EP3C25F256C7 - 24,624 LEs Cyclone III FPGA | Altera
料号： EP3C25F256C7 ✗ 停产EP3C25F256C7 概述
A field-programmable gate array is a semiconductor device whose digital logic, interconnects, and I/O behavior can be configured after manufacture. Within the product hierarchy, an FPGA is a programmable logic IC, which is a semiconductor and a form of programmable digital hardware. Cyclone III devices combine configurable logic, embedded memory, and programmable I/O in a single integrated circuit, reducing the number of external components required in systems that need flexible hardware behavior or late design changes.
The EP3C25F256C7 provides 24,624 logic elements, 608,256 memory bits, and 156 logic blocks. Its 256-LBGA package supports 256 device terminals and is identified as surface mount and lead-free in the supplied data. These resources make the device relevant to control logic, protocol bridging, test equipment, industrial automation, communications infrastructure, and embedded systems that require a reusable hardware platform. The operating range of -40°C to +125°C supports applications spanning industrial temperature environments.
The Cyclone III architecture combines configurable logic blocks with embedded memory resources and programmable input/output structures. This allows design logic to be implemented in parallel rather than entirely as sequential processor instructions. The EP3C25F256C7 should be configured for its intended clocking, I/O standards, memory interface, and system timing before operation. Detailed voltage ratings, supported I/O standards, speed-dependent timing, configuration methods, and power consumption were not included in the verified records and must therefore be confirmed in the manufacturer device documentation before design release.
Typical applications include industrial factory controllers, communication line cards, instrumentation and test systems, network-interface subsystems, embedded video control, and general-purpose digital signal-processing platforms. The 24,624 logic elements provide substantial parallel-processing capacity, while 608,256 memory bits can support buffering, lookup tables, packet storage, or state-machine data. The 256-terminal package also offers a broad interface footprint for external memory, transceivers, clocks, and data buses.
A key design consideration is power and thermal planning. The verified data does not provide core voltage, I/O voltage, quiescent power, or active power, so engineers should not estimate those values from generic Cyclone III data without checking the exact device, speed grade, package, and configuration. Likewise, the 256-LBGA package requires a qualified PCB layout with controlled escape routing, power and ground distribution, thermal analysis, and assembly-process controls. Configuration storage, JTAG access, clocking, decoupling, and I/O standards must all be verified against the official documentation.
This page combines the supplied distributor specifications, verified package and temperature details, available cross-reference candidates, and practical engineering cautions that are not consolidated in a typical distributor listing. It distinguishes verified characteristics from unavailable electrical details so engineers can assess fit, identify missing data, and plan a responsible migration or qualification process.
直接替换替代料： EP3C25F256C7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3C25F256C7 （相同外形与封装尺寸） ——差异在于 Operating Temperature, Device Type, Mounting Type, Logic Blocks, Logic Elements.
EP3C25F256C7N
✅ 直接替换📋 参考替代料（不在目录中）
EP3C25F256I7N
✅ 直接替换联系询价
查看数据手册 →EP3C25F256C6
✅ 直接替换📋 参考替代料（不在目录中）
EP3C25U256C8N
✅ 直接替换📋 参考替代料（不在目录中）
EP3C25F256C8N
✅ 直接替换 ⚠️ 规格未核验联系询价
查看数据手册 →EP3C25F256C7 最大额定值与电气特性
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone III |
| Logic Elements | 24,624 logic elements |
| Logic Blocks | 156 logic blocks |
| Embedded Memory | 608,256 bits |
| Package Type | 256-LBGA |
| Alternate Package Designation | FBGA-256 |
| 引脚数量 | 256 pins |
| Number of Terminations | 256 terminations |
| 工作温度 | -40°C to +125°C |
| 安装类型 | Surface Mount |
| Lead-Free Status | Lead-free package |
EP3C25F256C7 fbga-256 引脚配置指南
EP3C25F256C7（fbga-256 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3C25F256C7.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3C25F256C7 适用于 6 应用s: Industrial Factory Control, Communications Line Card, Programmable Instrumentation, Network Interface Subsystem, Embedded Signal Processing, Embedded Video Control.
Industrial Factory Control
The EP3C25F256C7 fits parallel industrial-control logic where a factory controller must combine sequencing, status monitoring, data acquisition, and communication interfaces. Its 24,624 logic elements and 156 logic blocks provide substantially more parallel logic capacity than a small microcontroller, while 608,256 memory bits can support state tables, local buffering, or protocol data. The verified operating range of -40°C to +125°C is relevant to equipment deployed in factories and other temperature-variable environments. The device would normally sit beside sensors, actuators, transceivers, and isolation hardware, with the FPGA implementing deterministic control functions. Because core voltage, I/O standards, clock limits, and active power were not included in the supplied records, the final controller design must use the official electrical and timing data, a qualified power tree, and a 256-LBGA layout that meets signal-integrity and assembly requirements.
推荐
Communications Line Card
The EP3C25F256C7 is suitable for a communications line card requiring configurable packet handling, parallel data paths, status logic, and multiple external interfaces. The 24,624 logic elements and 608,256 memory bits can divide the design among datapath logic, control state machines, buffers, and protocol adapters. Its 256-pin package exposes enough terminals for memory, clocks, transceiver connections, and supervision signals without relying exclusively on external glue logic. The verified -40°C to +125°C range can support controlled industrial network equipment. However, the supplied records do not identify supported I/O standards, maximum transceiver rates, core voltage, or power consumption. Engineers must therefore verify protocol timing, impedance-sensitive interfaces, clocking, and signal integrity against the exact speed grade. Configuration retention, JTAG access, thermal performance, and supply sequencing also need validation before the FPGA is released into a line-card design.
推荐
Programmable Instrumentation
The EP3C25F256C7 can serve programmable measurement and instrumentation front ends requiring concurrent acquisition logic, trigger management, filtering, calibration, and data formatting. Its 24,624 logic elements allow multiple digital pipelines to operate in parallel, while 608,256 memory bits can implement sample buffers, lookup tables, or calibration coefficients. The 256-LBGA footprint provides 256 terminals for converters, clocks, memory, and control signals, making it appropriate for densely connected custom test equipment. The documented -40°C to +125°C operating range permits evaluation across wide environmental conditions. Before implementation, engineers must obtain the missing voltage, clock, I/O, and power specifications and confirm that the selected configuration supports the required acquisition rate and endpoint timing. PCB design must also account for BGA assembly, clean power delivery, thermal spreading, and controlled clock distribution.
推荐
Network Interface Subsystem
The EP3C25F256C7 is a credible platform for a configurable network-interface subsystem that needs protocol framing, queueing, filtering, status accounting, and host-facing logic in one device. The verified 24,624 logic elements, 608,256 memory bits, and 156 logic blocks provide substantial parallel resources, while the 256-pin package can connect external PHY or transceiver components, memory, and management logic. The -40°C to +125°C range is useful for network equipment expected to operate in variable ambient temperatures. The available evidence does not specify supported I/O standards, maximum clock frequency, power, or security features, so a complete timing and compliance plan must use the exact official device documentation. Engineers should also evaluate configuration flash access, packet-memory bandwidth, clock jitter tolerance, termination, and PCB return-path design before considering the device for a production network interface.
推荐
Embedded Signal Processing
The EP3C25F256C7 is appropriate for embedded digital signal processing that benefits from parallel pipelines rather than sequential software execution. The 24,624 logic elements can implement filters, correlation, interpolation, waveform generation, or data-format conversion concurrently, while the 608,256 memory bits can provide local storage for samples and intermediate states. The 256-LBGA package offers a large interface surface for converters, sensors, memory, and clock sources. Its verified -40°C to +125°C range broadens the potential operating envelope for industrial instrumentation. The supplied records do not provide DSP blocks, multipliers, embedded-memory organization, maximum frequencies, or power values, and those details must not be inferred. Design verification should therefore cover arithmetic timing, memory bandwidth, clocking, I/O voltage compatibility, resource utilization, thermal margin, and the configuration method before functional sign-off.
推荐
Embedded Video Control
The EP3C25F256C7 can implement video timing, pixel formatting, control, and interface logic in an embedded display or imaging subsystem. Its 24,624 logic elements and 156 logic blocks allow parallel pipelines for timing generation, color conversion, overlay handling, and synchronization, while 608,256 memory bits can support line buffers or compact working storage. The 256-terminal package provides connections for external memory, display timing, control signals, and data sources. The documented -40°C to +125°C range makes it relevant to industrial display and imaging equipment. Exact video-rate capability cannot be claimed because the verified records do not provide clock limits, I/O standards, or memory architecture. Before implementation, engineers must validate horizontal and vertical timing margins, video clock jitter, data-bus timing, configuration startup, power sequencing, and BGA signal integrity for the selected board and display interface.
推荐
推荐产品汇总
工程参考数据： EP3C25F256C7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3C25F256C7N | EP3C25F256I7 | EP3C25F256C6 | EP3C25U256C8N | EP3C25F256C8 |
|---|---|---|---|---|---|---|
| Package | FBGA-256 | FBGA-256 | FBGA-256 | FBGA-256 | FBGA-256 | FBGA-256 |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Device Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Pin Count | 256 pins | 256 pins | 256 pins | 256 pins | 256 pins | 256 pins |
| Speed Grade | C7 | C7N | I7 | C6 | U256C8N | C8 |
关键差异点
- Identified 24,624-logic-element capacity in the target orderable device （对比 EP3C25U256C8N)
- Documented broad operating-temperature range （对比 EP3C25F256C7N)
- Direct C7 ordering identity avoids speed-grade reinterpretation （对比 EP3C25F256C6)
- Known 256-pin package and 156-block resource baseline （对比 EP3C25F256I7)
设计说明
Do not approve the power tree until the exact EP3C25F256C7 speed grade, core voltage, I/O voltage, configuration state, clock rate, and utilization have been entered into the manufacturer power tool. The verified records do not provide those values, so a generic regulator capacity estimate would be unsafe. Verify quiescent and I/O current separately, design independent core and I/O supplies if required, and include startup current, sequencing, monitoring, and worst-case derating in the supply design.
The 256-LBGA footprint requires a manufacturer-qualified escape-routing stackup, power-plane geometry, via structure, and assembly stencil design. Keep sensitive clock and configuration paths short, provide local decoupling at each supply terminal, and avoid splits or discontinuities in reference planes beneath the device. Because the verified data does not include the recommended capacitor values or via counts, use the official package design guidelines rather than relying on generic BGA layout assumptions.
Establish the thermal budget from actual configured activity rather than logic-element count alone. The EP3C25F256C7 has 24,624 logic elements, but utilization, switching frequency, I/O activity, and ambient conditions determine dissipation. Verify package thermal characteristics and the PCB stackup, distribute power and ground connections as specified, model the assembled board, and preserve airflow or conductive cooling when required. Do not substitute the 0.00 pricing placeholders for any validated cost or thermal data.
Do not treat an ordering suffix change as automatically harmless. Before replacing EP3C25F256C7 with EP3C25F256C7N, EP3C25F256I7, EP3C25F256C6, EP3C25U256C8N, or EP3C25F256C8, compare the official ordering guide, pin list, voltage ratings, timing grade, temperature range, configuration method, lifecycle status, and package drawing. Also verify that any active product is the same speed grade required by the original timing closure and that the design has not been changed for obsolete-device mitigation.
合规信息
The verified DigChip excerpt identifies the EP3C25F256C7 package as lead-free. It does not explicitly provide RoHS, REACH, halogen-free, conflict-minerals, or automotive-qualification declarations for this exact MPN. AEC-Q100 is marked not applicable because this is an FPGA rather than an automotive-qualified discrete device.
