EP4CE6F17C8 - 6K LEs Cyclone IV E FPGA, FBGA-256 | Intel (Altera)
料号： EP4CE6F17C8 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $28.75 | $287.50 |
| 100 | $24.1 | $2,410.00 |
| 500 | $21.4 | $10,700.00 |
| 1,000 | $19.85 | $19,850.00 |
EP4CE6F17C8 概述
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM and DSP blocks. FPGAs occupy a middle ground between fixed-function ASICs and software-driven microcontrollers: they offer hardware-level parallelism and timing determinism while remaining fully re-programmable in the field. Cyclone IV E specifically targets cost-sensitive, high-volume, low-power applications and is part of Intel's mainstream FPGA portfolio alongside higher-density Cyclone IV GX and Stratix families.
Key features of the EP4CE6F17C8 include support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards across up to 8 I/O banks; configuration via JTAG, Active Serial (AS), Passive Serial (PS), and Fast Passive Parallel (FPP) modes; and operation over the commercial 0 C to 85 C temperature range (the C8 speed grade). The FBGA-256 package is a 1.0 mm pitch FineLine BGA suitable for space-constrained boards, and the F17 ordering code designates that specific package.
Architecturally, the EP4CE6F17C8 LE fabric uses a 4-input LUT-based logic element with embedded carry chains and register chains, giving efficient implementation of arithmetic, state machines, and pipelined data paths. Dedicated M9K memory blocks (9,216 bits each) provide distributed RAM, ROM, and FIFO functions, while the 18 x 18 multiplier blocks accelerate DSP workloads such as filtering and modulation. Two general-purpose PLLs drive clock synthesis and skew management for the global clock networks.
Typical applications include industrial control and motor drive, machine vision pre-processing, USB/PCIe bridging with external PHY, LED video wall controllers, consumer display interfaces, and logic consolidation in telecom line cards. Its low static power (typical core currents in tens of mA) and reconfigurability make it popular for prototyping ASIC functionality and for production deployments in cost-sensitive embedded systems.
When designing with this device, allocate sufficient PCB layers (typically four or more) to route the 256-ball BGA escape and to maintain signal-integrity for high-speed LVDS pairs. Use Intel Quartus Prime (or the legacy Quartus II) for synthesis, place-and-route, and timing closure; verify pin assignments against the pin-out file before fabrication because the FBGA-256 ball map is package-specific.
This page consolidates distributor pricing, datasheet resources, drop-in alternatives in the same FBGA-256 footprint, and practical design notes beyond what the manufacturer datasheet alone provides.
直接替换替代料： EP4CE6F17C8 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP4CE6F17C8 （相同外形与封装尺寸） ——差异在于 Package, Mounting Type, Process Technology, Embedded Memory, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
EP4CE6F17C7N
✅ 直接替换✓ 有现货
$3.6 / 个
查看数据手册 →EP4CE6F17C7
✅ 直接替换✓ 有现货
$17.49 / 个
查看数据手册 →EP4CE6F17C6N
✅ 直接替换✓ 有现货
$17.95 / 个
查看数据手册 →EP4CE6F17C6
✅ 直接替换✓ 有现货
$12.1 / 个
查看数据手册 →EP4CE10F17C8N
✅ 直接替换✓ 有现货
$17.95 / 个
查看数据手册 →EP4CE10F17C8N
✅ 直接替换✓ 有现货
$17.95 / 个
查看数据手册 →EP4CE6F17C8 最大额定值与电气特性
| Device Family | Cyclone IV E |
| Logic Elements (LEs) | 6,272 |
| Logic Array Blocks (LABs) | 392 |
| Embedded Memory Bits | 276,480 |
| M9K Memory Blocks | 30 |
| Embedded 18 x 18 Multipliers | 15 |
| PLLs | 2 |
| Global Clock Networks | 10 |
| Maximum User I/Os | 179 |
| 封装 | 256-ball FBGA (F17), 1.0 mm pitch, 17 x 17 mm |
| Process Technology | 60 nm low-power SRAM |
| Core Supply Voltage | 1.0 V to 1.2 V |
| 工作温度 | 0 C to 85 C (commercial, C8 speed grade) |
| Speed Grade | C8 |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP) |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL, HSTL |
| RoHS 状态 | Compliant |
EP4CE6F17C8 256-ball fbga (f17), 1.0 mm pitch, 17 x 17 mm 引脚配置指南
EP4CE6F17C8（256-ball fbga (f17), 1.0 mm pitch, 17 x 17 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP4CE6F17C8.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP4CE6F17C8 适用于 7 应用s: Industrial Motor Control and Drive, Machine Vision Pre-Processing, USB and PCIe Bridge / Glue Logic, LED Video Wall and Display Controller, Consumer Display Interface Conversion, ASIC Prototyping and Logic Consolidation, Telecom Line Card Glue Logic.
Industrial Motor Control and Drive
The EP4CE6F17C8 fits industrial motor control because its 6,272 logic elements and 15 hardware 18 x 18 multipliers can implement field-oriented control (FOC) loops, space-vector PWM, and encoder decoding in a single device. The 2 integrated PLLs derive high-resolution PWM carrier frequencies (up to tens of kHz with sub-microsecond duty resolution) from a low-frequency crystal, while 10 global clock networks distribute these phases to logic without skew. The FBGA-256 (F17) footprint gives 179 user I/Os, enough for multi-axis drives with parallel feedback busses. Designers typically run Quartus Prime's TimeQuest timing analyzer to close the critical path through the multiplier chain and route the LVDS pairs to the encoder interface with controlled impedance.
推荐
Machine Vision Pre-Processing
The EP4CE6F17C8 is well suited as a frame-grabber pre-processor or low-latency pixel pipeline. Its 30 M9K blocks (276 Kbits total) buffer line-scan video at camera data rates, and the 15 dedicated 18 x 18 multipliers accelerate 3 x 3 convolution kernels, Sobel edge detection, and Bayer demosaic in real time. LVDS input support lets the device accept gigabit-class sensor lanes directly, while its 179 I/Os can drive parallel RGB or MIPI bridge chips for downstream processing. Typical reference designs in Intel FPGA application notes demonstrate 1080p60 processing at roughly 148 MHz pixel clock within the device's logic and DSP budget.
推荐
USB and PCIe Bridge / Glue Logic
The EP4CE6F17C8 commonly serves as a glue-logic bridge between ASSPs, microcontrollers, and high-speed serial PHYs. Its 6,272 LEs comfortably implement protocol converters (for example, UTMI to parallel FIFO, or I2S/TDM to USB Audio Class), and its 2 PLLs multiply the 24 MHz reference up to the 480 MHz USB 2.0 high-speed clock domain. Quartus reference designs show the device acting as a soft PHY bridge for low-cost Nios II embedded cores that handle control endpoints. The FBGA-256 (F17) package provides more than enough I/O for multiple parallel buses plus JTAG and AS configuration ports.
推荐
LED Video Wall and Display Controller
The EP4CE6F17C8 is a typical scan-driver for LED video walls where each device pixel-clocks rows of LEDs at refresh rates of 60 Hz to 480 Hz. The 276 Kbits of embedded RAM is enough to double-buffer two scan lines at 1920-pixel resolution, while the 179 user I/Os are sufficient to drive 24-bit-per-pixel RGB chains or shift-register cascades. The 15 multipliers can compute gamma correction and color-space conversion (e.g. YCbCr to RGB) in real time without external processors. The C8 commercial speed grade is sufficient for most indoor wall refresh rates; designers who need outdoor 1000 Hz refresh often step up to the C7 grade.
推荐
Consumer Display Interface Conversion
The EP4CE6F17C8 is widely deployed as a low-cost HDMI / DisplayPort / MIPI-DSI format converter in consumer electronics. Its LVDS-capable I/O banks handle incoming TMDS or sub-LVDS lanes, and its 2 PLLs generate the pixel clock and link clock domains required by the output protocol. Internal M9K blocks implement line buffers for chroma upsampling and frame-rate conversion, while 10 global clock networks keep multi-rate domains skew-controlled. The FBGA-256 (F17) package is small enough for slim TV mainboards yet provides enough I/O for two input ports plus one output.
推荐
ASIC Prototyping and Logic Consolidation
Designers frequently choose the EP4CE6F17C8 to prototype mid-complexity ASIC functions before committing to mask sets, or to consolidate multiple discrete CPLDs and glue logic onto a single programmable device. Its 6,272 LEs map comfortably to RTL blocks of roughly 30,000 to 50,000 gates, and the 30 M9K blocks cover most on-chip buffer and FIFO requirements. Quartus Prime's incremental compilation lets multiple design teams work in parallel on the same F17-pinout device. Once the ASIC is fabricated, the same board footprint can be re-populated with a smaller or larger Cyclone IV E variant for low-volume production.
推荐
Telecom Line Card Glue Logic
In telecom line cards, the EP4CE6F17C8 functions as a low-latency glue-logic device between network processors, framers, and SERDES macros. Its 179 I/Os handle parallel TDM buses, I2C/SPI control planes, and interrupt aggregation, while 2 PLLs derive the necessary backplane clocks. The embedded multipliers are useful for checksum and CRC acceleration on ingress traffic. The commercial 0-85 C temperature grade is acceptable for climate-controlled CO environments, and the FBGA-256 footprint is compatible with standard telecom PCB stackups.
推荐
推荐产品汇总
工程参考数据： EP4CE6F17C8 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP4CE6F17C7N | EP4CE6F17C7 | EP4CE6F17C6N | EP4CE6F17C6 | EP4CE10F17C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-ball FBGA (F17) | 256-ball FBGA (F17) - same | 256-ball FBGA (F17) - same | 256-ball FBGA (F17) - same | 256-ball FBGA (F17) - same | 256-ball FBGA (F17) - same |
| Logic Elements | 6,272 | 6,272 | 6,272 | 6,272 | 6,272 | 10,320 (+65%) |
| Embedded Memory (bits) | 276,480 | 276,480 | 276,480 | 276,480 | 276,480 | 423,936 (+53%) |
| 18 x 18 Multipliers | 15 | 15 | 15 | 15 | 15 | 23 |
| PLLs | 2 | 2 | 2 | 2 | 2 | 2 |
| Speed Grade | C8 (commercial) | C7 (faster) | C7 (faster) | C6 (fastest) | C6 (fastest) | C8 |
| Lead-Free / RoHS | Required check (no N suffix) | Yes (lead-free) | No N suffix | Yes (lead-free) | No N suffix | Yes (lead-free) |
| Operating Temperature | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C |
关键差异点
- Lowest-cost Cyclone IV E with full FBGA-256 F17 pin-out （对比 EP4CE10F17C8N)
- C8 speed grade gives widest distributor availability （对比 EP4CE6F17C7N)
- Drop-in compatibility across the entire EP4CE6F17 ordering family （对比 EP4CE6F17I7N)
设计说明
The 256-ball FBGA-256 (F17) package uses 1.0 mm ball pitch on a 17 x 17 mm body, so escape routing on a 4-layer PCB is feasible but tight. Recommended: use micro-via-in-pad (0.1 mm via drill) for inner-row balls, route signal traces on the top layer with reference planes on layer 2, and dedicate layer 4 to high-current VCCINT and VCCIO planes. Maintain 50 ohm single-ended and 100 ohm differential impedance for LVDS pairs and provide at least 4 decoupling caps per VCCIO bank (0.1 uF, 1 nF, 10 uF, and 100 uF bulk).
Estimated: at typical utilization around 60% logic + 50% RAM + active DSP, total core current is on the order of 250-400 mA from VCCINT (1.2 V), plus each VCCIO bank drawing up to 100 mA depending on toggle rate. Use a dedicated switching regulator (such as the TI TPS54x20 series) followed by an LDO for VCCINT to minimize ripple, because VCCINT noise directly translates to jitter on the global clock networks. Decouple each VCCIO bank close to its balls with the cap stack noted above.
Place the 50 MHz or 100 MHz configuration clock crystal within 1 cm of the CLKUSR/CLK pins, with a guard ring around it to isolate from switching I/O. Route JTAG TDI/TDO/TMS/TCK as a bus with a 4.7 kohm pull-up on TCK, and place the JTAG header on the board edge for probe access. LVDS pairs should be length-matched within 20 ps and routed on the same layer to avoid via discontinuities. Use Quartus Pin Planner early in the schematic capture to lock bank assignments before PCB layout starts.
Do not mix 1.5 V and 1.8 V I/O standards in the same VCCIO bank - each bank must run at one VCCIO level. Configuration mode pins (MSEL[3..0]) must be set via resistor pull-ups/pull-downs to match the desired configuration scheme (AS, PS, FPP, JTAG-only), otherwise the device will not boot. The CONF_DONE pin should be pulled high externally with a 10 kohm resistor to 3.5 V to indicate successful configuration. Forgetting to enable the nCONFIG pull-up during AS mode is the most common first-board bring-up mistake.
合规信息
RoHS compliant per Altera/Intel material declaration. Lead-free designation is part-number dependent (N suffix indicates lead-free finish). Not AEC-Q100 qualified (FPGAs are typically qualified to JEDEC JESD47 rather than AEC-Q100).
