EP4SGX360FH29I4N - Stratix IV GX FPGA 360K LE, 780-BGA | Intel
料号： EP4SGX360FH29I4N ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4520 | $45,200.00 |
| 25 | $4290 | $107,250.00 |
| 50 | $3995 | $199,750.00 |
| 100 | $3720 | $372,000.00 |
EP4SGX360FH29I4N 概述
What is an FPGA? A Field Programmable Gate Array is a programmable logic device containing an array of configurable logic blocks (CLBs/LABs), embedded memory, DSP blocks, and high-speed transceivers interconnected by a programmable routing fabric. FPGAs sit at the top of the programmable logic hierarchy between ASICs (custom silicon) and general-purpose processors: they offer ASIC-like parallel performance with processor-like reconfigurability, enabling hardware-level acceleration without NRE cost.
Key features of the EP4SGX360FH29I4N include 36 embedded 18x18 multipliers for DSP, four PLLs for clock synthesis, 1.6 Gbps LVDS support, and an industrial temperature grade (-40C to +100C for the I4 suffix). The part is fabricated on TSMC's 40nm process and supports configuration via JTAG, Active Serial, or Passive Parallel modes. The 780-BGA package uses a 1mm ball pitch and exposes a full 289 GPIOs for parallel interfacing.
The Stratix IV GX architecture combines a rich logic fabric with hardened PCIe Gen1/Gen2 hard IP blocks, multi-gigabit transceivers (MGTs), and on-chip termination, making the EP4SGX360FH29I4N a strong fit for high-throughput applications including 40G/100G line cards, broadcast video processing, and ASIC prototyping. The 8.5 Gbps transceivers enable protocols such as PCIe 2.0, SATA 2.0, XAUI, CEI-6G, and SFI-5.
Typical applications include ASIC prototyping, wireless baseband processing, high-performance computing accelerators, radar/sonar signal processing, and broadcast video infrastructure. The integrated transceivers and DSP blocks accelerate data-plane packet processing and parallel mathematical operations.
When designing with this device, allocate ample PCB area for the 780-ball FCBGA (29mm x 29mm typical) and use at least 8 PCB layers with continuous power and ground planes to deliver clean transponder analog supply rails. JTAG programming header, configuration flash, and external clock sources must be co-designed for production reliability.
直接替换替代料： EP4SGX360FH29I4N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EP4SGX360FH29I4N （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Speed Grade, Series, Family.
快速对比工具——选择替代料号进行并排对比：
EP4SGX360FH29I4
✅ 直接替换✓ 有现货
$1295 / 个
查看数据手册 →EP4SGX360FH29I3N
✅ 直接替换✓ 有现货
$1950 / 个
查看数据手册 →EP4SGX360FH29C4N
✅ 直接替换✓ 有现货
$4850 / 个
查看数据手册 →EP4SGX360FH29C3N
✅ 直接替换✓ 有现货
$1495 / 个
查看数据手册 →EP4SGX360FH29C2XN
✅ 直接替换✓ 有现货
$2210 / 个
查看数据手册 →EP4SGX360FH29I4N 最大额定值与电气特性
| Family | Stratix IV GX |
| Series | EP4SGX360 |
| Logic Elements | 353,600 |
| Logic Array Blocks (LABs) | 14,144 |
| Embedded Memory | 23,105,536 bits |
| User I/Os | 289 |
| Number of Pins/balls | 780 |
| 封装 | 780-BGA, FCBGA (FH29) |
| Ball Pitch | 1.0 mm |
| 工作温度 | -40C to +100C (industrial, I4 grade) |
| Max Transceiver Data Rate | 8.5 Gbps |
| PLLs | 4 |
| Process Node | 40nm TSMC |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Configuration Mode | JTAG / Active Serial / Passive Parallel |
| Hard PCIe IP | PCIe Gen1/Gen2 hard IP blocks |
EP4SGX360FH29I4N 780-bga, fcbga (fh29) 引脚配置指南
EP4SGX360FH29I4N（780-bga, fcbga (fh29) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EP4SGX360FH29I4N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EP4SGX360FH29I4N 适用于 7 应用s: ASIC Prototyping Platform, Wireless Baseband Processing, Broadcast Video Processing, High-Performance Computing Accelerator, Radar and Sonar Signal Processing, 40G/100G Network Line Card, Test and Measurement Instrumentation.
ASIC Prototyping Platform
The EP4SGX360FH29I4N's 353,600 logic elements and 23 Mbit embedded memory make it ideal for ASIC prototyping where engineers need to emulate complex SoC designs in real silicon before mask tape-out. The Stratix IV GX family has a long history as an ASIC prototype vehicle because its high LE count, abundant block RAM, and 8.5 Gbps transceivers can match mid-range ASIC complexity. Placed on a multi-board ASIC emulator, the FH29 device runs gate-level netlists directly - the hard PCIe Gen2 IP block accelerates verification of PCIe peripherals. Designers should use Quartus II Prime or Standard Edition with the Stratix IV GX device library; synthesis flow typically achieves 100-200 MHz on critical paths for prototype validation.
推荐
Wireless Baseband Processing
The EP4SGX360FH29I4N integrates 36 embedded 18x18 multipliers and high-speed DSP blocks well suited to wireless baseband signal processing such as LTE, WiMAX, and early 5G prototypes. The 8.5 Gbps transceivers interface with RF front-end ADCs/DACs and backhaul links, while the 23 Mbit embedded memory buffers symbol streams between FFT/decoder stages. Industrial temperature grade (-40C to +100C) supports outdoor base-station deployment. The device's parallel DSP throughput outperforms DSP microprocessors for PHY-layer algorithms such as channel estimation and MIMO decoding, and the programmable fabric enables protocol updates without hardware redesign.
推荐
Broadcast Video Processing
The EP4SGX360FH29I4N delivers the parallel processing bandwidth needed for broadcast video processing: 4K/UHD up/down conversion, color space conversion, and real-time codec acceleration. The 8.5 Gbps transceivers handle SDI (Serial Digital Interface) links including 3G-SDI and emerging 6G/12G-SDI standards, while the 289 GPIOs drive HDMI, DisplayPort, and parallel video buses. The 23 Mbit embedded memory acts as frame buffers for scaling and deinterlacing. Industrial temperature grade supports studio and field-broadcast equipment. Quartus II video IP cores accelerate design entry for designers familiar with Altera/Intel FPGA toolchains.
推荐
High-Performance Computing Accelerator
The EP4SGX360FH29I4N accelerates compute-bound workloads in HPC systems through its parallel logic fabric and 8.5 Gbps transceivers. Typical use cases include custom encryption/decryption engines, financial Monte Carlo simulations, and database query acceleration where general-purpose CPUs become the bottleneck. The hard PCIe Gen2 IP block provides a low-latency CPU-to-FPGA interconnect at up to 5 Gbps, and the 23 Mbit embedded memory caches working datasets close to the logic. Industrial temperature grade and 780-BGA packaging support multi-FPGA accelerator cards in rack-mounted servers.
推荐
Radar and Sonar Signal Processing
The EP4SGX360FH29I4N's 353,600 logic elements, embedded DSP blocks, and high-bandwidth transceivers are well matched to radar and sonar signal processing pipelines. The device performs real-time FFT, pulse compression, and beamforming on multi-channel data streams from RF front-ends. The 8.5 Gbps transceivers digitize and aggregate ADC outputs while the parallel logic fabric executes matched filters and adaptive thresholding algorithms. Industrial -40C to +100C temperature grade supports naval and field-deployable systems. The Stratix IV GX family has been deployed in phased-array radar and synthetic aperture sonar (SAS) applications.
推荐
40G/100G Network Line Card
The EP4SGX360FH29I4N serves as a packet-processing engine in 40G/100G telecom line cards, leveraging its 8.5 Gbps transceivers to bond multiple lanes for higher aggregate throughput. Typical applications include deep-packet inspection (DPI), traffic management, and protocol adaptation between OTN, Ethernet, and SONET. The 289 user I/Os drive parallel data paths to external network processors and TCAM lookups, while the hard PCIe Gen2 IP block enables coprocessor offload. Industrial temperature grade and 780-BGA package support multi-FPGA ATCA or AdvancedTCA line-card designs.
推荐
Test and Measurement Instrumentation
The EP4SGX360FH29I4N functions as a flexible waveform generator, digitizer, or protocol analyzer in high-end test and measurement equipment. The 8.5 Gbps transceivers capture or generate high-speed serial test patterns (PRBS, PCIe, SATA, USB 3.0) for compliance testing, while the 353,600 logic elements implement real-time DSP, statistical analysis, and triggering logic. The 23 Mbit embedded memory stores waveform samples and correlation results. Industrial -40C to +100C temperature range supports laboratory and field test gear. Custom triggering, sequencing, and protocol decoding can be updated via in-system programming without hardware redesign.
推荐
推荐产品汇总
工程参考数据： EP4SGX360FH29I4N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EP4SGX360FH29I4 | EP4SGX360FH29I3N | EP4SGX360FH29C4N | EP4SGX360FH29C3N | EP4SGX360FH29C2XN |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-BGA (FH29) | 780-BGA (FH29) - same | 780-BGA (FH29) - same | 780-BGA (FH29) - same | 780-BGA (FH29) - same | 780-BGA (FH29) - same |
| Logic Elements | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 | 353,600 |
| LABs | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 | 14,144 |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C |
| Speed Grade | I4 (fastest industrial) | I4 (commercial temp version) | I3 (-1 speed step) | C4 (commercial temp, fast) | C3 (-1 step) | C2X (-2 steps, slowest) |
| Embedded Memory | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits | 23,105,536 bits |
| User I/Os | 289 | 289 | 289 | 289 | 289 | 289 |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
关键差异点
- Fastest speed grade in industrial temperature range （对比 EP4SGX360FH29I3N)
- Industrial temperature range for harsh environments （对比 EP4SGX360FH29C4N)
- Full 8.5 Gbps transceiver support across FH29 package （对比 EP4SGX360FF35I4N)
设计说明
The 780-BGA FCBGA package requires thermal management via thermal vias under the central ball array and a PCB heatsink or top-side heat spreader. For continuous 8.5 Gbps transceiver operation, expect 8-15 W power dissipation depending on utilization. Use at least 12 PCB layers with solid power/ground planes. Theta-JA for the FH29 package is approximately 12 C/W with proper thermal design (4-layer minimum with thermal vias); without thermal vias, junction temperatures can exceed +100C under sustained load.
The 780-BGA with 1mm ball pitch requires HDI PCB fabrication with microvias (laser-drilled) and sequential lamination. Recommended stackup: 8-12 layers with continuous GND planes on layers 2 and N-1, VCC cores on layers 3-4. Match all differential pairs to 100 ohm +/- 10% impedance for 8.5 Gbps serial channels. Use length matching within 0.127mm for high-speed parallel interfaces. Ball-to-pad registration must be specified for BGA pad pitch tolerance.
8.5 Gbps transceiver channels demand tight signal integrity control: use 100 ohm differential impedance with adjacent GND stitching vias spaced every 0.5 lambda. AC-coupling capacitors (100nF X7R) are required between adjacent TX/RX pairs; do NOT route DC-coupled signals to the MGT pins. Reference clock inputs must be low-jitter (under 100 fs RMS) oscillators; Xilinx/Microsemi part substitution requires firmware register reconfiguration. Maintain return path continuity across layer transitions with GND vias adjacent to each signal via.
The EP4SGX360FH29I4N requires multiple supply rails: VCC (core), VCCA_PLL (PLL analog), VCCPT (programmable technology), VCCIO (I/O banks), VCCPD (pre-driver), VCCR/VCCP_GXB/MGT analog supplies. Use a dedicated LDO per analog rail and bulk decoupling of at least 220 uF low-ESR ceramic plus 1mF polymer per rail. Power sequencing follows Intel's recommended order: VCC -> VCCIO -> VCCPD. Inrush current can exceed 10A on ramp-up; use soft-start controllers.
Common pitfalls: (1) Using JTAG configuration without external flash - the configuration volatile memory needs re-loading each power cycle. (2) Forgetting to tie MSEL pins for the desired configuration mode. (3) Not enabling the nCONFIG or nSTATUS pull-ups. (4) Driving 8.5 Gbps lines through 90-degree bends or excessive vias - keep via count under 4 per TX/RX pair. (5) Failing to constrain clock domain crossings in Quartus - use ALTDDIO or design-wide CDC scripts.
合规信息
RoHS compliance per Intel product page. AEC-Q100 not applicable for FPGAs - FPGAs are not directly qualified against automotive IC stress standards; the I4 industrial temperature range (-40C to +100C) provides the temperature margin typically required for in-cabin automotive systems.
