EP3C40F780C6N - Cyclone III FPGA 39.6K LE 780-FBGA | Intel (Altera)
料号： EP3C40F780C6N ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $223.12 | $223.12 |
| 10 | $215 | $2,150.00 |
| 100 | $199.5 | $19,950.00 |
| 500 | $185 | $92,500.00 |
| 1,000 | $172 | $172,000.00 |
EP3C40F780C6N 概述
A Field-Programmable Gate Array (FPGA) is a programmable logic device that allows designers to configure arbitrary digital logic, memory blocks, and I/O behavior after PCB fabrication, in contrast to an Application-Specific Integrated Circuit (ASIC) which is fixed at mask production. FPGAs occupy the IC hierarchy at programmable logic -> logic IC -> integrated circuit -> semiconductor. The Cyclone III family specifically targets the cost/performance sweet spot, offering ASIC-level density at FPGA-level flexibility for applications like motor control, video processing, and telecommunications line cards.
Key specifications include 39,600 logic elements distributed across 4,065 Logic Array Blocks (LABs) and 126 M9K embedded memory blocks totaling 1,161,216 bits (113 Kbytes of true SRAM). The device integrates 4 phase-locked loops (PLLs) for clock synthesis, supports multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL) on its 535 user I/O pins, and provides up to 4 integrated hard memory controllers plus a wide range of soft IP cores from Altera/Intel.
The Cyclone III architecture uses 60 nm process technology with a 1.2 V core supply and hot-socketing support, achieving typical power consumption of roughly 0.4 W to 1.5 W depending on design utilization. Its SRAM-based configuration requires external flash or a configuration device, while the built-in Cyclic Redundancy Check (CRC) circuitry catches configuration bitstream errors. The device also supports partial reconfiguration for in-field updates without system downtime.
Typical applications include industrial motor control, LED display controllers, machine vision and video bridging, automotive infotainment, and low-cost telecommunications line cards. The 535 I/O count and 780-FBGA footprint make it suitable for medium-density designs requiring many parallel interfaces such as LVDS or DDR2 memory.
Designers should evaluate the 780-ball FBGA routing complexity and use a minimum 6-layer PCB with controlled-impedance traces. The 1.0 mm pitch keeps the BGA manageable for standard assembly, but X-ray inspection after reflow is mandatory. JTAG programming via USB-Blaster is the standard configuration path.
This page synthesizes distributor pricing, drop-in alternative FPGAs, and practical PCB/design notes not aggregated in any single Altera datasheet or distributor listing.
直接替换替代料： EP3C40F780C6N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP3C40F780C6N （相同外形与封装尺寸） ——差异在于 Speed Grade, Process Technology, Package, Series, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
EP3C40F780C8N
✅ 直接替换✓ 有现货
$64.85 / 个
查看数据手册 →EP3C40F780I6N
✅ 直接替换📋 参考替代料（不在目录中）
EP3C40F780C7N
✅ 直接替换✓ 有现货
$145.4 / 个
查看数据手册 →EP4CE40F780C8N
✅ 直接替换📋 参考替代料（不在目录中）
EP3C120F780C7N
✅ 直接替换✓ 有现货
$162 / 个
查看数据手册 →EP3C40F780C6
✅ 直接替换✓ 有现货
$142.1 / 个
查看数据手册 →EP3C40F780C6N 最大额定值与电气特性
| Family | Cyclone III |
| Logic Elements | 39,600 |
| Embedded Memory Bits | 1,161,216 |
| Embedded Memory (Kbytes) | 113 |
| M9K Memory Blocks | 126 |
| Logic Array Blocks (LABs) | 4,065 |
| Maximum User I/O Pins | 535 |
| PLLs | 4 |
| Process Technology | 60 nm CMOS |
| Core Voltage | 1.2 V |
| Speed Grade | 6 (commercial) |
| 工作温度 | 0C to +85C (commercial) |
| 封装 | 780-ball FBGA (FineLine BGA) |
| Package Dimensions | 29 x 29 mm |
| Ball Pitch | 1.0 mm |
| Package Height | 2.6 mm |
| 安装类型 | Surface Mount (FBGA) |
| Lead Free | Yes |
| Configuration Method | SRAM, JTAG via USB-Blaster |
| RoHS 状态 | Compliant |
EP3C40F780C6N 2.6 mm 引脚配置指南
EP3C40F780C6N（2.6 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP3C40F780C6N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP3C40F780C6N 适用于 7 应用s: Industrial Motor Control, LED Display Controllers and Video Walls, Machine Vision and Video Bridging, Telecommunications Line Cards, Automotive Infotainment and Driver Assistance, Portable Test and Measurement Equipment, Software Defined Radio (SDR) Baseband.
Industrial Motor Control
The EP3C40F780C6N is well-suited to multi-axis industrial motor control thanks to its 39,600 logic elements and 126 M9K memory blocks for state-machine commutation tables. The 535 user I/Os directly drive 3-phase PWM channels plus encoder/QEI inputs, while the 4 PLLs synthesize jitter-free clocks for resolver excitation and sigma-delta current sensing. Typical designs place this FPGA between a Cortex-M3 host and IGBT driver stage, implementing field-oriented control in 60-100 MHz hardware loops with sub-microsecond deterministic latency that a microcontroller cannot deliver.
推荐
LED Display Controllers and Video Walls
The EP3C40F780C6N drives large LED video walls by combining 39,600 logic elements for scan-line and gamma-correction pipelines with 1,161,216 bits of embedded memory for double-buffered frame storage. Its 535 I/Os in the 780-FBGA package route dozens of LVDS pairs simultaneously, supporting 24-48 channels of hub75 LED interface without external serializer chips. The 4 PLLs generate pixel clocks from DVI/HDMI inputs while the high I/O count supports front-panel control, color sensors, and brightness feedback without extra logic.
推荐
Machine Vision and Video Bridging
Machine vision systems use the EP3C40F780C6N to bridge Camera Link / LVDS / MIPI CSI-2 sensors to Ethernet or USB3 host interfaces. The 126 M9K blocks implement line buffers at 200-300 MHz pixel rates, while the 535 I/Os handle 8-12 LVDS pairs from a typical 2K line-scan sensor with room for trigger outputs, GPIO, and external flash. The 39,600 LE capacity runs real-time defect detection algorithms (Sobel, blob detection) with sub-line latency, replacing PC-based vision at a fraction of the BOM cost.
推荐
Telecommunications Line Cards
Telco line cards leverage the EP3C40F780C6N to implement E1/T1 framers, HDLC controllers, and LVDS-to-CMOS bridging in DSLAM or PDH multiplexer equipment. The 39,600 logic elements support 16-32 E1/T1 channels with full HDLC encapsulation and BERT testing in a single device. The 4 PLLs generate 2.048 MHz E1 reference clocks with low jitter, and the 535 I/Os expose individual timeslot access to backplane transceivers - far beyond what a CPLD or fixed-function framer IC could provide.
推荐
Automotive Infotainment and Driver Assistance
Automotive infotainment ECUs use the EP3C40F780C6N (industrial or AEC-Q100 variant) to mux LVDS display streams, decode CAN/LIN buses, and drive TFT controllers. The 39,600 LE capacity implements H.264 baseline decode for rear-seat displays while the 535 I/Os expose navigation, USB, Bluetooth, and radio DSP interfaces simultaneously. Designers pair it with the automotive-grade EP3C40F780I6N variant when -40C to +100C operation is required; for new designs, EP4CE40F780C8N is the lower-power successor.
推荐
Portable Test and Measurement Equipment
Portable T&M instruments leverage the EP3C40F780C6N to implement deep custom DSP and trigger logic that fixed-function ASICs cannot match. The 126 M9K blocks hold 100K-sample deep capture buffers while the 39,600 logic elements run 200 MSPS trigger/state-machines in parallel. The 780-FBGA exposes 535 I/Os to ADC/DAC LVDS interfaces, parallel front-panel keypads, and TFT graphics - all in one device. Low core voltage (1.2 V) keeps battery drain manageable in handheld oscilloscopes and protocol analyzers.
推荐
Software Defined Radio (SDR) Baseband
SDR baseband platforms use the EP3C40F780C6N for DDC/DUC, channelization, and protocol decoding between RF ADCs/ DACs and a host processor. The 39,600 logic elements implement multiple parallel DDC chains (CIC + FIR) at 100-200 MHz while the 1,161,216 embedded bits provide coefficient storage and FFT scratch buffers. The 535 I/Os expose LVDS pairs to high-speed ADCs (ADS62P4x) and DACs (DAC5682x), and the 4 PLLs synthesize all sample clocks from a single reference oscillator.
推荐
推荐产品汇总
工程参考数据： EP3C40F780C6N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP3C40F780C8N | EP3C40F780I6N | EP3C40F780C7N | EP4CE40F780C8N | EP3C120F780C7N | EP3C40F780C6 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-ball FBGA | 780-ball FBGA (same) | 780-ball FBGA (same) | 780-ball FBGA (same) | 780-ball FBGA (same) | 780-ball FBGA (same) | 780-ball FBGA (same) |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 | 120,060 | 39,600 |
| Speed Grade | C6 (commercial) | C8 (faster) | I6 (industrial) | C7 (mid) | C8 (Cyclone IV E) | C7 (mid) | C6 (same) |
| User I/O Pins | 535 | 535 | 535 | 535 | 535 | 535 | 535 |
| Embedded Memory (Kbits) | 1,134 (113 Kbytes) | 1,134 | 1,134 | 1,134 | 1,134 | 3,888 | 1,134 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Lifecycle Status | NRND | NRND | NRND | NRND | Active | NRND | NRND |
关键差异点
- Full 535 user I/Os in the largest Cyclone III package （对比 EP3C40F484C6N)
- Cost-optimized -6 speed grade variant （对比 EP3C40F780C8N)
- Mature ecosystem with Cyclone III handbook reference designs （对比 Lattice ECP5 (LFE5U-45F-8BG256C))
- Identical pinout to higher-density EP3C120F780 （对比 EP3C40F484C6N)
设计说明
Route the EP3C40F780C6N 780-FBGA on a minimum 6-layer PCB with continuous ground and power planes beneath the BGA. Use 0.4 mm via-in-pad with filled-and-capped microvias for all inner-row balls to escape cleanly. Maintain 1.0 mm pitch routing - escape routing via 4 mil (0.1 mm) traces between balls and a fanout pattern that leaves the inner BGA rows unblocked. X-ray inspection after reflow is mandatory because all solder joints are under the package.
The Cyclone III EP3C40F780C6N requires three rails: 1.2 V VCCINT (core), 2.5 V VCCAUX (PLLs and configuration), and 3.3 V VCCIO (I/O banks). Decoupling must include 100 nF X7R caps per bank plus bulk 22-47 uF tantalum or polymer caps near each supply pin. Estimated core power at 50% utilization and 200 MHz is approximately 1.0-1.5 W; use the PowerPlay estimator in Quartus II for design-specific values. Power-up sequencing requires VCCINT, then VCCAUX, then VCCIO - violating the order risks latch-up.
The 780-FBGA package theta_JA is roughly 16 C/W with 4 thermal balls connected to inner ground/power planes. Estimated: at 1.5 W dissipation and 25C ambient, junction temperature rises 24C - no heatsink required. For industrial-temperature (-40C to +100C) designs using EP3C40F780I6N, leave an open thermal via array under the package to maximize PCB heat-sinking. Always refer to the Cyclone III Handbook thermal characterization curves before locking your enclosure.
LVDS pairs on the EP3C40F780C6N require 100 ohm differential routing with matched length (within 10 mils) on each pair. Match skew across parallel LVDS buses within 50 mils. Use 50 ohm controlled-impedance traces for 3.3 V LVCMOS and 50 ohm for 2.5 V SSTL. If routing DDR2 memory with the Cyclone III external memory interface, follow the Intel/Altera EMIF layout guidelines for DQ/DQS byte-group matching (within 20 mils).
Do not confuse the C6, C7, and C8 speed grades - C8 is the fastest, C6 the slowest; choosing the wrong grade causes timing-closure failure. MSEL pins must be tied to select AS or JTAG configuration mode - leaving them floating results in configuration failure. Note that EP3C40F780C6N is NRD lifecycle (per the verified web data); new designs should target EP4CE40F780C8N or 10CL040YF780I7G with Quartus Prime instead of Quartus II 13.0.
合规信息
RoHS and lead-free compliance confirmed by FindIC specification (LEAD FREE flag) and distributor listings (Alldatasheet, Heisener, Mouser). REACH SVHC, halogen-free, and conflict-minerals status not present in the verified data - request from Intel/Arrow/Avnet for EU-market certifications. AEC-Q100 not applicable - the F780C6N is commercial grade; EP3C40F780I6N is the industrial-temperature variant.