | Industrial, -40 °C to 100 °C | Commercial grade |
关键差异点
- Industrial temperature qualification （对比 EP3C10M164C8N)
- Compact logic and memory balance （对比 EP3C80F780I7N)
- Higher resource capacity for complex pipelines （对比 EP3C10M164I7N)
设计说明
Design the 1.15 V to 1.25 V core supply around the nominal 1.2 V operating point and follow Altera's recommended decoupling network for every supply rail. Keep the FPGA's core and I/O supply distribution planes continuous, place local capacitors close to their associated power balls, and minimize return-path discontinuity under high-speed switching. The 1.2 V rail should not be used as a substitute for separately specified I/O reference or auxiliary voltages.
The 164-ball TFBGA requires a fine-pitch, multilayer PCB with a footprint verified against the official package drawing. Follow the manufacturer's ball-assignment, solder-mask, paste, and via-in-pad guidance rather than deriving dimensions from a generic MBGA footprint. Inspect the assembled joints using an approach compatible with the fine ball pitch, and pay particular attention to power and ground balls because their connection quality affects device stability and configuration behavior.
Allocate the 106 I/Os according to the electrical standards required by connected devices, and treat clock, configuration, and high-speed interface routing as separate high-priority concerns. Use short return paths, avoid splits beneath active signals, and apply source-series termination where required by the external interface specification. Validate all edge rates with the final stack-up and loading; a nominal maximum FPGA frequency does not establish that an external memory or transceiver interface will operate reliably.
合规信息
No definitive RoHS, REACH, lead-free, halogen-free, or conflict-minerals status is established by the cited product information. AEC-Q100 is not applicable because the device is an industrial-temperature FPGA rather than an automotive-qualified device.
