EP4SGX360FH29C2X - 353600 LEs Stratix IV GX FPGA, 780-HBGA | Intel
料号： EP4SGX360FH29C2X ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4250 | $4,250.00 |
| 10 | $3980 | $39,800.00 |
| 100 | $3650 | $365,000.00 |
| 500 | $3320 | $1,660,000.00 |
| 1,000 | $3050 | $3,050,000.00 |
EP4SGX360FH29C2X 概述
An FPGA (Field Programmable Gate Array) is a programmable logic device hierarchy sitting between ASICs (Application-Specific Integrated Circuits) and general-purpose processors. FPGAs belong to the broader programmable logic device family, alongside CPLDs (Complex Programmable Logic Devices), and sit within the digital semiconductor and logic IC taxonomy. Stratix IV GX specifically combines general-purpose fabric with multi-gigabit transceivers, positioning it for serial connectivity, baseband processing, and high-bandwidth datapath acceleration.
Key features of the EP4SGX360FH29C2X include 24 integrated transceivers capable of supporting protocols such as PCI Express Gen1/Gen2, XAUI, CEI-6G, Serial RapidIO, and Gbps Ethernet, hardened PCIe and memory controller IP blocks, up to 1,440 embedded 18x18 multipliers, and rich clocking with PLLs. The C2 speed grade is the slowest commercial Stratix IV GX speed grade, offering the lowest cost at the price of reduced Fmax versus C3/C4/I-grade siblings.
The 40 nm process node and the 33x33 mm 780-HBGA package together manage power dissipation and signal integrity for hundreds of high-speed serial and parallel signals. Transmit pre-emphasis, receive equalization, and adaptive voltage swing are built in, reducing external PHY circuitry and simplifying board layout. The device supports configuration via fast passive parallel, fast active serial, and JTAG modes.
Typical applications include 40G/100G optical transport line cards, PCIe Gen2 endpoint/root-complex boards, radar and electronic warfare signal processing, software-defined radio baseband, ASIC prototyping, and high-performance test & measurement instrumentation. The wide logic and transceiver budget makes the EP4SGX360FH29C2X a frequent choice when a design must absorb both compute-intensive datapaths and multi-lane serial I/O in a single device.
When designing with this part, plan thermal management carefully: a 780-ball FCBGA at 33x33 mm requires a multi-layer PCB with a thermal via array under the lid and, often, a heatsink for sustained workloads. Validate signal-integrity budgets for the 8.5 Gbps transceivers against your PCB stack-up before commit, and confirm Quartus II support for the C2 speed-grade timing models in your design flow. This page synthesizes distributor inventory, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： EP4SGX360FH29C2X ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP4SGX360FH29C2X （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Speed Grade, Mounting Type, Adaptive Logic Modules (ALMs).
快速对比工具——选择替代料号进行并排对比：
EP4SGX360FH29C2XN
✅ 直接替换✓ 有现货
$2210 / 个
查看数据手册 →EP4SGX360FH29C3
✅ 直接替换✓ 有现货
$1395 / 个
查看数据手册 →EP4SGX360FH29C4
✅ 直接替换✓ 有现货
$3225 / 个
查看数据手册 →EP4SGX360FH29C2G
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP4SGX360FH29I3N
✅ 直接替换✓ 有现货
$1950 / 个
查看数据手册 →EP4SGX360FH29C2X 最大额定值与电气特性
| Series | Stratix IV GX |
| Logic Elements | 353600 |
| LABs/CLBs | 14144 |
| Total RAM Bits | 23105536 |
| Number of I/O | 289 |
| Number of Transceivers | 24 |
| Transceiver Data Rate | Up to 8.5 Gbps |
| Core Voltage Supply | 0.87 V to 0.93 V |
| Process Technology | 40 nm |
| 封装 | 780-BBGA, FCBGA (33x33 mm) |
| 安装类型 | Surface Mount |
| Operating Temperature Grade | Commercial |
| Speed Grade | C2 |
| MSL 等级 | 3 |
| RoHS 状态 | Compliant |
EP4SGX360FH29C2X 780-bbga, fcbga (33x33 mm) 引脚配置指南
EP4SGX360FH29C2X（780-bbga, fcbga (33x33 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP4SGX360FH29C2X.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP4SGX360FH29C2X 适用于 6 应用s: 40G/100G Optical Transport Line Cards, PCI Express Gen2 Endpoint / Root Complex Boards, Radar and Electronic Warfare Signal Processing, Software-Defined Radio Baseband Processing, ASIC Prototyping and Emulation, High-Performance Test & Measurement Instrumentation.
40G/100G Optical Transport Line Cards
The EP4SGX360FH29C2X is well matched to 40G and 100G optical line-card designs because its 24 transceivers support up to 8.5 Gbps per lane, enabling 4x25G or 10x10G aggregation with built-in pre-emphasis and adaptive equalization. Its 353,600 logic elements absorb OTN framing, FEC, and MAC functions, while 22 Mbit of embedded RAM buffers packet bursts without external SRAM. The 780-HBGA 33x33 mm package keeps board area reasonable for dense line-card faceplates. Designers should budget ~6-8 W core power and validate thermal via arrays under the lid for sustained 100G operation.
推荐
PCI Express Gen2 Endpoint / Root Complex Boards
With hardened PCI Express Gen1/Gen2 IP blocks integrated in the Stratix IV GX fabric, the EP4SGX360FH29C2X simplifies PCIe endpoint and root-complex designs for server accelerators and storage controllers. The 8.5 Gbps transceivers handle x8 Gen2 links at full 40 Gbps payload, while 1,440 18x18 multipliers accelerate crypto and compression offload. The C2 speed grade is acceptable for Gen2 with relaxed timing margins. A typical board uses one x8 Gen2 link plus DDR3 memory via the dedicated external memory interface.
推荐
Radar and Electronic Warfare Signal Processing
The EP4SGX360FH29C2X's combination of 1,440 18x18 multipliers, 22 Mbit of block RAM, and 24 high-speed transceivers makes it a strong fit for radar front-end digitization and electronic-warfare processing boards. Wide datapath beamforming, pulse compression, and FFT-based detection run efficiently in Stratix IV DSP blocks. The C2 commercial grade is acceptable for indoor rack-mount chassis; fielded platforms should select the I-grade EP4SGX360FH29I3N. Plan thermal dissipation around 8-10 W core plus transceiver power at full duty cycle.
推荐
Software-Defined Radio Baseband Processing
Software-defined radio baseband systems need wide datapath compute and flexible high-speed connectivity to RF ADCs/DACs, both of which the EP4SGX360FH29C2X provides. The 353,600 LEs plus DSP blocks run multi-carrier demodulation, channelization, and FEC in a single device, while 8.5 Gbps transceivers interface to JESD204B ADCs/DACs or to a companion RF transceiver ASIC. The 780-HBGA 33x33 mm package is compact enough for 6U VPX or compactPCI baseband cards. Designers should validate transceiver jitter performance against JESD204B SYSREF requirements in the lab.
推荐
ASIC Prototyping and Emulation
With 353,600 logic elements and 24 transceivers on a single die, the EP4SGX360FH29C2X is a popular building block for ASIC prototyping and emulation farms. Multiple FPGAs can be tiled via the 8.5 Gbps transceivers to emulate multi-million-gate ASICs. The C2 commercial speed grade keeps prototype cost low for volume emulation seats. Quartus II synthesis and TimeQuest timing closure are well documented for this speed grade, simplifying large RTL partitions.
推荐
High-Performance Test & Measurement Instrumentation
Automated test equipment, protocol analyzers, and high-speed oscilloscope acquisition boards leverage the EP4SGX360FH29C2X for its 8.5 Gbps transceivers and abundant logic fabric. The 24 transceivers can aggregate multiple PCIe, SATA, USB 3.0, or proprietary serial lanes into a single FPGA for protocol decode. The 1,440 DSP blocks accelerate FFT-based spectrum analysis and jitter measurement in real time. A typical instrument design pairs this FPGA with DDR3 SODIMM and a high-pin-count FMC connector for mezzanine I/O.
推荐
推荐产品汇总
工程参考数据： EP4SGX360FH29C2X ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP4SGX360FH29C2XN | EP4SGX360FH29C3 | EP4SGX360FH29C4 | EP4SGX360FH29C2G | EP4SGX360FH29I3N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-BBGA, FCBGA (33x33 mm) | 780-BBGA, FCBGA (33x33 mm) - same | 780-BBGA, FCBGA (33x33 mm) - same | 780-BBGA, FCBGA (33x33 mm) - same | 780-BBGA, FCBGA (33x33 mm) - same | 780-BBGA, FCBGA (33x33 mm) - same |
| Speed Grade | C2 (commercial) | C2 (commercial) | C3 (commercial, +15% Fmax) | C4 (commercial, +25% Fmax) | C2 (commercial, lead-free) | I3 (industrial, +25% Fmax) |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial | Industrial (-40C to +100C) |
| Logic Elements | 353600 | 353600 | 353600 | 353600 | 353600 | 353600 |
| Transceivers | 24 x 8.5 Gbps | 24 x 8.5 Gbps | 24 x 8.5 Gbps | 24 x 8.5 Gbps | 24 x 8.5 Gbps | 24 x 8.5 Gbps |
| User I/O | 289 | 289 | 289 | 289 | 289 | 289 |
| Core Voltage | 0.87 V to 0.93 V | 0.87 V to 0.93 V | 0.87 V to 0.93 V | 0.87 V to 0.93 V | 0.87 V to 0.93 V | 0.87 V to 0.93 V |
关键差异点
- Lowest cost Stratix IV GX speed grade （对比 EP4SGX360FH29C3)
- Compact 33x33 mm 780-HBGA footprint （对比 EP4SGX360FF35C2X)
- 24 transceivers at 8.5 Gbps integrated （对比 EP4CGX150DF31I7N)
设计说明
Estimated: At full utilization (353K LEs @ ~70% toggle rate plus 24 transceivers at 8.5 Gbps), the EP4SGX360FH29C2X can dissipate 10-12 W core power. The 780-HBGA package has a published theta_JA in the 8-12 C/W range when paired with a properly designed thermal via array and a heatsink. Without active cooling, junction temperature can exceed 100C in still air. Always use at least an 8x8 thermal via array under the package and a 20x20 mm heatsink with thermal interface material for production.
The 780-ball FC-HFBGA at 33x33 mm requires a 1.0 mm ball pitch, which mandates high-density interconnect (HDI) PCB fabrication with microvias and a minimum 12-layer stack-up. Use Megtron-6 or equivalent low-loss dielectric for the transceiver lanes to maintain 8.5 Gbps SI margins. Reference the Stratix IV GX Board Design Guidelines for via-in-pad recommendations and DC-blocking capacitor placement adjacent to each transceiver ball.
The EP4SGX360FH29C2X requires at least three independent supply rails: 0.87-0.93 V core, 1.1 V auxiliary, and 1.5 V/2.5 V/3.0 V I/O banks. Use a sequencer such as the LTC2923 or TI UCD90120A to enforce power-up and power-down sequencing per the datasheet - improper sequencing can permanently damage the device. Decouple every transceiver power pin with 0.1 uF and 10 uF capacitors placed within 100 mil of the ball.
8.5 Gbps transceivers require 85-ohm differential impedance (not 100-ohm) with intra-pair skew under 1 ps per inch. Maintain at least 3W trace-to-trace spacing between adjacent transceiver pairs. Use the Quartus II transceiver toolkit to tune pre-emphasis and equalization coefficients per channel; do not rely on default settings for production. Always validate eye masks via BERT measurement at production temperatures.
Do not confuse the EP4SGX360FH29C2X speed-grade suffix 'C2' with industrial-grade 'I2'. The part is commercial temperature only. If your chassis will see temperatures above +70C ambient, select the I3 sibling (EP4SGX360FH29I3N) instead. Also verify that your Quartus II version supports the C2 speed-grade timing models - older Quartus releases may flag C2 as preliminary.
合规信息
RoHS and lead-free status confirmed per Altera/Intel product documentation. AEC-Q100 not applicable - this is a commercial-grade FPGA, not an automotive-qualified part. For automotive applications consider the EP4SGX360 automotive variants if available, or migrate to a newer automotive-qualified Intel FPGA family.
