EP4CE55F23C8LN - Cyclone IV E FPGA 55K LE 484-FBGA | Intel
料号： EP4CE55F23C8LN ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $142.5 | $142.50 |
| 10 | $132 | $1,320.00 |
| 100 | $121.75 | $12,175.00 |
| 500 | $112.4 | $56,200.00 |
| 1,000 | $105 | $105,000.00 |
EP4CE55F23C8LN 概述
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as multipliers, memory blocks, and transceivers. FPGAs sit within the broader category of programmable logic devices (PLDs), which in turn belong to the digital logic integrated circuit family. Unlike fixed-function ASICs, FPGAs are reconfigured at design time to implement arbitrary digital signal processing, glue logic, control state machines, or even soft-processor subsystems.
Key features of the EP4CE55F23C8LN include 156 embedded 18x18 multipliers supporting DSP-intensive designs, 4 PLLs for flexible clock synthesis, and 20 global clock networks. The device operates from a 1.2 V core supply with separate VCCPD and VCCIO banks for mixed-voltage I/O standards such as LVDS, SSTL, and LVCMOS up to 3.3 V. Its hard memory controller and PCIe interface (when available in the family) accelerate common system functions. The "N" suffix confirms lead-free / Pb-free termination consistent with RoHS.
Architecturally, Cyclone IV E uses an SRAM-based look-up table (LUT) fabric with 4-input LUTs feeding adjacent registers, and dedicated carry chains for arithmetic. Logic elements are grouped into Logic Array Blocks (LABs); the EP4CE55F23C8LN contains 3,491 LABs. The 484-FBGA package exposes the maximum user-I/O count of the family for this die, ideal for high-pin-count designs.
Typical applications include industrial motor control, video processing and display bridging, factory automation controllers, low-cost software-defined radio front-ends, test and measurement instrumentation, and protocol bridging between legacy and modern interfaces (UART/SPI/I2C to Ethernet/PCIe). The combination of DSP blocks and PLLs also suits motor drive encoder interpolation and multi-axis servo control loops.
Design consideration: the FBGA-484 package requires careful PCB layout with microvia stack-ups and controlled-impedance traces; ensure reference schematics from the Cyclone IV E handbook are followed for decoupling and bank-power sequencing.
This page synthesizes distributor pricing, drop-in Cyclone IV E variants, and practical design notes not found on any single manufacturer or distributor product page.
直接替换替代料： EP4CE55F23C8LN ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP4CE55F23C8LN （相同外形与封装尺寸） ——差异在于 Package, Speed Grade, Operating Temperature, RoHS Status, Configuration Modes.
快速对比工具——选择替代料号进行并排对比：
EP4CE55F23C8L
✅ 直接替换✓ 有现货
$112.9 / 个
查看数据手册 →EP4CE55F23C8N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$74 / 个
查看数据手册 →EP4CE55F23C7N
✅ 直接替换✓ 有现货
$56.4 / 个
查看数据手册 →EP4CE55F23C6N
✅ 直接替换✓ 有现货
$54.92 / 个
查看数据手册 →EP4CE55F23A7N
✅ 直接替换✓ 有现货
$134.4 / 个
查看数据手册 →EP4CE40F23C8LN
✅ 直接替换✓ 有现货
$49.95 / 个
查看数据手册 →EP4CE55F23C8LN 最大额定值与电气特性
| Family | Cyclone IV E |
| Device Logic Elements | 55,856 |
| Logic Array Blocks (LABs) | 3,491 |
| Embedded Memory | 2,396,160 bits |
| Embedded 18x18 Multipliers | 156 |
| Maximum User I/Os | 324 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Process Technology | 60 nm |
| Core Voltage | 1.2 V |
| 封装 | 484-pin FBGA (FBGA-484) |
| Package Size | 23 x 23 mm |
| Ball Pitch | 1.0 mm |
| 工作温度 | 0C to +85C (commercial) |
| Speed Grade | C8 |
| RoHS 状态 | Compliant (lead-free) |
| Device Type | FPGA |
EP4CE55F23C8LN 23 x 23 mm 引脚配置指南
EP4CE55F23C8LN（23 x 23 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP4CE55F23C8LN.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP4CE55F23C8LN 适用于 6 应用s: Industrial Motor Control and Servo Drives, Video Processing and Display Bridging, Software Defined Radio Baseband, Factory Automation PLC and Protocol Bridging, Test and Measurement Instrumentation, Medical Imaging Front-End Processing.
Industrial Motor Control and Servo Drives
The EP4CE55F23C8LN is well matched to multi-axis industrial servo drives where its 156 18x18 hardware multipliers accelerate Park/Clarke transforms and PID loops in current/torque control. The 4 PLLs generate precisely phased PWM carriers at 20 kHz while the 20 global clock networks distribute encoder feedback clocks across all axes. With 324 user I/Os in the FBGA-484, the device accepts quadrature encoder inputs, Hall sensors, and isolated gate-driver feedback for three to six axis machines. The 2.4 Mbits of embedded memory buffer reference trajectories and oscilloscope captures locally, reducing CPU burden on the host MCU.
推荐
Video Processing and Display Bridging
In video wall controllers and HDMI-to-LVDS display bridges, the EP4CE55F23C8LN's 55,856 logic elements implement color-space conversion, chroma resampling, and frame-rate conversion in real time. The 156 multipliers handle 3-tap to 7-tap scaling filters with headroom for 1080p60 throughput. LVDS I/O support at 324 pins drives dual-link DSI or OpenLDI panels, while the 4 PLLs synthesize the pixel clock independent of the input video timing. Designers appreciate the 2.4 Mbits of block RAM for line-buffer storage without external DDR on small-format designs.
推荐
Software Defined Radio Baseband
The EP4CE55F23C8LN is widely deployed in low-cost software-defined radio (SDR) baseband processors handling DDC/DUC (digital down/up conversion), channelization, and demodulation for narrowband protocols. Its 156 18x18 multipliers implement 64-tap FIR filters and FFT butterflies comfortably, while 2.4 Mbits of block RAM stores coefficient tables and windowed sample buffers. The 4 PLLs derive sample clocks from the ADC's reference, and 324 LVDS-capable I/Os interface to dual-channel 14/16-bit ADC/DAC pairs operating up to 250 MSPS. Commercial temperature rating suits indoor test equipment and ham-radio transceivers.
推荐
Factory Automation PLC and Protocol Bridging
Programmable Logic Controllers (PLCs) and industrial gateways use the EP4CE55F23C8LN to bridge legacy fieldbuses such as Profibus, Modbus RTU, and CANopen to Ethernet/IP or PROFINET. The FPGA's 55,856 logic elements implement up to eight independent protocol stacks concurrently, and the 156 multipliers accelerate CRC and checksum offload. 324 I/Os in FBGA-484 connect to opto-isolated digital inputs, relay-driver outputs, and analog front-ends. The 4 PLLs synthesize isolated RS-485 bit clocks while maintaining deterministic latency under 10 microseconds.
推荐
Test and Measurement Instrumentation
Bench-top instruments such as arbitrary waveform generators, logic analyzers, and protocol exercisers leverage the EP4CE55F23C8LN for waveform synthesis, pattern matching, and trigger sequencing. The 2.4 Mbits of embedded memory store deep acquisition captures without requiring external DDR, simplifying board layout and reducing BOM cost. With 156 18x18 multipliers the device computes real-time statistics and FFT bins at sample rates above 100 MSPS. The FBGA-484 package exposes 324 I/Os for parallel probe channels, and 4 PLLs generate independent sample and trigger clocks.
推荐
Medical Imaging Front-End Processing
Portable ultrasound and patient-monitoring platforms benefit from the EP4CE55F23C8LN's 156 multipliers, which accelerate beamforming and envelope detection in real time. The 2.4 Mbits of block RAM hold coefficient sets and pre-computed look-up tables for multiple transducer apertures. Commercial temperature rating (0C to +85C) covers clinical and lab environments, and 324 user I/Os in FBGA-484 connect to multi-channel ADC arrays and LVDS display panels. Low-power Cyclone IV E architecture simplifies thermal design in compact cart-based ultrasound systems.
推荐
推荐产品汇总
工程参考数据： EP4CE55F23C8LN ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP4CE55F23C8L | EP4CE55F23C8N | EP4CE55F23C7N | EP4CE55F23C6N | EP4CE40F23C8LN |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-484 (F23, 23x23 mm) | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same | FBGA-484 (F23) - same |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 39,600 (-29%) |
| Embedded Memory (bits) | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 1,134,000 (-53%) |
| 18x18 Multipliers | 156 | 156 | 156 | 156 | 156 | 113 (-28%) |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Max User I/Os | 324 | 324 | 324 | 324 | 324 | 324 |
| Speed Grade | C8 | C8 | C8 | C7 (10% slower Fmax) | C6 (20% slower Fmax) | C8 |
| Ball Finish | Pb-free (RoHS) | SnPb (non-RoHS) | Pb-free (RoHS) | Pb-free (RoHS) | Pb-free (RoHS) | Pb-free (RoHS) |
关键差异点
- Lead-free RoHS compliance at the same price band as the SnPb equivalent （对比 EP4CE55F23C8L)
- Faster speed grade for tighter timing margins （对比 EP4CE55F23C7N)
- Significantly more logic elements than the cost-down option （对比 EP4CE40F23C8LN)
设计说明
The FBGA-484 package has a 1.0 mm ball pitch and 23 x 23 mm body, requiring a microvia-capable PCB stack-up (4+ layers with 0.4 mm laser-drilled microvias). Escape routing on the top layer must use dog-bone fan-outs or via-in-pad designs to keep breakouts under the BGA. Reference the Cyclone IV E device handbook Chapter 7 for the recommended decoupling scheme: 100 nF X7R per power pin within 100 mils, plus 10 uF bulk caps per voltage rail.
Power the EP4CE55F23C8LN from a 1.2 V VCCINT supply capable of delivering up to 1.5 A under worst-case toggle patterns, with separate VCCPD (3.3 V or 2.5 V) for I/O pre-drivers and per-bank VCCIO for mixed-voltage signaling. Power-on sequencing requires VCCINT before VCCPD before VCCIO; violating this order can latch-up the device. Use a sequencer IC such as the LM3880 or dedicated FPGA supervisor to enforce the rail order at every power cycle.
Do not apply JTAG signals before the 1.2 V VCCINT rail stabilizes, or configuration may fail with a corrupted bitstream. When using the EPCS or EPCQ configuration flash, ensure the nCONFIG pulse is de-asserted only after VCCINT reaches 90 percent of nominal. Cyclone IV E does not support hot-socketing of JTAG; isolate TMS, TDI, TDO, and TCK with 4.7 kohm pull-ups if the device can be inserted into a powered backplane.
合规信息
Lead-free Pb-free ball finish confirmed by "N" suffix in ordering code. RoHS compliance per Altera/Intel product page. AEC-Q100 not qualified; choose EP4CE55F23I8LN for industrial temperature range.
