EP4CGX30BF14C7 - Cyclone IV GX FPGA, 30K LE, 169-FBGA | Intel
料号： EP4CGX30BF14C7 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $29.25 | $292.50 |
| 100 | $25.9 | $2,590.00 |
| 500 | $22.8 | $11,400.00 |
| 1,000 | $20.4 | $20,400.00 |
| 3,000 | $18.1 | $54,300.00 |
EP4CGX30BF14C7 概述
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that engineers can re-program in the field to implement arbitrary digital logic. FPGAs sit within the broader semiconductor hierarchy as reconfigurable logic devices, distinct from ASICs (Application-Specific Integrated Circuits), microcontrollers, and DSPs. The Cyclone IV family specifically targets low total system cost while integrating high-speed serial transceivers that historically required a companion PHY chip.
Key features of the EP4CGX30BF14C7 include up to four integrated 3.125 Gbps transceivers supporting PCI Express Gen1, Gigabit Ethernet, and CPRI interfaces; 66 (18x18) hardware multipliers for DSP-style arithmetic; and dedicated DDR/DDR2 SDRAM memory interfaces with hardware PHY support. The C7 speed grade designates a commercial temperature grade with the device rated for 0C to +85C ambient operation. Quartus II / Quartus Prime software is the configuration and synthesis toolchain of record.
The Cyclone IV GX architecture combines a logic fabric built around 4-input ALMs (Adaptive Logic Modules), embedded M9K memory blocks, and a flexible I/O ring supporting LVDS, SSTL, and HSTL signaling. Compared to the non-GX Cyclone IV E devices, the GX variants add hardened PCI Express and 8B/10B-capable serial transceivers, eliminating the need for an external PHY in many low-lane-count applications.
Typical applications include industrial motor control, video surveillance bridges, low-density protocol bridging, low-cost PCIe endpoints, and consumer-facing displays with high-speed serial capture. The transceiver-equipped packages target designs that previously would have required a discrete ASSP PHY alongside an FPGA.
When designing with this device, ensure that the Quartus II fitter reports clean timing closure for all transceiver and DDR paths before tape-out, and validate thermal dissipation against the FBGA-169 ball count. For newer low-power work, evaluate Cyclone 10 LP or Cyclone V as a forward migration path, since Cyclone IV is on long-term support.
This page synthesizes distributor pricing, drop-in same-family and cross-brand alternatives, and practical design notes that go beyond the manufacturer datasheet. All quotes are referenced as of 2026-09-10 and may vary by lead time and reel size.
直接替换替代料： EP4CGX30BF14C7 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP4CGX30BF14C7 （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Embedded Memory, Speed Grade, Transceivers.
快速对比工具——选择替代料号进行并排对比：
EP4CGX30BF14C6N
✅ 直接替换✓ 有现货
$25.9 / 个
查看数据手册 →EP4CGX30BF14C6
✅ 直接替换✓ 有现货
$119.4995 / 个
查看数据手册 →EP4CGX30BF14C8N
✅ 直接替换✓ 有现货
$43.12 / 个
查看数据手册 →EP4CGX30BF14I7N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$65.8 / 个
查看数据手册 →EP4CGX30CF23C7
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$137.62 / 个
查看数据手册 →EP4CGX30BF14C7 最大额定值与电气特性
| Series | Cyclone® IV GX |
| Family | Cyclone IV GX |
| Device Logic Elements | 29,440 |
| Total Memory Bits | 1,105,920 bits |
| Embedded Multipliers (18x18) | 66 |
| Transceivers | Up to 4 channels, 3.125 Gbps |
| User I/O Pins | 72 |
| 封装 | 169-ball FBGA (F14) |
| Package Code | LBGA-169 |
| 工作温度 | 0C to +85C (Commercial) |
| Speed Grade | C7 |
| Core Voltage | 1.2 V |
| Process Technology | 60 nm low-power CMOS |
| 安装类型 | Surface Mount (BGA) |
| RoHS 状态 | Compliant (per distributor listings) |
EP4CGX30BF14C7 lbga-169 引脚配置指南
EP4CGX30BF14C7（lbga-169 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP4CGX30BF14C7.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP4CGX30BF14C7 适用于 6 应用s: PCI Express Gen1 Endpoint, Industrial Motor Control, Video Surveillance Bridge / Image Sensor Aggregation, Gigabit Ethernet / CPRI Front-Haul Bridge, Low-Cost Protocol Bridge / Display Controller, Automotive Telematics / Infotainment Auxiliary.
PCI Express Gen1 Endpoint
The EP4CGX30BF14C7 is well suited as a PCI Express Gen1 endpoint, with up to 4 integrated 3.125 Gbps transceivers that include a hardened PCIe PHY. The Cyclone IV GX hard IP supports x1 PCIe Gen1 at 2.5 Gbps without an external PHY, simplifying BOM and PCB complexity. With 29,440 LEs and 66 18x18 multipliers, designers can implement endpoint logic plus DMA, descriptor handling, and protocol bridging. Compared to using a discrete PCIe PHY + small FPGA, the BF14C7 reduces board area and improves signal integrity. Performance consideration: route the PCIe lanes as 90-ohm differential pairs with reference-plane continuity, and use the Quartus II PCIe hard IP core for compliance. The 169-FBGA package supports the required x1 endpoint with margin for additional GPIO. This combination of integrated transceiver and PCIe hard IP is the primary reason engineers choose the BF14C7 over the Cyclone IV E family.
推荐
Industrial Motor Control
The EP4CGX30BF14C7 fits industrial motor control applications requiring fast PWM generation, encoder decoding, and field-oriented control (FOC) loops. With 66 hardware 18x18 multipliers, the device can execute Park/Clarke transforms and PI controllers at the kHz loop rates demanded by servo drives, and the integrated transceivers enable EtherCAT or industrial-Ethernet side-band communication. The 169-FBGA F14 package operates at the commercial 0C to +85C range, which covers most factory-floor enclosures; designers needing -40C to +100C should select the I7N or C8N speed-grade variants listed in alternatives. The Cyclone IV GX has ample LVDS and single-ended I/O for resolver and Hall-sensor interfaces, plus embedded memory to buffer current-loop waveforms. Performance consideration: leverage the dedicated PLL blocks for precise PWM switching frequency and add copper pours under the BGA for thermal dissipation at high PWM duty cycles. Compared to microcontrollers, the BF14C7 delivers parallel deterministic latency for tight control loops.
推荐
Video Surveillance Bridge / Image Sensor Aggregation
The EP4CGX30BF14C7 bridges parallel CMOS image sensor data into MIPI or Ethernet output streams at surveillance-equipment frame rates. With 72 user I/Os on the F14 package, the device can ingest a wide parallel LVDS sensor interface (8-12 lanes plus clock and sync) and serialize through the integrated 3.125 Gbps transceivers. The 1,105,920 embedded memory bits buffer line-scan data before transmission, and the 29,440 logic elements implement image-processing pre-filters without external memory. Compared to a fixed-function serializer IC, the BF14C7 allows the firmware team to change sensor formats via Quartus reprogramming, enabling one SKU to serve multiple sensor vendors. Performance consideration: place 0.1uF decoupling on every BGA power ball and use controlled-impedance routing for the parallel LVDS inputs. The commercial temperature range (C7) suits indoor surveillance cameras and DVR/NVR bridges.
推荐
Gigabit Ethernet / CPRI Front-Haul Bridge
The EP4CGX30BF14C7 functions as a low-cost 1G Ethernet or CPRI front-haul bridge in small-cell wireless infrastructure and industrial-Ethernet gateways. Each of the four integrated transceivers supports 1.25 Gbaud for GbE or 1.228/2.457 Gbps for CPRI without requiring external SerDes ICs. With 66 hardware multipliers, designers can implement Ethernet MAC, switch fabric glue logic, or CPRI framing within the FPGA fabric without paying for a dedicated networking ASIC. Compared to ASSP switches, the BF14C7 offers reprogrammability for evolving protocols and custom L2/L3 features. Performance consideration: place the SFP/QSFP module within 100mm of the BGA to meet GbE signal-integrity budgets, and use the Quartus II Ethernet IP cores for compliance. The 169-FBGA package footprint enables compact small-cell enclosures.
推荐
Low-Cost Protocol Bridge / Display Controller
The EP4CGX30BF14C7 serves as a versatile protocol bridge between LVDS, RGB, SPI, I2C, and serial interfaces in low-density consumer-facing applications. With 29,440 LEs and 72 user I/Os, the device can drive small TFT displays, implement HDMI bridge glue, or convert between industrial protocols without a dedicated ASIC NRE. The embedded M9K memory blocks provide line buffers for video path conversion. Compared to the larger Cyclone V or Cyclone 10 LP devices, the BF14C7 lowers total BOM cost while keeping the Quartus II toolchain flow. Performance consideration: use the device's LVDS I/O for high-speed display lanes and route them as 100-ohm differential pairs. The 169-FBGA commercial temperature grade (C7) suits consumer and light-industrial enclosures. Engineers gain a reprogrammable platform that can pivot across product SKUs with minimal hardware variation.
推荐
Automotive Telematics / Infotainment Auxiliary
The EP4CGX30BF14C7 (commercial C7 grade) can serve as an auxiliary processor in infotainment stacks, CAN-FD bridges, or telematics gateways. While the C7 commercial temperature grade is not automotive-qualified, design teams evaluating non-safety telematics modules frequently use BF14C7 designs and qualify them with external thermal protection. For automotive-grade applications, designers should migrate to the EP4CGX30BF14I7N industrial variant or to the Cyclone IV Auto family. With 29,440 LEs and four transceivers, the BF14C7 can host LVDS display drivers, Ethernet AVB bridges, and CAN-FD controllers concurrently. Performance consideration: copper-ball BGA package is robust to vibration but requires underfill for harsh automotive thermal cycling. Compared to ASSP telematics chipsets, the BF14C7 allows late-stage feature differentiation in a competitive infotainment market.
推荐
推荐产品汇总
工程参考数据： EP4CGX30BF14C7 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP4CGX30BF14C6N | EP4CGX30BF14C6 | EP4CGX30BF14C8N | EP4CGX30BF14I7N | EP4CGX30CF23C7 |
|---|---|---|---|---|---|---|
| Package | 169-ball FBGA (F14) | 169-ball FBGA (F14) - same | 169-ball FBGA (F14) - same | 169-ball FBGA (F14) - same | 169-ball FBGA (F14) - same | 484-ball FBGA (CF23) - larger package |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 29,440 | 29,440 (same die) | 29,440 (same die) | 29,440 (same die) | 29,440 (same die) | 29,440 (same die) |
| Speed Grade | C7 | C6 (slower) | C6 (slower) | C8 (faster) | I7 (industrial) | C7 (same) |
| Temperature Range | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| User I/O Count | 72 | 72 (same) | 72 (same) | 72 (same) | 72 (same) | ~290 (CF23 package, larger) |
| Transceivers | Up to 4 @ 3.125 Gbps | Up to 4 @ 3.125 Gbps (same) | Up to 4 @ 3.125 Gbps (same) | Up to 4 @ 3.125 Gbps (same) | Up to 4 @ 3.125 Gbps (same) | Up to 4 @ 3.125 Gbps (same) |
| Embedded Memory (bits) | 1,105,920 | 1,105,920 (same) | 1,105,920 (same) | 1,105,920 (same) | 1,105,920 (same) | 1,105,920 (same) |
| Hardware Multipliers (18x18) | 66 | 66 (same) | 66 (same) | 66 (same) | 66 (same) | 66 (same) |
关键差异点
- Integrated 3.125 Gbps transceivers with PCIe Gen1 hard IP （对比 EP4CE40F29C7 (Cyclone IV E))
- Lowest cost 169-FBGA Cyclone IV GX option in the F14 package （对比 EP4CGX30CF23C7 (CF23 484-ball package))
- Same-family drop-in replacement path for commercial designs （对比 EP4CGX30BF14C6N (lower speed grade))
设计说明
Estimated: At typical Cyclone IV GX utilization around 70% and full transceiver duty cycle, the 169-FBGA F14 package dissipates roughly 1.0-1.5W. With the package's theta_JA in the range of 25-30 C/W on a 4-layer JEDEC board, junction temperature rises approximately 30-45C above ambient. For enclosed industrial enclosures without forced airflow, add a thermal pad copper pour under the BGA and consider top-side heatsinks for sustained high-utilization workloads. Design teams should consult AN 469: Thermal Management for Altera Devices for board-level guidelines.
Estimated: Route the four multi-gigabit transceiver channels as 100-ohm differential pairs with reference-plane continuity on the layer immediately below the trace. Maintain 4W/8W spacing rules for adjacent pairs and place AC-coupling capacitors (typically 100nF X7R) within 200mm of the BGA transmitter balls. Decoupling strategy: 0.1uF and 0.01uF ceramic capacitors within 200 mils of every VCCINT and VCCIO ball, plus bulk 10-47uF tantalum/polymer capacitors on each supply rail. Use blind/buried vias and microvia stackups where possible to keep power delivery inductance low.
Common pitfall 1: Selecting a Cyclone IV E part (e.g., EP4CE40F29C7) when PCIe Gen1 or multi-gigabit transceivers are required - E devices lack the integrated transceiver PHYs. Pitfall 2: Forgetting to switch the Quartus II device from the BF14C7 ID to the BF14C6 or BF14C8N ID before recompiling - bitstream compatibility between speed grades is NOT automatic. Pitfall 3: Using non-Altera configuration memories without verifying they support the Cyclone IV GX compression modes, leading to configuration failures. Pitfall 4: Driving the LVDS I/O at voltages outside the bank-specific VCCIO range - the BF14C7 has mixed VCCIO banks and over-voltage can damage I/O cells.
合规信息
RoHS compliance confirmed via distributor product listings (DigiKey, Mouser, Avaq). The Cyclone IV GX family is in long-term support as of 2026; not AEC-Q100 qualified (automotive-grade variants belong to the Cyclone IV Auto family). MSL rating not explicitly published in distributor data - assumed MSL3 for FBGA packages; verify before reflow assembly.
