EP3C16M164C7N - Cyclone III FPGA, 15408 LE | Intel
料号： EP3C16M164C7N ✗ 停产EP3C16M164C7N 概述
A field-programmable gate array, or FPGA, is a programmable digital semiconductor used to implement logic functions, control systems, signal processing, and interface logic. An FPGA combines configurable logic blocks, programmable interconnects, memory resources, and input/output blocks on one integrated circuit. After configuration, the EP3C16M164C7N can execute parallel digital designs without the fixed function of a conventional application-specific integrated circuit.
The Cyclone III device provides 15,408 logic elements, which the product listing also describes as 963 logic array blocks, plus 92 user I/O. Its 504 Kb block RAM supports buffering, data storage, and control logic that benefit from on-chip memory. The 164-MBGA package provides a compact surface-mount option for equipment where board area and interconnect density are important.
The device is manufactured using 65 nm CMOS technology and separates its core and I/O supply requirements into 1.2 V and 2.5 V rails. Speed grade 7 identifies its performance class within the Cyclone III ordering system. The commercial temperature designation corresponds to a 0 °C to 85 °C junction-temperature range, making the device appropriate for commercial and industrial environments that remain within that limit.
Typical design uses include industrial control systems, communications interfaces, embedded data acquisition, general-purpose digital logic, embedded storage control, and parallel signal processing. The combination of 15,408 logic elements, 92 I/O, and 504 Kb of block RAM makes the device useful for designs that require substantial configurable logic without moving to a larger FPGA family.
Design planning should account for the M164 package, its 164-ball land pattern, separate core and I/O rails, configuration requirements, and pin-constrained user I/O. PCB design must follow the package ball map and power-decoupling guidance in the Intel Cyclone III handbook. Because this device is an older programmable-logic product, verify configuration device support, tool versions, and any last-time-buy considerations before starting a new production design.
This page organizes the confirmed Cyclone III resource counts, package information, supply details, and same-package ordering alternatives into a practical engineering reference. It also distinguishes speed-grade and temperature-grade options, helping designers evaluate whether a lower or higher grade can be used without changing the PCB footprint.
直接替换替代料： EP3C16M164C7N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3C16M164C7N （相同外形与封装尺寸） ——差异在于 Logic Elements.
EP3C16M164C7
✅ 直接替换📋 参考替代料（不在目录中）
EP3C16M164C8N
✅ 直接替换联系询价
查看数据手册 →EP3C16M164I7N
✅ 直接替换📋 参考替代料（不在目录中）
EP3C16M164C6N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP3C16M164C5N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP3C16M164C4N
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP3C16M164C7N 最大额定值与电气特性
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) |
| Logic Elements | 15,408 LE |
| Logic Array Blocks | 963 LAB |
| User I/O | 92 I/O |
| Block RAM | 504 Kb |
| 封装 | 164-MBGA (M164), 8 x 8 mm |
| Technology | 65 nm CMOS |
| Core Supply Voltage | 1.2 V |
| I/O Supply Voltage | 2.5 V |
| Speed Grade | Grade 7 |
| Temperature Grade | Commercial |
| Junction Temperature Range | 0 °C to 85 °C |
| Terminal Count | 164 terminals |
| 安装类型 | Surface Mount |
| Package Shape | Square |
| Lead-Free Status | Lead Free |
EP3C16M164C7N square 引脚配置指南
EP3C16M164C7N（square 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3C16M164C7N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3C16M164C7N 适用于 6 应用s: Industrial PLC Control Logic, Data Acquisition and Signal Conditioning, Communications Protocol Interface, Embedded Video and Image Processing, Embedded Storage Controller, General-Purpose Digital Instrumentation.
Industrial PLC Control Logic
The EP3C16M164C7N fits compact programmable control logic requiring parallel sensor handling, sequencing, and deterministic digital state machines. Its 15,408 logic elements provide capacity for control paths, while 92 user I/O allow multiple external interfaces to share one FPGA. The 504 Kb of block RAM can hold operating data, counters, and message buffers without an external memory device. In a controller, the FPGA would connect field inputs, execute supervisory logic, and drive outputs through the available user I/O. The 8 x 8 mm M164 package also reduces board footprint, although dense BGA routing and careful power planning remain essential.
推荐
Data Acquisition and Signal Conditioning
The EP3C16M164C7N can act as the digital control layer for a parallel data-acquisition system because it combines 92 user I/O with 15,408 configurable logic elements. External analog-to-digital converters can feed parallel data into the FPGA, where programmable logic can perform sampling control, channel multiplexing, filtering, and data packing. The 504 Kb block RAM provides local buffering for samples and control words. For source-synchronous interfaces or high-speed capture, system timing must be verified against the selected speed grade. The 65 nm CMOS implementation and 1.2 V core supply should be paired with the power and decoupling plan in the manufacturer handbook.
推荐
Communications Protocol Interface
The EP3C16M164C7N is suitable for configurable communications interfaces that translate between parallel logic and external data paths. Its 15,408 logic elements can accommodate framing, byte alignment, checksums, FIFOs, and control-state machines, while 504 Kb of block RAM can support packet buffering. The 92 user I/O provide enough parallel connections for multiple buses, control signals, and status indicators. Engineers should allocate pins from the official M164 ball map, verify electrical-standard support for each interface, and confirm that clock and timing requirements fit speed grade 7. Configuration storage and boot-up behavior also need to be included in the complete system design.
推荐
Embedded Video and Image Processing
The EP3C16M164C7N can support modest parallel image-processing pipelines when the design does not require the resources of a larger FPGA. Pixel acquisition, thresholding, color classification, region detection, and display-control functions can be distributed across 15,408 logic elements, while the 504 Kb of block RAM can implement line buffers or compact frame-storage stages. Its 92 user I/O are useful for connecting image sensors, parallel converters, and local display-control logic. The design must account for the 164-MBGA escape routing and the device's 1.2 V core and 2.5 V I/O rails. Video timing and sustained throughput should be verified before using the device for full-frame high-definition processing.
推荐
Embedded Storage Controller
The EP3C16M164C7N is appropriate for a compact embedded storage-control subsystem because its programmable logic can implement state machines, error handling, and command translation. The 504 Kb of block RAM can support FIFOs, sector caches, and transfer descriptors, while 92 user I/O can connect a controller to external memory and host-side signals. Because the Cyclone III device does not provide the memory interface of a dedicated storage controller, protocol-specific logic must be implemented in the FPGA. Engineers should use the manufacturer timing tools to establish clock rates and should reserve I/O for status, interrupt, and configuration functions. Thermal and signal-integrity checks remain necessary for a reliable board implementation.
推荐
General-Purpose Digital Instrumentation
The EP3C16M164C7N can consolidate several functions in an instrument such as a logic analyzer, sequence generator, digital pattern processor, or test interface. Fifteen thousand four hundred eight logic elements support configurable counters, trigger logic, state machines, and data-formatting functions, while 92 user I/O provide connections to probes and peripheral circuits. The 504 Kb block RAM supports capture windows, reference tables, and protocol patterns. For laboratory equipment, the commercial 0 °C to 85 °C junction-temperature range must be respected under worst-case ambient conditions. Synchronous acquisition paths should be evaluated against the timing margin of speed grade 7, and the complete BGA layout should follow the manufacturer's package and power guidelines.
推荐
推荐产品汇总
工程参考数据： EP3C16M164C7N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3C16M164C7 | EP3C16M164C8N | EP3C16M164I7N | EP3C16M164C6N | EP3C16M164C5N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 164-MBGA (M164), 8 x 8 mm | 164-MBGA (M164), 8 x 8 mm | 164-MBGA (M164), 8 x 8 mm | 164-MBGA (M164), 8 x 8 mm | 164-MBGA (M164), 8 x 8 mm | 164-MBGA (M164), 8 x 8 mm |
| Logic Elements | 15,408 LE | 15,408 LE | 15,408 LE | 15,408 LE | 15,408 LE | 15,408 LE |
| User I/O | 92 I/O | 92 I/O | 92 I/O | 92 I/O | 92 I/O | 92 I/O |
| Block RAM | 504 Kb | 504 Kb | 504 Kb | 504 Kb | 504 Kb | 504 Kb |
| Speed Grade | Grade 7 | Grade 7 | Grade 8 | Grade 7 | Grade 6 | Grade 5 |
| Temperature Designation | Commercial | Commercial | Commercial | Industrial | Commercial | Commercial |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| I/O Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Process Technology | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS | 65 nm CMOS |
关键差异点
- Commercial speed grade 7 configuration （对比 EP3C16M164C8N)
- Commercial-temperature ordering option （对比 EP3C16M164I7N)
- Full speed grade 7 operation in the M164 package （对比 EP3C16M164C5N)
设计说明
Implement the M164 footprint from the official 164-MBGA ball map rather than inferring locations from a generic BGA symbol. Route the 1.2 V core and 2.5 V I/O rails as separate networks, preserve the manufacturer's plane recommendations, and place the required bulk and decoupling capacitors close to their associated supply balls. Dense BGA escape routing should be checked for via transitions, return paths, and adequate clearance around configuration and clock pins.
The EP3C16M164C7N is assigned a commercial junction-temperature range of 0 °C to 85 °C. Calculate worst-case junction temperature from ambient temperature, FPGA power dissipation, and the effective thermal resistance of the actual PCB stack-up; do not rely on a generic package rating. If the calculated value approaches 85 °C, use a lower-power design, improve copper spreading, increase airflow, or select an industrial-temperature ordering option.
Place configuration, clock, and user-interface routing according to the Cyclone III pin-connection guidelines. Keep high-speed clock and data nets short, provide continuous reference planes, and account for BGA breakout vias when estimating signal loss. Confirm pin assignments in the design compiler and compare them with the package drawing before release. Changes between speed or temperature grades should not alter the M164 land pattern, but they still require timing and thermal review.
Do not treat the I7N variant as an unconditional substitute for C7N: the ordering code changes the commercial temperature designation to industrial, while C8N changes speed grade 7 to grade 8. Lower speed grades can change achievable clock rates and timing closure even when the package and logic resources match. Verify configuration-device compatibility, tool support, clock constraints, I/O assignments, and production availability before approving a substitution.
合规信息
The exact MPN is identified as lead-free. Explicit RoHS, REACH, halogen-free, and conflict-minerals declarations were not identified, so those fields remain unknown. AEC-Q100 qualification is not applicable to the commercial ordering code.
