EP3C25F324C8 - Cyclone III FPGA 24,624 LE 324-FBGA | Intel
料号： EP3C25F324C8 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.75 | $2,975.00 |
| 500 | $26.4 | $13,200.00 |
| 1,000 | $23.1 | $23,100.00 |
EP3C25F324C8 概述
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. FPGAs sit between fixed-function ASICs and microcontrollers in the digital design hierarchy: programmable logic IC -> FPGA -> SRAM-based FPGA -> low-power FPGA. Cyclone III FPGAs are specifically engineered for cost- and power-sensitive applications, building on the Cyclone architecture with a 65 nm process to reduce static and dynamic power while maintaining sufficient logic density for mid-range designs.
Key specifications of the EP3C25F324C8 include 66 embedded 18 x 18 multipliers for DSP workloads, four general-purpose PLLs for clock management, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device integrates 24624 logic elements organized as 1539 logic array blocks (LABs), with each LAB containing 16 logic elements. The embedded memory is configurable as RAM, ROM, or FIFO, providing flexible on-chip data buffering without external SRAM.
The Cyclone III architecture supports partial dynamic reconfiguration and ships with free Quartus II design software, including IP cores for DDR/DDR2 SDRAM controllers, PCI Express, Ethernet, and common serial protocols. The 324-ball FineLine BGA package measures 19 mm x 19 mm with a 1.0 mm ball pitch, making it compatible with standard multilayer PCB manufacturing.
Typical applications include industrial motor control, video processing pipelines, automotive infotainment prototypes, low-cost software-defined radio, and bridge/interface glue logic. It is also used as a prototyping vehicle for ASIC verification and as a low-volume production replacement for legacy CPLDs.
When designing with this part, attention to simultaneous switching output (SSO) noise and decoupling is critical; the application notes recommend 0.1 µF and 0.01 µF high-frequency capacitors within 100 mils of each power pin. Migration paths include the Cyclone IV E family for cost reduction and Cyclone V for higher logic density.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical Quartus II design notes not found in the manufacturer datasheet alone, supporting faster engineering decisions.
直接替换替代料： EP3C25F324C8 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3C25F324C8 （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Operating Temperature, Speed Grade, Embedded Memory.
快速对比工具——选择替代料号进行并排对比：
EP3C25F324C7N
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →EP3C25F324C6N
✅ 直接替换✓ 有现货
$62.3 / 个
查看数据手册 →EP3C25F324I7N
✅ 直接替换✓ 有现货
$58.2 / 个
查看数据手册 →EP3C16F484C8N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$29.95 / 个
查看数据手册 →EP3C25F256I7N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$27.2 / 个
查看数据手册 →XC6SLX25-3FGG324C
✅ 直接替换📋 参考替代料（不在目录中）
EP3C25F324C8 最大额定值与电气特性
| Series | Cyclone III |
| Logic Elements | 24,624 LE |
| Logic Array Blocks | 1,539 LABs |
| Embedded Memory | 608,256 bits |
| Embedded Multipliers | 66 (18 x 18) |
| User I/Os | 215 |
| PLLs | 4 |
| Process Technology | 65 nm CMOS, SRAM-based |
| Core Voltage | 1.2 V |
| Speed Grade | 8 (commercial) |
| 工作温度 | 0 °C to +85 °C (commercial) |
| 封装 | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| 安装类型 | Surface Mount (BGA) |
| Maximum Internal Clock | 402 MHz |
| RoHS 状态 | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) |
EP3C25F324C8 324-ball fbga (fineline bga), 19 x 19 mm, 1.0 mm pitch 引脚配置指南
EP3C25F324C8（324-ball fbga (fineline bga), 19 x 19 mm, 1.0 mm pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3C25F324C8.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3C25F324C8 适用于 6 应用s: Industrial Motor Control, Video Processing Pipeline, Automotive Infotainment Prototype, Software-Defined Radio Front-End, ASIC Prototyping Platform, Legacy Bridge and Interface Logic.
Industrial Motor Control
The EP3C25F324C8 fits industrial motor control designs thanks to its 66 embedded 18x18 multipliers that accelerate Field-Oriented Control (FOC) math, 4 PLLs for precise PWM timing, and 215 user I/Os for encoder, Hall-sensor, and gate-driver interfaces. With 24,624 logic elements, the device can host a full FOC algorithm, current/voltage PI loops, and SVPWM modulator in a single chip while leaving headroom for safety logic. Operating from a 1.2 V core with separate I/O bank supplies, the FPGA interfaces directly to 3.3 V and 5 V gate drivers, eliminating level shifters in typical 24 V industrial bus architectures. Estimated: at 50 MHz system clock, FOC loop closure in under 4 µs is achievable.
推荐
Video Processing Pipeline
The 608 Kbits of embedded SRAM in the EP3C25F324C8 is well suited for line buffering in video processing pipelines, where each M9K block stores one scan line of standard-definition video at 8-bit color depth. With 24,624 logic elements, the device can implement color-space conversion (YUV to RGB), scaling, deinterlacing, and on-screen display overlay in a single chip. The 215 user I/Os accommodate parallel ITU-R BT.656 or digital RGB interfaces plus LVDS for flat-panel connections. Quartus II IP cores for SDRAM controllers simplify external frame-buffer management. This combination eliminates the need for a separate video processor ASIC in mid-resolution designs.
推荐
Automotive Infotainment Prototype
Automotive infotainment prototypes benefit from the EP3C25F324C8's combination of DSP multipliers for audio decode, ample logic for CAN/LIN bridging, and 215 I/Os for display, touch, and radio tuner interfaces. The Cyclone III family is widely used in pre-production automotive head units before ASIC migration. While the C8 commercial-temperature variant is limited to 0-85 °C, the EP3C25F324I7N industrial variant (-40 to +100 °C) is pin-compatible for under-dash environments. The FBGA-324 package at 19x19 mm fits standard double-DIN chassis PCBs with room for power management and audio DAC peripherals.
推荐
Software-Defined Radio Front-End
The EP3C25F324C8 supports entry-level software-defined radio front-ends where its 66 18x18 multipliers perform DDC/DUC (digital down/up conversion) and channelization on IF samples up to approximately 100 MSPS. With 4 PLLs, the device generates independent clocks for ADC, DAC, and digital mixer sections. The 215 user I/Os connect to dual-channel ADC/DAC pairs, external memory buses, and high-speed LVDS links to baseband processors. Engineers typically pair this Cyclone III device with Analog Devices AD9361 or similar transceivers for sub-6 GHz SDR experiments, achieving FPGA-based modulation/demodulation at zero per-unit licensing cost.
推荐
ASIC Prototyping Platform
The 24,624 logic elements of EP3C25F324C8 provide enough density to prototype mid-complexity ASICs in the 50k-100k gate range, including glue logic, custom peripherals, and small RISC-V soft cores. The Quartus II design flow supports industry-standard Verilog and VHDL, allowing direct migration of pre-silicon RTL. With 608 Kbits embedded memory, designers can emulate on-chip SRAM blocks without external devices. The FBGA-324 footprint enables multi-FPGA partitioning by stacking daughter cards. This use case is common in semiconductor NPI teams validating designs before committing to mask sets.
推荐
Legacy Bridge and Interface Logic
Bridge and interface logic designs (e.g., I2C to SPI, UART to USB, parallel bus to LVDS) fit naturally within the EP3C25F324C8's logic budget, replacing legacy 74-series TTL or older CPLDs with a single programmable device. With 215 I/Os, the FPGA supports 8-10 simultaneous interface conversions on a single chip. Quartus II IP cores for I2C, SPI, UART, PCIe, and DDR/DDR2 controllers accelerate development. Engineers building legacy industrial adapters and test equipment commonly use this Cyclone III device as a flexible glue-logic replacement that consolidates discrete logic into one BGA, reducing BOM count and board area.
推荐
推荐产品汇总
工程参考数据： EP3C25F324C8 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3C25F324C7N | EP3C25F324C6N | EP3C25F324I7N | EP3C16F484C8N | XC6SLX25-3FGG324C |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Xilinx |
| Package | FBGA-324 (19x19 mm, 1.0 mm pitch) | FBGA-324 (19x19 mm, 1.0 mm pitch) - same | FBGA-324 (19x19 mm, 1.0 mm pitch) - same | FBGA-324 (19x19 mm, 1.0 mm pitch) - same | FBGA-484 (23x23 mm, 1.0 mm pitch) - different | FBGA-324 (similar footprint) - same ball count |
| Logic Elements | 24,624 LE | 24,624 LE - same | 24,624 LE - same | 24,624 LE - same | 15,408 LE - 37% less | 24,051 cells - similar |
| Speed Grade | 8 (commercial) | 7 (faster) | 6 (faster) | 7 (faster) | 8 (commercial) - same | -3 (Xilinx speed grade) |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) |
| RoHS Compliance | Non-compliant (no N suffix) | Compliant (N suffix) | Compliant (N suffix) | Compliant (N suffix) | Compliant (N suffix) | Compliant |
| User I/Os | 215 | 215 - same | 215 - same | 215 - same | 346 | 226 |
| Embedded Memory | 608 Kbits | 608 Kbits - same | 608 Kbits - same | 608 Kbits - same | 504 Kbits - 17% less | 936 Kbits Block RAM |
关键差异点
- Lowest-cost Cyclone III option in FBGA-324 package （对比 EP3C25F324C7N)
- Commercial temperature variant for cost-sensitive indoor designs （对比 EP3C25F324I7N)
- Mature ecosystem with proven IP cores （对比 XC6SLX25-3FGG324C)
设计说明
The EP3C25F324C8 requires a 1.2 V core supply (VCCINT) and separate VCCIO bank supplies for I/O standards (typically 1.5 V, 1.8 V, 2.5 V, or 3.3 V). Per the Cyclone III device family datasheet power section, place 0.1 µF and 0.01 µF decoupling capacitors within 100 mils of every power pin. Use a low-dropout regulator with 1% voltage tolerance for VCCINT; tighter tolerance reduces core current variation and improves timing closure. Estimated core current consumption: 350-500 mA typical at 50% logic utilization with 100 MHz clock.
The 324-ball FBGA package at 1.0 mm pitch requires laser-drilled micro-vias and via-in-pad technology for reliable fan-out. Per IPC-7095 Class 3 design rules, allocate 4-6 layer PCB stack-up with dedicated ground and power planes adjacent to BGA break-out layers. Do not route signals under the BGA; use via arrays to escape to inner layers immediately. After assembly, perform X-ray inspection to verify BGA solder joint integrity per IPC-A-610 acceptance criteria.
Common pitfalls: (1) Configuring I/O banks with mixed voltage standards causes contention - verify VCCIO per bank before assigning pins in Quartus II Pin Planner. (2) Configuring unused pins as input floating draws leakage current - set to 'As output driving ground' or 'As input tri-stated with weak pull-up' per the device handbook. (3) Bitstream compression must be enabled for designs larger than 50% logic utilization or configuration time exceeds 100 ms. (4) Programming via JTAG requires VCCIO of bank 1 to be 2.5 V or higher.
LVDS signals on EP3C25F324C8 require 100 Ω differential termination at the receiver; place resistor networks within 200 mils of FPGA input pins. Maximum LVDS data rate is 875 Mbps per the device handbook. For DDR/DDR2 SDRAM interfaces, use the Quartus II memory controller IP with calibrated timing and follow the board design guidelines for matched-length traces (within 25 ps skew on byte lanes). SSO (simultaneous switching output) noise can cause ground bounce; limit 8 mA outputs to 12-16 per power/ground pair.
合规信息
RoHS non-compliance per Lisleapex product listing - the EP3C25F324C8 (no N suffix) uses lead-bearing solder balls. For RoHS-compliant equivalent, choose EP3C25F324C8N. AEC-Q100 not applicable for FPGA in this package/grade; choose automotive-qualified Cyclone III variants separately. Lead-free, halogen-free, REACH, and conflict minerals status not explicitly stated in verified data and should be confirmed with manufacturer datasheet for N-suffix variants.
