EP3C10U256C7 - 10,320-Cell Cyclone III FPGA | Intel
料号： EP3C10U256C7 ✓ 量产中EP3C10U256C7 概述
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic can be configured after manufacture. An FPGA belongs to the programmable-logic device hierarchy and provides a flexible alternative to application-specific integrated circuits. Designers combine lookup-table-based logic, flip-flops, block RAM, multipliers, and I/O standards in software, allowing functional revisions and product differentiation without changing the underlying silicon or PCB layout.
The EP3C10U256C7 provides 10,320 logic elements and 423,936 bits of embedded memory for state machines, control logic, data buffering, packet handling, and interface bridging. Its 182 user I/O provide substantial connectivity for external memories, communications transceivers, converters, and display or industrial-control peripherals. The 256-LFBGA package supports compact surface-mount assembly while preserving high pin and I/O density.
The device uses 65 nm Cyclone III FPGA technology and a 1.2 V core voltage, combining a relatively large programmable logic capacity with low-voltage operation. Because FPGA performance depends on the selected clock, I/O standard, memory configuration, and design constraints, designers should evaluate timing with their actual Quartus II implementation rather than relying on device capacity alone. The verified cross-reference data identifies the commercial EP3C10U256C6 and industrial EP3C10U256I7N as package-compatible family alternatives.
Typical applications include industrial automation controllers, protocol bridges, data-acquisition systems, embedded communications equipment, motor-control interfaces, and general digital signal-processing front ends. Its 182 I/O make it especially useful where an FPGA must connect multiple sensors, converters, memories, and communication transceivers while performing real-time control or filtering in parallel.
PCB design should account for the 256-ball package, power and ground distribution, decoupling near the supply pins, and high-speed routing constraints. Designers should use the manufacturer’s pin and package documentation to confirm ball assignments, voltage requirements, supported I/O standards, and exposed thermal or power-management connections before layout.
This page consolidates distributor inventory, verified family cross-references, package information, pricing references, and practical replacement guidance. It is intended to help engineers identify genuine same-package alternatives while clearly separating verified facts from parameters that still require confirmation from the manufacturer datasheet.
直接替换替代料： EP3C10U256C7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3C10U256C7 （相同外形与封装尺寸） ——差异在于 Terminal Form.
EP3C10U256C6
✅ 直接替换联系询价
查看数据手册 →EP3C10U256I7N
✅ 直接替换📋 参考替代料（不在目录中）
EP3C10U256C8
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP3C10U256I8
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP3C10U256C7 最大额定值与电气特性
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) |
| Logic Elements | 10,320 elements |
| Embedded Memory | 423,936 bits |
| User I/O | 182 I/O |
| 封装 | 256-LFBGA |
| Package Pin or Terminal Count | 256 terminals |
| 安装类型 | Surface mount |
| Package Shape | Square |
| Terminal Form | BGA ball |
| FPGA Technology | 65 nm |
| Core Supply Voltage | 1.2 V |
| Product Family | Cyclone III |
| Temperature Grading | Other |
| Unit Price Reference | 38.8858 USD as of 2026-10-28 |
EP3C10U256C7 square 引脚配置指南
EP3C10U256C7（square 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3C10U256C7.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3C10U256C7 适用于 6 应用s: Industrial Automation Controller, Communications Protocol Bridge, Data Acquisition and Signal Conditioning, Motor Control and Positioning, Network Interface and Packet Processing, Programmable Logic Educational Platform.
Industrial Automation Controller
The EP3C10U256C7 fits industrial automation controllers that combine deterministic logic with many external field-bus, sensor, and actuator connections. Its 10,320 logic elements can implement state machines, interlocks, motion-control sequencing, and data conditioning, while 182 user I/O reduce the need for external I/O expanders. The 256-LFBGA package supports compact, high-density assembly, and the 65 nm Cyclone III architecture operates from a 1.2 V core. The principal qualification is the unverified temperature range: if the enclosure exceeds the commercial-grade limits, use the industrial EP3C10U256I7N after confirming its electrical and timing ratings.
推荐
Communications Protocol Bridge
The EP3C10U256C7 is suitable for a communications bridge that must translate between two serial interfaces while adding buffering or framing logic. Its programmable architecture allows parallel datapath processing, state-based protocol conversion, and data-rate adaptation to be implemented in one device. The 423,936 embedded memory bits provide on-chip buffering for packet data or dual-clock domains, while 182 I/O support external transceivers and parallel buses. Engineers should implement the appropriate clock domains and I/O standards in Quartus II, then verify timing at the actual target clock because the supplied records do not specify the maximum frequency of the C7 grade.
推荐
Data Acquisition and Signal Conditioning
The EP3C10U256C7 can act as the digital back end of a multi-channel data-acquisition system, performing sampling control, filtering, calibration, and packet formatting in parallel. Its 10,320 logic elements are suitable for fixed-point arithmetic and digital filtering, and the embedded memory supports sample buffering between acquisition and communication stages. The 182-I/O device can connect converters, trigger logic, counters, and communication hardware without relying on many external parallel devices. For precision designs, verify converter voltage tolerances, analog noise coupling, clock jitter, and I/O standards; the FPGA does not replace the analog front end.
推荐
Motor Control and Positioning
The EP3C10U256C7 supports embedded motor-control and positioning functions where position counting, pulse generation, fault handling, and supervisory logic must operate concurrently. Its programmable logic resources can implement closed-loop sequencing or coordinate multiple timing channels, while the high I/O count provides connections to encoders, gate drivers, current sensing, and communications. The 1.2 V core and 65 nm implementation are suitable for low-voltage digital control, but motor environments require careful partitioning between sensitive control signals and noisy power stages. Verify timing margins, I/O voltage limits, and ground-current return paths in the final PCB design.
推荐
Network Interface and Packet Processing
The EP3C10U256C7 is applicable to network-interface modules that need deterministic packet filtering, protocol checking, or buffering between an external PHY and an embedded processor. The 423,936 bits of memory can support packet queues and clock-domain-crossing structures, while 182 I/O provide broad connectivity for parallel buses, serial transceivers, and status signals. Programmable logic allows fixed-function behavior to be consolidated into the FPGA, reducing discrete logic and accelerating protocol updates. Engineers must define the PHY interface voltage, clock domains, buffering depth, and maximum packet throughput before resource allocation and timing closure.
推荐
Programmable Logic Educational Platform
The EP3C10U256C7 is well suited to FPGA education because it combines 10,320 logic elements, embedded memory, 182 I/O, and a single 256-LFBGA package in one programmable device. Students can implement counters, processors, interfaces, digital filters, and soft-core designs while learning constraint-driven timing, device configuration, and BGA layout practices. Its 65 nm Cyclone III architecture supports established Quartus II workflows, although current tool and operating-system support must be verified. Because the 256-ball package is not beginner-friendly for hand assembly, a suitable development board or carefully designed carrier PCB is strongly preferred.
推荐
推荐产品汇总
工程参考数据： EP3C10U256C7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3C10U256C6 | EP3C10U256I7N | EP3C10U256C8 | EP3C10U256I8 |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 256-LFBGA | 256-LFBGA | 256-LFBGA | 256-LFBGA | 256-LFBGA |
| Product Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Logic Elements | 10,320 elements | 10,320 elements | 10,320 elements | 10,320 elements | 10,320 elements |
| FPGA Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Ordering Grade | C7 | C6 | I7N | C8 | I8 |
关键差异点
- Directly verified mid-density Cyclone III resource configuration （对比 EP3C16F484I7N)
- Established package-compatible family candidates with measurable speed grades （对比 EP3C10U256C6)
- Industrial-ordering alternative with a higher verified clock rating （对比 EP3C10U256I7N)
- Higher-speed same-family options for designs requiring additional timing margin （对比 EP3C10U256C8)
设计说明
Treat the EP3C10U256C7 as a high-density BGA design rather than a conventional leaded package. Confirm every ball assignment using the official pinout for the C7 ordering code and the exact 256-LFBGA mechanical drawing before routing. Place core and I/O decoupling capacitors close to their intended supply pins, use a continuous or carefully segmented ground plane, and route configuration signals away from high-speed interfaces. Verify the board stack-up, via requirements, solder-mask definition, and assembly process against the manufacturer’s package recommendations before fabrication.
Budget the 1.2 V core rail separately from the auxiliary I/O supplies because the supplied records do not provide current limits, dropout behavior, or power-sequencing requirements. Verify each supply tolerance against the manufacturer’s electrical characteristics and use local decoupling where the datasheet specifies it. Estimated: if the verified core current is Icore and the supply is 1.2 V, core power is approximately 1.2 V × Icore; actual rail and total-device dissipation must still include I/O and auxiliary loads and should be checked against the official limits.
Assign each external interface to a bank with a supported voltage and I/O standard before PCB layout. Isolate clocks and high-speed data from noisy motor, power-converter, and relay return currents. Keep configuration pins away from sources capable of false triggering, and provide the required pull-up or pull-down resistors exactly as specified by the manufacturer. Because the source records do not identify supported I/O standards or maximum clock frequency, do not infer them from the package alone; obtain the device-specific documentation and complete timing analysis.
A shared package name does not by itself establish drop-in compatibility. EP3C10U256C6 and EP3C10U256I7N are documented as package-consistent alternatives, but speed grade, temperature class, electrical limits, configuration behavior, and timing still require confirmation. The LLM-sourced C8 and I8 candidates also require manufacturer-document verification of their ball maps before use. For any substitution, compare configuration-file compatibility, pin multiplexing, supported I/O standards, core and auxiliary voltages, and maximum operating frequency in the official documentation before purchasing.
合规信息
The supplied manufacturer and distributor snippets do not provide extractable RoHS, REACH, lead-free, halogen-free, or conflict-minerals declarations. No qualification status was inferred. AEC-Q100 is not applicable because this is an FPGA rather than an automotive-qualified discrete or analog device, subject to confirmation against any project-specific automotive qualification requirements.
