EP4CE55F23I8L - Cyclone IV E 55K LEs FPGA | Intel | 484-FBGA
料号： EP4CE55F23I8L ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $204.9 | $204.90 |
| 10 | $184.41 | $1,844.10 |
| 100 | $165.36 | $16,536.00 |
| 250 | $152 | $38,000.00 |
| 500 | $143.43 | $71,715.00 |
EP4CE55F23I8L 概述
A Field Programmable Gate Array (FPGA) is a type of programmable logic device that combines the architecture of gate arrays with the configurability of software. FPGAs occupy a unique position in the semiconductor hierarchy, sitting between fixed-function Application-Specific Integrated Circuits (ASICs) and general-purpose microcontrollers. Within that hierarchy, the Cyclone IV E family is positioned as a low-cost, low-power FPGA branch of Intel's programmable logic portfolio, optimized for high logic density per dollar and per watt, and it remains a popular choice for legacy designs and long-lifecycle industrial platforms.
Key features of the EP4CE55F23I8L include 55,856 logic elements, 2,396,160 bits of embedded RAM (approximately 234 KByte), 156 embedded 18x18 multipliers, four general-purpose PLLs, and 324 maximum user I/O pins. The device supports a wide range of I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. Configuration is supported via active serial (AS), passive serial (PS), and JTAG modes, with optional on-chip encryption for design security.
The Cyclone IV E architecture separates logic into logic array blocks (LABs) of 16 logic elements each, with embedded memory blocks (M9K) of 9 Kbit each arranged in columns. The I/O structure consists of banks supporting independent voltage standards, and the four PLLs provide flexible clock management with multiply, divide, phase shift, and duty cycle control. The 484-FBGA package provides ample signal escape for high I/O-count designs while fitting in a 23 x 23 mm body.
Typical applications include industrial motor control and factory automation, video processing and surveillance, telecommunications line cards and protocol bridging, automotive infotainment and driver assistance subsystems, and test and measurement instrumentation. The combination of mid-range logic capacity, generous embedded memory, and wide I/O count also suits programmable I/O expansion and legacy ASIC prototyping.
When designing with this device, pay close attention to bank voltage assignments and reference voltage pins - mismatched VREF can permanently damage I/O banks. The Quartus II / Quartus Prime design suite from Intel is required for synthesis, place-and-route, and bitstream generation; timing closure is typically the most challenging aspect for designs exceeding 70% logic utilization. Industrial temperature grade parts are ideal for harsh environment designs.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical Quartus design notes not always present in the manufacturer's datasheet, offering engineers a one-stop decision reference for sourcing and selection.
直接替换替代料： EP4CE55F23I8L ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP4CE55F23I8L （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Configuration Modes, Process Technology, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
EP4CE55F23I8LN
✅ 直接替换✓ 有现货
$165.2 / 个
查看数据手册 →EP4CE55F23I7N
✅ 直接替换✓ 有现货
$130.4 / 个
查看数据手册 →EP4CE55F23C8LN
✅ 直接替换✓ 有现货
$105 / 个
查看数据手册 →EP4CE55F23C8L
✅ 直接替换✓ 有现货
$112.9 / 个
查看数据手册 →EP4CE55F23C9LN
✅ 直接替换✓ 有现货
$110.45 / 个
查看数据手册 →EP4CE55F23C9L
✅ 直接替换✓ 有现货
$76.73 / 个
查看数据手册 →EP4CE55F23I8L 最大额定值与电气特性
| Device Family | Cyclone IV E |
| Logic Elements (LEs) | 55,856 |
| Embedded Memory Bits | 2,396,160 bits (~234 Kbit / ~292.5 KByte) |
| Maximum User I/O Pins | 324 |
| Embedded 18x18 Multipliers | 156 |
| General-Purpose PLLs | 4 |
| Process Technology | 60 nm |
| Core Supply Voltage | 1.2 V |
| 封装 | 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) |
| 工作温度范围 | -40C to +100C (Industrial) |
| Configuration Modes | AS, PS, JTAG |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X |
| Speed Grade | 8 |
| RoHS 状态 | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes |
EP4CE55F23I8L 484-ball fbga (23 x 23 mm, 1.0 mm pitch) 引脚配置指南
EP4CE55F23I8L（484-ball fbga (23 x 23 mm, 1.0 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP4CE55F23I8L.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP4CE55F23I8L 适用于 6 应用s: Industrial Motor Control and Factory Automation, Video Processing and Surveillance Systems, Telecommunications Line Cards and Protocol Bridging, Automotive Infotainment and Driver Assistance Subsystems, Test and Measurement Instrumentation, Programmable I/O Expansion and Legacy ASIC Prototyping.
Industrial Motor Control and Factory Automation
The EP4CE55F23I8L is well suited for industrial motor control and factory automation because it offers 55,856 logic elements for PWM generators, encoder decoding, and field-oriented control loops, plus 156 18x18 multipliers that accelerate Park and Clarke transforms. Its industrial -40C to +100C temperature rating ensures reliable operation in factory cabinets and outdoor enclosures. Four general-purpose PLLs provide clean clock synthesis for resolver-excitation chains and EtherCAT PHYs, while 324 user I/O pins simplify connection to multi-axis drives, HMI panels, and digital I/O racks. In a typical six-axis servo design, the FPGA performs current-loop math at sub-microsecond latency while the host CPU handles trajectory planning.
推荐
Video Processing and Surveillance Systems
The EP4CE55F23I8L fits video processing and surveillance because its 2,396,160 bits of embedded memory absorb multiple lines of pixel data, and the 156 dedicated 18x18 multipliers perform real-time FIR filtering, scaling, and color-space conversion on HD video streams. With 324 user I/O pins it supports multiple camera inputs, DDR2/DDR3 memory interfaces, and high-speed LVDS links to image sensors. The four PLLs generate independent pixel clocks for multi-camera capture, while the industrial temperature grade allows deployment in outdoor IP-camera housings. A typical design uses the FPGA as a pre-processor before MPEG/H.264 compression, offloading real-time tasks from an application processor.
推荐
Telecommunications Line Cards and Protocol Bridging
Telecommunications line cards and protocol bridges benefit from the EP4CE55F23I8L because 55,856 logic elements can implement multi-channel TDM, HDLC, and serial protocol bridges concurrently, while the 324 I/O pins provide ample LVDS and HSTL signaling for backplane interfaces. The four PLLs synthesize independent bit clocks for E1/T1, gigabit Ethernet PHYs, and inter-FPGA links. Industrial temperature operation and long product lifecycle support telecom equipment deployed in central offices and outdoor cell sites. A typical application bridges legacy E1/T1 streams to Ethernet or implements a multi-port serial concentrator.
推荐
Automotive Infotainment and Driver Assistance Subsystems
The EP4CE55F23I8L works well in automotive infotainment and ADAS subsystems because it integrates display controllers, video overlay, and CAN/LIN bridging on a single device with 55,856 logic elements and 156 DSP multipliers for low-latency image preprocessing. The industrial temperature grade (-40C to +100C) handles cabin thermal stress, and the 324 user I/O pins connect to multiple camera inputs, displays, and automotive network PHYs. The four PLLs drive independent pixel clocks for rear-view, surround-view, and central display streams. Typical deployments use the FPGA as a flexible bridge between image sensors and a host application processor running Linux/QNX infotainment stacks.
推荐
Test and Measurement Instrumentation
Test and measurement instruments benefit from the EP4CE55F23I8L because its 55,856 logic elements can implement arbitrary waveform generators, real-time DSP filters, and custom triggering logic in a single device. The 156 18x18 multipliers accelerate FFT, FIR, and correlation pipelines, while the four PLLs provide multiple synchronized sampling clocks for high-speed ADCs and DACs. The 324 user I/O pins accommodate multi-channel analog front ends, parallel LVDS ADC interfaces, and front-panel connectors. Industrial temperature grading enables portable and lab instrument designs that must operate across controlled environments. A typical use case is a 4-channel 200 MSPS digitizer with on-FPGA real-time FFT.
推荐
Programmable I/O Expansion and Legacy ASIC Prototyping
The EP4CE55F23I8L is well suited for programmable I/O expansion and legacy ASIC prototyping because its 324 user I/O pins and flexible I/O standard support (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI) allow bridging between mismatched voltage domains and protocols. With 55,856 logic elements it can prototype mid-complexity ASICs and provide reconfigurable I/O conditioning for industrial PCs, single-board computers, and legacy backplanes. The four PLLs generate conversion clocks for asynchronous domains, and embedded M9K memory blocks buffer protocol packets. Designers often use this part to replace multiple discrete logic devices and bridges, shrinking BOM cost and PCB area.
推荐
推荐产品汇总
工程参考数据： EP4CE55F23I8L ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP4CE55F23I8LN | EP4CE55F23I7N | EP4CE55F23C8LN | EP4CE55F23C8L | EP4CE55F23C9LN |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same | 484-ball FBGA - same |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 |
| Embedded Memory (bits) | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 |
| Max User I/O | 324 | 324 | 324 | 324 | 324 | 324 |
| Embedded 18x18 Multipliers | 156 | 156 | 156 | 156 | 156 | 156 |
| Speed Grade | 8 | 8 | 7 (slower) | 8 | 8 | 9 (faster) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
关键差异点
- Same silicon with explicit lead-free terminal finish designation （对比 EP4CE55F23I8LN)
- Faster speed grade for higher Fmax in timing-critical paths （对比 EP4CE55F23C9LN)
- Slower speed grade with relaxed timing margin （对比 EP4CE55F23I7N)
- Industrial temperature rating for harsh environments （对比 EP4CE55F23C8LN)
设计说明
Estimated: Cyclone IV E core current for EP4CE55F23I8L at full utilization is roughly 500 mA to 1 A from a 1.2 V supply, plus I/O bank current proportional to switching frequency and load. Provide at least four 0.1 uF decoupling capacitors around the BGA perimeter plus bulk 10 uF to 22 uF ceramics on each voltage rail. Use a wide power plane split with decoupling placed as close to the balls as the PCB stack-up allows. Estimated value: design for ~1.5 W quiescent + dynamic margin when sizing regulators.
The 484-ball FBGA uses 1.0 mm ball pitch with a 23 x 23 mm body. Use a minimum 4-layer stack-up with continuous GND and PWR planes under the device. Microvia-in-pad or via-in-pad construction is recommended to escape the fine-pitch BGA; ensure proper via tenting and solder fillet quality. Provide at least 6 thermal vias in the center pad array to improve theta-JA. Match trace lengths within each LVDS / DDR byte-lane group to within 50 mil to meet setup/hold.
Do not power I/O banks before their reference voltage (VREF) pins are valid - this can latch-up the I/O buffers and permanently damage the device. Always assert VCCIO and VREF together per the datasheet power sequencing guidelines. Configuration mode pins MSEL[3..0] must be tied to the correct logic levels for AS, PS, or JTAG mode; floating or incorrect MSEL values are a common boot failure root cause. Verify nCONFIG and nSTATUS are pulled high with a proper external pull-up resistor (typically 10 kohm).
Estimated: At full IO toggling and high logic utilization, junction temperature can approach the industrial 100C ceiling with minimal airflow. Derate I/O switching activity or add forced-air cooling if ambient exceeds 70C. Use the Cyclone IV E PowerPlay Early Power Estimator (EPE) within Quartus Prime to model real workloads before committing to PCB layout. Estimated thermal resistance theta-JA for the 484-FBGA is roughly 15 C/W with a JEDEC-compliant test board; reduce by adding a heatsink or thermal interface for high-power designs.
For DDR2/DDR3 memory interfaces, follow the Micron-compatible PCB layout checklist and use Series-Stub-Switched-Termination (SSSTL) if signal integrity requires it. For LVDS pairs, keep intra-pair skew below 10 mil and inter-pair skew below 50 mil. Reference each I/O bank with its own VREF pin and decouple locally with 0.1 uF and 1 uF capacitors. Use the Quartus Prime pin planner to assign I/O standards and verify the I/O bank voltage before place-and-route; mismatched VCCIO settings are a top cause of timing failure.
合规信息
RoHS and lead-free per Intel/Altera product page. Industrial temperature grade is NOT AEC-Q100 qualified - true AEC-Q100 automotive parts are designated with automotive-specific ordering codes (e.g., RAA, Q-grade suffixes).
