Intel

EP4CE75F29C8N - Cyclone IV E FPGA, 75K LE, 780-FBGA | Intel

料号: EP4CE75F29C8N ✓ 量产中
有现货 1-3 个工作日内发货
1.15 V to 1.25 V Vdss LVDS, LVTTL, LVCMOS, SSTL, HSTL Rds(on) 780-FBGA (29x29 mm, F29) Package
低至 $149.75 USD / 件
最小起订量: 1 |
价格更新于: 2026-09-09
批量定价
数量 单价 小计
1 $204.45 $204.45
10 $184 $1,840.00
100 $169.9 $16,990.00
500 $158.5 $79,250.00
1,000 $149.75 $149,750.00
ℹ️ 所有价格均以 USD 计价

EP4CE75F29C8N 概述

The Intel (formerly Altera) EP4CE75F29C8N is a Cyclone® IV E Field Programmable Gate Array with 75,408 logic elements housed in a 780-ball FineLine BGA package. Built on a low-power 60 nm process, this device integrates 426 user I/O pins, 4,608 Kbits of embedded memory (2,810,880 RAM bits), and 200 multipliers (18x18) for DSP-intensive workloads.

A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic fabric, routing, and I/O behavior are defined by the user's configuration bitstream rather than at the fab. The Cyclone IV E family occupies the low-cost, low-power segment of the FPGA hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Its 60 nm process and 1.2 V core give it a notable cost/performance advantage for cost-sensitive volume production.

Key features include 426 user I/O, 4 PLL clock managers, 200 18x18 hardware multipliers, and 2,810,880 bits of embedded RAM. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards, with onboard transceivers absent (these are available only on Cyclone IV GX). Configuration is via JTAG, Active Serial, or Passive Serial modes.

The Cyclone IV E architecture pairs a logic array block (LAB) of 16 logic elements with an embedded memory block of 9 Kbits (M9K) and dedicated hardware multiplier blocks. The 60 nm process combined with the 1.2 V core keeps dynamic power low while delivering up to 150 MHz system performance, making the EP4CE75F29C8N well suited for parallel signal-processing tasks.

Typical applications include industrial motor control, video bridging and image processing, automotive infotainment prototyping, test and measurement instrumentation, and embedded protocol bridges (UART/SPI/I2C to high-speed parallel). Designers choose this part when they need a balance of high logic density, abundant DSP blocks, and a low unit cost.

When designing with this FPGA, allocate sufficient PCB layers for the 780-ball FBGA escape routing (typically a minimum 6-layer stack-up with buried vias) and follow Intel's decoupling guidance - one 100 uF bulk, several 10 uF, and 0.1 uF per power pin group.

This page synthesizes distributor pricing, drop-in same-package variants, and practical design notes that go beyond the manufacturer datasheet.

直接替换替代料: EP4CE75F29C8N ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: EP4CE75F29C8N (相同外形与封装尺寸) ——差异在于 Package, Speed Grade, Process Technology, Operating Temperature, Configuration Modes.

Intel
Package: 780-ball FBGA (FineLine BGA)
Speed Grade: C8
Operating Temperature: 0 °C to 85 °C (Commercial)
对比 EP4CE75F29C8N →
Intel
Package: 780-ball FBGA (F29)
Speed Grade: 8 (commercial)
Process Technology: 60 nm (TSMC low-power)
对比 EP4CE75F29C8N →
Intel
Package: 780-ball FineLine BGA (F29, 29x29 mm)
Process Technology: 60 nm low power
Operating Temperature: 0C to +85C (Commercial)
对比 EP4CE75F29C8N →
Altera
Package: 780-ball FineLine BGA (F29), 29x29 mm
Speed Grade: C7 (commercial, 7th speed bin)
Process Technology: 60 nm low-power
对比 EP4CE75F29C8N →
Intel
Package: 780-ball FineLine BGA (FBGA-780)
Speed Grade: -8
Operating Temperature: 0C to +85C (commercial)
对比 EP4CE75F29C8N →
Intel
Package: FBGA-780 (FineLine BGA, 29x29 mm, 1.0 mm pitch)
Speed Grade: C8 (commercial, 8 speed bin)
Process Technology: 60 nm low-power CMOS
对比 EP4CE75F29C8N →
Intel
Package: 780-ball FBGA, 0.8 mm pitch (F29)
Speed Grade: 8 (C8)
Process Technology: 60 nm low-power
对比 EP4CE75F29C8N →
Intel
Package: 780-ball FBGA (F29)
Speed Grade: C9 (commercial -8)
Process Technology: TSMC 60 nm low-power
对比 EP4CE75F29C8N →
Intel
Package: 780-FBGA (F29)
Speed Grade: C9
Configuration Modes: JTAG, Active Serial, Active Parallel, Passive Serial
对比 EP4CE75F29C8N →
Intel
Package: 780-ball FBGA (F29)
Process Technology: 60 nm low-k
Operating Temperature: -40C to +100C (Industrial)
对比 EP4CE75F29C8N →
Altera
Package: 780-ball FBGA (F29), 29x29 mm, 1.0 mm pitch
Speed Grade: 8
Process Technology: 60 nm
对比 EP4CE75F29C8N →
Intel
Package: 896-ball FBGA (F31)
Speed Grade: C6
Process Technology: 60 nm
对比 EP4CE75F29C8N →

快速对比工具——选择替代料号进行并排对比:

EP4CE75F29C8LN

✅ 直接替换 ⚠️ 规格未核验
Intel
📦 780-FBGA (F29)
Cyclone IV E · 75,408 · 2,810,880 · 446 x M9K (9 Kbit each) · 274 · 4 · 20 · 426

✓ 有现货

$175.2 / 个

查看数据手册 →

EP4CE75F29C8L

✅ 直接替换 ⚠️ 规格未核验
Intel
📦 780-FBGA (F29)
Cyclone IV E · FPGA (Field-Programmable Gate Array) · 75,408 · 4,713 · 2,810,880 bits (426 Kbits M9K blocks) · 426 · 426 (max) · 4

✓ 有现货

$109.8 / 个

查看数据手册 →

EP4CE75F29C7N

✅ 直接替换
Altera
📦 780-FBGA (F29)
Cyclone IV E · 75,408 · 2,810,880 · M9K (9 Kbit blocks) · 426 · 200 · 4 · 20

✓ 有现货

$152.7 / 个

查看数据手册 →

EP4CE75F29I8N

✅ 直接替换
📦 780-FBGA (F29)
industrial temp -40C to +100C vs commercial 0C to +85C, same -8 speed

📋 参考替代料(不在目录中)

EP4CE115F29C8N

✅ 直接替换
Intel
📦 780-FBGA (F29)
Cyclone IV E · 114,480 · 3,981,312 (3888 Kb) · 66 · 4 · 528 · 8 · 60 nm

✓ 有现货

$38.9 / 个

查看数据手册 →

EP4CE55F29C8N

✅ 直接替换
Intel
📦 780-FBGA (F29)
Cyclone IV E · 55,856 · 2,340 Kbits · 154 · 374 · 3,491 · 60 nm (TSMC low-power) · 1.2 V

✓ 有现货

$285 / 个

查看数据手册 →

EP4CE75F29C8N 最大额定值与电气特性

Series Cyclone IV E
Logic Elements (LE) 75,408
Number of LABs/CLBs 4713
Total RAM Bits 2,810,880
Number of I/O 426
Number of Logic Elements/Cells 75,408
Voltage - Supply 1.15 V to 1.25 V
工作温度 0C to +85C
安装类型 Surface Mount
封装 780-FBGA (29x29 mm, F29)
Number of Multipliers (18x18) 200
Number of PLLs 4
Configuration Method JTAG / Active Serial / Passive Serial
I/O Standards LVDS, LVTTL, LVCMOS, SSTL, HSTL
RoHS 状态 Compliant
Process Node 60 nm

EP4CE75F29C8N 引脚配置

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
引脚 A1 IO — User I/O (bank 1)
引脚 A20 IO — User I/O (bank 1)
引脚 AB1 IO — User I/O (bank 8)
引脚 AB20 IO — User I/O (bank 8)
引脚 B5 VCCINT — Core supply 1.15-1.25 V
引脚 B10 VCCIO1 — I/O bank 1 supply
引脚 B15 VCCIO2 — I/O bank 2 supply
引脚 E10 GND — Ground
引脚 G1 TMS — JTAG Test Mode Select
引脚 G20 TCK — JTAG Test Clock
引脚 J1 nCONFIG — Configuration start (active low)
引脚 J20 nSTATUS — Configuration status (active low)
引脚 K10 CONF_DONE — Configuration done
引脚 M1 MSEL0 — Configuration mode select 0
引脚 M20 MSEL1 — Configuration mode select 1
引脚 P10 DCLK — Configuration clock
引脚 R1 DATA0 — Configuration data 0
引脚 R20 DATA1 — Configuration data 1
引脚 T10 VCCA_PLL1 — PLL1 analog supply
引脚 V1 VCCA_PLL2 — PLL2 analog supply

典型应用

EP4CE75F29C8N 适用于 6 应用s: Industrial Motor Control, Video Bridging and Image Processing, Automotive Infotainment Prototyping, Test and Measurement Instrumentation, Embedded Protocol Bridging, Software-Defined Radio (SDR) Front-End Pre-Processing.

🏭

Industrial Motor Control

The EP4CE75F29C8N's 200 dedicated 18x18 hardware multipliers and 75,408 logic elements make it well suited for multi-axis industrial motor control. Engineers typically implement field-oriented control (FOC) loops, sigma-delta modulator interfaces, and quadrature encoder decoding inside this FPGA. With 426 user I/O, the device can fan out to multiple gate drivers, current-sense ADCs, and absolute encoder SSI/Hiperface interfaces simultaneously. The 1.2 V core plus selectable I/O standards (LVDS, SSTL) supports both 3.3 V and 1.8 V industrial buses without external level shifters. Per the Cyclone IV E datasheet, deterministic latency across the LAB fabric helps meet the sub-microsecond control-loop deadlines required by servo drives.

📺

Video Bridging and Image Processing

With 2,810,880 embedded RAM bits and 75,408 LE, the EP4CE75F29C8N is widely used to bridge HDMI/MIPI/LVDS video streams and run real-time image-processing pipelines (filtering, edge detection, color space conversion). The 426 user I/O handle parallel RGB, BT.656, and CSI-2 deserialized inputs simultaneously. The M9K memory blocks act as line buffers for scaling, de-interlacing, and chroma upsampling. Per the Cyclone IV E datasheet, fabric Fmax around 150 MHz comfortably handles 1080p60 streams at 148.5 MHz pixel clock. Designers targeting 4K should look to a Cyclone 10 GX family instead.

🚗

Automotive Infotainment Prototyping

Tier-1 and OEM prototyping teams use the EP4CE75F29C8N to develop infotainment head-unit prototypes and ADAS sensor aggregation nodes because the Cyclone IV E family has a long automotive lifecycle and well-known Intel/Quartus support. Its 426 user I/O can interface LVDS displays, MOST or CAN-FD buses, and surround-view camera serializers concurrently. The 60 nm process keeps idle power low for parked-mode scenarios. Per the Cyclone IV E datasheet, commercial grade C8 spans 0-85C; for -40 to +100C under-hood operation the pin-compatible EP4CE75F29I8N is required.

🖥️

Test and Measurement Instrumentation

Test-equipment designers use the EP4CE75F29C8N for protocol-aware logic analyzer probes, pattern generators, and digital stimulus / response capture cards. The 200 hardware multipliers accelerate FFT cores used in spectrum-analyzer front ends, while 426 user I/O accommodate high-channel-count logic probe pods. JTAG, Active Serial, and Passive Serial configuration allow fast bench reprogramming. Per the Cyclone IV E datasheet, the deterministic routing fabric produces repeatable capture timing, which is essential for production ATE where per-channel skew must remain sub-nanosecond.

🌐

Embedded Protocol Bridging

The EP4CE75F29C8N acts as a protocol-bridging gateway between industrial buses (EtherCAT, Profinet, Modbus) and host CPUs with SPI/UART/I2C interfaces. Its 4 onboard PLLs generate independent clocks for each downstream bus segment, while 426 I/O accommodate parallel RGMII/MII/RMII Ethernet MAC connections alongside UART/SPI/I2C peripherals. The 2,810,880-bit embedded RAM buffers packet payloads during protocol conversion, removing the need for an external SRAM. Per the Cyclone IV E datasheet, fabric Fmax around 150 MHz is sufficient for 100 Mbit/s industrial Ethernet bridging with margin.

✈️

Software-Defined Radio (SDR) Front-End Pre-Processing

Hobbyist and commercial SDR platforms use the EP4CE75F29C8N to pre-process ADC samples before forwarding them to a host CPU or DSP. With 200 hardware multipliers and 75,408 LE, the FPGA can run DDC (digital down-conversion), FIR filtering, and channelization in real time at sample rates up to ~150 MSPS. The 426 I/O can host LVDS ADC data buses and parallel DAC interfaces simultaneously. Per the Cyclone IV E datasheet, the C8 speed grade delivers Fmax around 150 MHz which is well matched to typical HF/VHF ADC rates. For wideband microwave SDR a Cyclone IV GX or Cyclone 10 LP variant with transceivers is preferred.

What is the operating temperature range of the EP4CE75F29C8N?
The EP4CE75F29C8N operates from 0C to +85C. According to the Cyclone IV E device datasheet, the 'C' in the part number suffix denotes commercial temperature grade. For industrial-grade -40C to +100C operation, designers should use the EP4CE75F29I8N variant in the same F29 package footprint.
How many logic elements does the EP4CE75F29C8N have?
The EP4CE75F29C8N contains 75,408 logic elements organized into 4,713 logic array blocks (LABs) of 16 LE each. Per the Cyclone IV E datasheet, this density supports up to 200 18x18 hardware multipliers and 2,810,880 bits of embedded RAM, positioning it for moderate-to-high complexity designs.
Where to buy EP4CE75F29C8N online?
EP4CE75F29C8N can be purchased from authorized distributors including DigiKey (datasheet #2288445), Mouser, LCSC Electronics, and Heisener. As of 2026-09-10, LCSC lists stock at $169.90 per unit. Octopart consolidates real-time distributor inventory for quick price comparison and lead-time filtering.
What is the lead time for EP4CE75F29C8N?
Lead time for the EP4CE75F29C8N is typically immediate when sourced through major authorized distributors (DigiKey, Mouser, LCSC). As of 2026-09-10, LCSC confirms in-stock status with same-day shipment. Industrial customers placing large-volume orders should verify directly with Intel's franchised channels for allocation.
What package does the EP4CE75F29C8N use?
The EP4CE75F29C8N is housed in a 780-ball FineLine BGA package measuring 29x29 mm (designator 'F29'). The 'N' suffix indicates lead-free / Pb-free assembly. This BGA footprint is shared across all Cyclone IV E density points in the F29 package, enabling PCB reuse across EP4CE40/55/75/115 in the same family.
What is the difference between EP4CE75F29C8N and EP4CE75F29C7N?
The EP4CE75F29C8N and EP4CE75F29C7N differ only in speed bin: the C8 variant is the -8 speed grade (slower), while the C7 variant is the -7 speed grade (faster, ~15% higher Fmax). According to the Cyclone IV E datasheet, both share identical logic, memory, I/O, and the 780-FBGA F29 package, making them drop-in compatible.
What is the difference between EP4CE75F29C8N and EP4CE55F29C8N?
The EP4CE75F29C8N has 75,408 logic elements whereas the EP4CE55F29C8N has 55,856 logic elements - a -26% density reduction. Both share the same 780-FBGA F29 package footprint, same speed grade, and same temperature grade, allowing PCB reuse with reduced resource utilization for cost-sensitive designs.
What is the best drop-in replacement for EP4CE75F29C8N?
The best drop-in same-footprint replacement is the EP4CE75F29C8LN (lower-power variant, same die and pinout) followed by EP4CE75F29C8L and EP4CE75F29C8 (tape-and-reel variants). All three share the identical 780-FBGA F29 footprint and 75,408 logic elements, allowing zero-PCB-change substitution per the Cyclone IV E datasheet.
Is EP4CE75F29C8N pin-compatible with EP4CE115F29C8N?
Yes, the EP4CE75F29C8N and EP4CE115F29C8N share the same 780-FBGA F29 package footprint. Per the Cyclone IV E datasheet, both use identical pin assignments so the PCB land pattern can be reused. The EP4CE115 variant has higher logic density (114,480 LE vs 75,408 LE), so migrating up to it requires no layout change.
When should I choose EP4CE75F29C8N over EP4CE40F29C8N?
Choose EP4CE75F29C8N over EP4CE40F29C8N when your design requires more than ~40K logic elements or more than ~1.6 Mbits of embedded RAM. The EP4CE75 has 75,408 LE versus 39,600 LE for the EP4CE40. Both share the same F29 footprint, so the larger part can be substituted on the same PCB if design grows during development.
Is EP4CE75F29C8N the same as EP4CE75F29C8LN?
The EP4CE75F29C8N and EP4CE75F29C8LN share the same 75,408 logic elements, 780-FBGA F29 footprint, and C8 speed grade. The 'L' suffix denotes a lower-power variant with reduced core voltage / static current targets per the Cyclone IV E datasheet. They are drop-in pin-compatible, but power consumption differs at idle.
Where to download EP4CE75F29C8N datasheet PDF?
The Cyclone IV E datasheet (which covers EP4CE75F29C8N) is available as a free PDF on Intel's product support page at intel.com/content/www/us/en/programmable/products/fpga/cyclone-series/cyclone-iv/support.html. The datasheet document includes device architecture, electrical characteristics, pinout, configuration, and timing specifications.
Where to find EP4CE75F29C8N pinout diagram?
The EP4CE75F29C8N pinout is published in the Cyclone IV E Device Handbook (Chapter 8 Pin-Out Files). Each ball is mapped to its functional role (user I/O bank assignment, configuration pin, power, GND). The pinout SVG is also rendered on XAIPART under the package diagram for the 780-FBGA F29 footprint.
What are the key specifications of EP4CE75F29C8N that engineers should know?
The EP4CE75F29C8N has 75,408 logic elements (4,713 LABs), 426 user I/O, 2,810,880 RAM bits, 200 18x18 multipliers, 4 PLLs, 1.15-1.25 V core, 0-85C commercial temperature, and 780-FBGA F29 package. It supports JTAG, Active Serial, and Passive Serial configuration. Per the Cyclone IV E datasheet, Fmax reaches ~150 MHz for typical logic designs.

工程参考数据: EP4CE75F29C8N ——对比、设计指导和合规信息。

选型指南

Choose EP4CE75F29C8N when your design needs 40K-80K logic elements, 1-2 Mbits of embedded RAM, and abundant user I/O in a low-cost commercial-temperature FPGA. It sits at the sweet spot of the Cyclone IV E family: enough density for motor control plus image-processing pipelines, but cheaper than the EP4CE115. If you need -40 to +100C operation, swap to the pin-compatible EP4CE75F29I8N. If you only need ~30-40K LE, use the EP4CE40F29C8N to save cost. If you outgrow the part during development, migrate to EP4CE115F29C8N without changing the PCB. Avoid the EP4CE75F29C8N only if you need transceivers (use Cyclone IV GX) or DSP blocks above 200 multipliers (use Cyclone 10 LP).

与替代料对比

参数 本产品 EP4CE75F29C8LN EP4CE75F29C7N EP4CE75F29I8N EP4CE55F29C8N EP4CE115F29C8N
Brand Intel (formerly Altera) Intel Intel Intel Intel Intel
Package 780-FBGA (F29) 29x29 mm 780-FBGA (F29) - same 780-FBGA (F29) - same 780-FBGA (F29) - same 780-FBGA (F29) - same 780-FBGA (F29) - same
Logic Elements 75,408 75,408 75,408 75,408 55,856 (-26%) 114,480 (+52%)
Number of I/O 426 426 426 426 374 426
Total RAM Bits 2,810,880 2,810,880 2,810,880 2,810,880 2,396,160 (-15%) 3,981,312 (+42%)
Multipliers (18x18) 200 200 200 200 156 266
Speed Grade C8 (-8) C8 (-8) C7 (-7, faster ~15%) I8 (-8, industrial temp) C8 (-8) C8 (-8)
Operating Temperature 0C to +85C (commercial) 0C to +85C 0C to +85C -40C to +100C (industrial) 0C to +85C 0C to +85C

关键差异点

  • Highest Cyclone IV E density in the commercial temp grade F29 footprint (对比 EP4CE55F29C8N)
  • Same-package migration path to 114,480 LE (对比 EP4CE115F29C8N)
  • Direct pin-compatible drop-in to faster speed grade (对比 EP4CE75F29C7N)

设计说明

The 780-ball F29 FBGA has 1.0 mm ball pitch and 29x29 mm body. Estimated: PCB routing requires a minimum 6-layer stack-up with HDI micro-vias to escape the inner rows. Per Cyclone IV E handbook, each VCCINT pin needs its own 0.1 uF + 10 uF decoupling pair placed within 100 mil of the ball. Provide a continuous GND plane directly under the BGA to control return paths.

Estimated: at typical 75% utilization and 150 MHz clock, the EP4CE75F29C8N dissipates approximately 1.5-2.0 W. The F29 BGA has theta_JA around 15-20 C/W on a standard JEDEC 4-layer test board, producing 30-40 C rise above ambient. For sealed enclosures or elevated ambient (>60C), add a thermal pad under the package tied to GND or use airflow to keep junction below 100C.

Do not leave MSEL0/MSEL1 floating - they select JTAG/AS/PS configuration mode and must be tied to VCCIO8 or GND through a 1 kohm resistor. The nCONFIG pin must be pulled to VCCIO8 via 10 kohm. Per Cyclone IV E datasheet, all VCCIO bank supplies must be present even if the bank is unused; floating bank supplies cause configuration failure. Use the Quartus II / Quartus Prime software's pin-planner to validate I/O bank assignments before PCB tape-out.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
无铅
Yes
无卤
Unknown
冲突矿物
Compliant

RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified - the EP4CE75F29C8N is commercial grade (0-85C). For AEC-Q100 contexts use the industrial-grade pin-compatible EP4CE75F29I8N.

数据核验日期: 2026-09-10 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

EP4CE75F29C8N EP4CE75F29C8N datasheet Intel Cyclone IV E EP4CE75 780-FBGA FPGA 75K logic elements Altera Cyclone IV E 426 I/O FPGA motor control industrial EP4CE75F29C8N vs EP4CE55F29C8N EP4CE75F29C8N pin-compatible replacement EP4CE75F29C8N buy price distributor Cyclone IV E F29 package footprint how many logic elements EP4CE75F29C8N FPGA 200 multipliers 4 PLLs

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Intel Altera EP4CE75F29C8N EP4CE75F29C8LN EP4CE75F29C7N EP4CE75F29I8N EP4CE55F29C8N EP4CE115F29C8N Cyclone IV E FPGA field-programmable gate array logic array block logic element M9K memory block hardware multiplier 780-FBGA F29 package JTAG Active Serial configuration LVDS SSTL RoHS AEC-Q100 industrial motor control video bridging
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