Altera

EPF10K30EFC256-2X - 30K FLEX-10KE FPGA 1728 Cells 256-BGA | Intel / Altera

料号： EPF10K30EFC256-2X ✗ 停产

有现货 1-3 个工作日内发货

2.375 V to 2.625 V Vdss 256-FBGA (17x17) Package 200 MHz Speed

低至 $17.95 USD / 件

最小起订量： 1 |

价格更新于： 2026-09-11

批量定价

数量	单价	小计
1	$38.5	$38.50
10	$32.4	$324.00
100	$26.85	$2,685.00
500	$21.2	$10,600.00
1,000	$17.95	$17,950.00

ℹ️ 所有价格均以 USD 计价

查看数据手册 (PDF) 查看替代料

数量

EPF10K30EFC256-2X 概述

The Intel / Altera EPF10K30EFC256-2X is a member of the FLEX-10KE embedded programmable logic family, delivering 30,000 gates and 1,728 logic elements on a 0.22 µm CMOS process in a 256-ball FineLine BGA package measuring 17x17 mm. It operates from a 2.375 V to 2.625 V (2.5 V nominal) supply and supports user I/O counts up to 176 with a propagation delay as low as 0.6 ns and internal frequency up to 200 MHz.

What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable semiconductor that can be configured by the designer after manufacturing to implement custom digital logic. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) -> FPGAs -> SRAM-based FPGAs -> embedded-block FPGAs. The FLEX-10KE family pioneered embedded array blocks, integrating RAM and logic to enable System-on-a-Programmable-Chip (SOPC) designs that combine glue logic, FIFOs, and state machines on a single device.

Key features include 24,576 bits of embedded SRAM distributed across EABs (Embedded Array Blocks), 216 Logic Array Blocks (LABs), 0.22 µm CMOS technology, and a -2 speed grade. The FineLine BGA package provides high I/O density for designs requiring many parallel interfaces in a compact footprint, suitable for legacy telecom, industrial control, and ASIC prototyping systems.

Typical applications include ASIC prototyping, glue-logic consolidation, custom DSP pre-processing, telecom interface bridges, and industrial bus controllers. The device is also used in test equipment, military/aerospace (when properly screened), and legacy communications infrastructure where the FLEX-10KE architecture is well-supported by mature toolchains such as Quartus II and MAX+PLUS II.

When designing with this device, ensure proper decoupling per FLEX-10KE guidelines and verify configuration mode support (e.g., passive serial, JTAG) against the toolchain version. Note that this part is now legacy hardware - confirm long-term availability with authorized distributors before committing to new designs.

直接替换替代料： EPF10K30EFC256-2X ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号： EPF10K30EFC256-2X （相同外形与封装尺寸） ——差异在于 Operating Temperature, Speed Grade, Package, Process Technology, Logic Elements / Cells.

EPF10K100EFC256-2X

Altera

Logic Elements / Cells: 49,152

对比 EPF10K30EFC256-2X →

EPF10K30EFC256-1

Intel

Operating Temperature: 0C to +70C (Commercial)

Speed Grade: -1

Process Technology: 0.22 µm CMOS SRAM

对比 EPF10K30EFC256-2X →

EPF10K30EFC256-1X

Intel

Operating Temperature: 0 °C to +70 °C (commercial)

Speed Grade: -1X (fastest commercial)

Package: 256-ball FBGA, 17 x 17 mm, 1.0 mm pitch (FineLine BGA)

对比 EPF10K30EFC256-2X →

EPF10K30EFC256-2

Altera

Operating Temperature: 0 C to 70 C (commercial)

Speed Grade: -2 (commercial, mid-speed)

Package: 256-FBGA (17x17 mm)

对比 EPF10K30EFC256-2X →

EPF10K30EFC256-2N

Intel

Operating Temperature: 0 °C to +70 °C (Commercial)

Speed Grade: -2N (mid-grade, 0.6 ns)

Package: 256-ball FineLine BGA (PBGA256), 17 x 17 mm, 1.0 mm pitch

对比 EPF10K30EFC256-2X →

EPF10K30EFC256-2XN

Altera

Operating Temperature: -40 C to +85 C (Industrial, 'N' suffix)

Package: 256-ball FBGA, 17x17 mm

Process Technology: 0.22 micrometer CMOS, 4-layer metal

对比 EPF10K30EFC256-2X →

EPF10K30EFC256-3

Intel

Speed Grade: -3 (fastest)

Package: 256-ball FineLine BGA

Process Technology: 0.22 micrometer CMOS

对比 EPF10K30EFC256-2X →

✅ 直接替换

Altera

📦 256-FBGA (17x17)

FLEX-10KE · FLEX 10KE · 49,152 · 624 · 4,992 · 49,152 · 191 · 100,000

✓ 有现货

$30.5 / 个

查看数据手册 →

EPF10K30EFC256-2X 最大额定值与电气特性

Series	FLEX-10KE
Family	FLEX 10KE
Gates	30,000
Logic Elements / Cells	1,728
Number of LABs/CLBs	216
Number of Logic Elements/Cells	1,728
Total RAM Bits	24,576
Number of I/O	176
Voltage - Supply	2.375 V to 2.625 V
工作温度	0°C to 70°C
Internal Frequency (Max)	200 MHz
Propagation Delay	0.6 ns
Technology	0.22 µm CMOS
Supplier Device Package	256-FBGA (17x17)
封装 / 外壳	256-BGA
安装类型	Surface Mount
Speed Grade	-2

EPF10K30EFC256-2X 256-bga 引脚配置指南

EPF10K30EFC256-2X（256-bga 封装）的引脚配置。该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

暂无详细引脚数据： EPF10K30EFC256-2X.

请参阅数据手册以查看完整引脚配置。

典型应用

EPF10K30EFC256-2X 适用于 6 应用s: ASIC Prototyping and Pre-Silicon Validation, Glue Logic Consolidation, Telecom Interface Bridging, Industrial Control and Bus Controllers, Legacy Communications Infrastructure, Test and Measurement Equipment.

🖥️

ASIC Prototyping and Pre-Silicon Validation

The EPF10K30EFC256-2X is widely used in legacy ASIC prototyping because its 1,728 logic elements and 24,576 bits of embedded SRAM provide enough capacity to validate mid-complexity ASIC designs before tape-out. The 200 MHz internal frequency and 0.6 ns propagation delay enable accurate timing emulation of many ASIC blocks. The 256-FBGA 17x17 mm package supports high I/O density required for chip-to-FPGA emulation boards, with 176 user I/Os enabling parallel signal access.

推荐

🔧

Glue Logic Consolidation

Many legacy designs use the EPF10K30EFC256-2X to replace discrete TTL/CMOS glue logic with a single programmable device. Its 216 LABs and 1,728 LEs can absorb dozens of standard logic parts, reducing PCB area and improving reliability. The 2.5 V core and configurable I/O standards allow direct interfacing with 3.3 V and 5 V legacy components when proper level shifting is used. The device's JTAG support enables in-system reconfiguration.

推荐

EPF10K30EFC256-2N · Intel EPC2LC20 · Altera

🌐

Telecom Interface Bridging

Telecom systems from the late 1990s and early 2000s frequently use the EPF10K30EFC256-2X as a protocol bridge between E1/T1 framers, HDLC controllers, and TDM backplanes. Its 24,576 bits of embedded SRAM can hold framing buffers and look-up tables, while the 200 MHz internal frequency supports typical telecom bit rates. The 256-FBGA package's 176 I/Os accommodate multiple parallel telecom interfaces in a single device.

推荐

EPF10K50EFC256-2 (Higher-density FLEX-10KE variant) EPF10K50EFI484-2 (FBGA-484 option with more I/O)

🏭

Industrial Control and Bus Controllers

The EPF10K30EFC256-2X is found in industrial PLCs, motor controllers, and fieldbus interface cards where it implements custom control logic, encoder decoding, and serial protocol handling. Its 0.6 ns propagation delay allows fast feedback loop implementations. The 0°C to 70°C commercial operating temperature range suits indoor control cabinet environments, while the 176 I/Os accommodate multiple sensor inputs and actuator outputs.

推荐

EPF10K30EFC256-1 · Intel EPF10K30EFC256-1X · Intel

📡

Legacy Communications Infrastructure

Many installed telecom base stations and switching centers still rely on FLEX-10KE FPGAs for channel card processing. The EPF10K30EFC256-2X supports custom framing, encryption pre-processing, and routing functions on legacy equipment. Its mature Quartus II and MAX+PLUS II toolchain support keeps existing designs operational, and authorized distributors continue to supply stock for service continuity.

推荐

EPF10K30EFC256-2X · Altera EPF10K30ATC144-2N · Altera

📊

Test and Measurement Equipment

The EPF10K30EFC256-2X is used in test equipment for custom timing generation, pattern matching, and data acquisition sequencing. Its embedded EABs can implement deep FIFOs for capturing high-speed transients, while the 176 I/Os drive multiple test channels simultaneously. The 200 MHz internal frequency supports high-resolution timing applications in oscilloscope and logic analyzer auxiliary modules.

推荐

EPF10K100EQC240-2 · Altera EPF10K200SFC484-2 · Altera

推荐产品汇总

EPF10K100EFC256-2X Altera 用于： ASIC Prototyping and Pre-Silicon Validation EPF10K130EFC484-3 Intel 用于： ASIC Prototyping and Pre-Silicon Validation EPF10K30EFC256-2N Intel 用于： Glue Logic Consolidation EPC2LC20 Altera 用于： Glue Logic Consolidation EPF10K50EFC256-2 Higher-density FLEX-10KE variant 用于： Telecom Interface Bridging EPF10K50EFI484-2 FBGA-484 option with more I/O 用于： Telecom Interface Bridging EPF10K30EFC256-1 Intel 用于： Industrial Control and Bus Controllers EPF10K30EFC256-1X Intel 用于： Industrial Control and Bus Controllers EPF10K30EFC256-2X Altera 用于： Legacy Communications Infrastructure EPF10K30ATC144-2N Altera 用于： Legacy Communications Infrastructure EPF10K100EQC240-2 Altera 用于： Test and Measurement Equipment EPF10K200SFC484-2 Altera 用于： Test and Measurement Equipment

What is the operating voltage range of the EPF10K30EFC256-2X FPGA?

The EPF10K30EFC256-2X operates from a supply voltage of 2.375 V to 2.625 V, with a 2.5 V nominal core rail typical for the FLEX-10KE family. According to the Altera FLEX 10KE device handbook, the I/O banks can be configured for 3.3 V or 2.5 V signaling depending on the design. Decoupling capacitors must follow the manufacturer reference schematic for stable operation.

How many logic elements does the EPF10K30EFC256-2X contain?

The EPF10K30EFC256-2X contains 1,728 logic elements (LEs) organized into 216 Logic Array Blocks (LABs), and provides 30,000 typical gates with 24,576 bits of embedded SRAM distributed across EABs. According to Altera datasheets, this makes it well-suited for glue-logic consolidation, FIFOs, and ASIC prototyping on the FLEX-10KE architecture.

Is the EPF10K30EFC256-2X still in production or is it obsolete?

The EPF10K30EFC256-2X is classified as obsolete and not recommended for new designs. The FLEX-10KE family is legacy hardware, though stock remains available through authorized distributors and brokers. Engineers should verify long-term availability and second-source options before committing to a new design using this part.

What package does the EPF10K30EFC256-2X use and how many pins does it have?

The EPF10K30EFC256-2X uses a 256-ball FineLine BGA (FBGA) package measuring 17x17 mm. This high-density package supports the device's 176 user I/O pins while maintaining a compact footprint, which is typical for the FLEX-10KE family targeting ASIC prototyping and high I/O applications.

What is the maximum internal frequency of the EPF10K30EFC256-2X?

The EPF10K30EFC256-2X supports a maximum internal frequency of 200 MHz with a propagation delay of approximately 0.6 ns at the -2 speed grade. According to Altera FLEX 10KE datasheet specifications, real-world performance depends on the logic utilization and routing, with lower fMAX values achievable when designs use full device resources.

Where can I buy EPF10K30EFC256-2X online and what is the lead time?

The EPF10K30EFC256-2X can be purchased from authorized distributors including DigiKey and Mouser, as well as from brokers and surplus suppliers. Lead time for this obsolete part typically ranges from stock to 8-12 weeks depending on available inventory. Pricing as of 2026-09-11 starts around $38.50 for single-piece orders.

What is the price of EPF10K30EFC256-2X in volume quantities?

As of 2026-09-11, the EPF10K30EFC256-2X is priced at approximately $38.50 at qty 1, $32.40 at qty 10, $26.85 at qty 100, $21.20 at qty 500, and $17.95 at qty 1000. Because this is an obsolete legacy FPGA, pricing varies significantly between distributors, brokers, and surplus channels; always request firm quotes for production quantities.

EPF10K30EFC256-2X vs EPF10K30EFC256-2N - which is better for new designs?

Neither is recommended for new designs because both FLEX-10KE variants are obsolete. The EPF10K30EFC256-2X is the lead-free / Pb-free X-marked variant, while the -2N suffix denotes a standard speed grade and lead-free option as well. For new designs, consider current-generation Cyclone or MAX families with equivalent or higher logic density and active lifecycle support.

EPF10K30EFC256-2X vs EPF10K100EFC256-2X - which has more logic capacity?

The EPF10K100EFC256-2X has significantly more logic capacity than the EPF10K30EFC256-2X, with approximately 100,000 typical gates versus 30,000 typical gates, and more logic elements per device. Both share the 256-FBGA package and FLEX-10KE family, but the 100K variant is suitable for larger designs requiring more EABs and logic resources.

When should I choose the EPF10K30EFC256-2X over a modern FPGA?

Choose the EPF10K30EFC256-2X only for legacy system maintenance, exact-replacement repairs, or designs with an existing FLEX-10KE IP core and toolchain that cannot be migrated. For new designs, current-generation Intel Cyclone IV/V or Lattice ECP5 FPGAs offer more logic capacity, lower power, and active lifecycle support at competitive cost.

What is the best drop-in replacement for the EPF10K30EFC256-2X?

The closest drop-in replacement is the EPF10K30EFC256-2N, which shares the same 256-FBGA 17x17 mm package and identical FLEX-10KE silicon. Both have the same 1,728 LEs and 30K gates. For functional migration to an active device, the EPF10K30EFC256-3N provides a different speed grade and same package footprint.

Can the EPF10K30EFC256-2X be replaced by a Cyclone series FPGA?

Direct pin-for-pin replacement by a Cyclone FPGA is not possible because the FLEX-10KE and Cyclone architectures use different ball maps, configuration schemes, and JTAG IDs. Functional migration requires PCB rework and full re-implementation of the design using Quartus II or newer Cyclone tools. Engineers should treat this as a redesign, not a drop-in replacement.

Where can I download the EPF10K30EFC256-2X datasheet PDF?

The official Altera / Intel datasheet for the FLEX 10KE family can be downloaded from Intel's FPGA documentation archive. Search for 'FLEX 10KE Device Handbook' on the Intel FPGA website. The datasheet includes pinout diagrams, electrical characteristics, configuration mode specifications, and AC timing parameters for the entire FLEX-10KE family including the EPF10K30E device.

Where can I find the pinout diagram for the EPF10K30EFC256-2X 256-BGA package?

The pinout diagram for the EPF10K30EFC256-2X is included in the FLEX 10KE Device Handbook, available from Intel's FPGA documentation archive. The 256-FBGA package uses a 17x17 mm grid with balls arranged in a FineLine BGA pattern. Reference designators and ball function assignments are listed in the handbook's device-specific tables.

What are the key specifications engineers should know about the EPF10K30EFC256-2X?

Key specifications of the EPF10K30EFC256-2X include: 1,728 logic elements, 216 LABs, 24,576 bits of embedded SRAM, 176 user I/Os, 2.5 V core supply (2.375-2.625 V), 200 MHz max internal frequency, 0.6 ns propagation delay, 0.22 µm CMOS process, and 256-ball FBGA 17x17 mm package. Operating temperature is 0°C to 70°C. Source: Altera FLEX 10KE datasheet family.

What cross-brand equivalent exists for the EPF10K30EFC256-2X?

There is no direct cross-brand pin-for-pin equivalent for the EPF10K30EFC256-2X because FLEX-10KE is a proprietary Altera architecture. Functional alternatives from other vendors like Xilinx XC4000-series or Lattice ispMACH parts offer similar gate counts but require complete PCB redesign and HDL migration. Treat any cross-brand match as a redesign project, not a drop-in.

工程参考数据： EPF10K30EFC256-2X ——对比、设计指导和合规信息。

选型指南

Choose the EPF10K30EFC256-2X when you need a 30K-gate FLEX-10KE FPGA with the -2 speed grade for timing-critical legacy designs and 176 user I/Os in the 256-FBGA 17x17 mm package. Choose the EPF10K30EFC256-2N as an equivalent drop-in if your contract manufacturer prefers the N-suffix lead finish. Choose the EPF10K30EFC256-1X or EPF10K30EFC256-1 if your design does not require the -2 speed grade and you can accept ~125 MHz max internal frequency (param_match_percentage 80 - within 30% drop-in tolerance). Choose the EPF10K100EFC256-2X when you need more logic capacity in the same package footprint - it offers ~3x the gates while remaining pin-compatible. All five alternatives share the 256-FBGA 17x17 mm package, enabling PCB layout reuse. For new designs, consider current-generation Cyclone IV/V or Lattice ECP5 devices rather than this legacy FLEX-10KE part.

与替代料对比

参数	本产品	EPF10K30EFC256-2N	EPF10K30EFC256-2	EPF10K30EFC256-1X	EPF10K30EFC256-1	EPF10K100EFC256-2X
Package	256-FBGA (17x17)	256-FBGA (17x17) - same	256-FBGA (17x17) - same	256-FBGA (17x17) - same	256-FBGA (17x17) - same	256-FBGA (17x17) - same
Brand	Altera	Altera	Altera	Altera	Altera	Altera
Series / Family	FLEX-10KE	FLEX-10KE	FLEX-10KE	FLEX-10KE	FLEX-10KE	FLEX-10KE
Logic Elements	1,728	1,728	1,728	1,728	1,728	4,992
Typical Gates	30,000	30,000	30,000	30,000	30,000	100,000
Speed Grade	-2	-2	-2	-1	-1	-2
Internal Frequency (Max)	200 MHz	200 MHz	200 MHz	~125 MHz (lower fMAX)	~125 MHz (lower fMAX)	200 MHz
Total RAM Bits	24,576	24,576	24,576	24,576	24,576	40,960
User I/Os	176	176	176	176	176	176

关键差异点

Exact same FLEX-10KE silicon and 256-FBGA footprint for zero-design-change drops （对比 EPF10K30EFC256-2N)
Three times more logic capacity in the same footprint for design growth headroom （对比 EPF10K100EFC256-2X)
Higher speed grade offers ~60% higher fMAX for timing-critical paths （对比 EPF10K30EFC256-1X)

设计说明

The EPF10K30EFC256-2X operates from a 2.375 V to 2.625 V core supply with separate VCCIO pins for I/O bank voltage selection. Decoupling per Altera FLEX-10KE guidelines requires bulk capacitors (≥47 µF) at each power plane entry plus 0.1 µF and 0.01 µF high-frequency ceramics near each VCC/VCCIO pin group. Power sequencing between VCCINT and VCCIO must be coordinated to prevent I/O latchup during power-up.

Estimated: at typical 2.5 V core with 80% toggle rate at 200 MHz, core current approximates 250-400 mA, dissipating ~0.6-1.0 W. The 256-FBGA package requires a properly designed thermal copper pour and via array beneath the die to dissipate heat to inner PCB layers. Forced airflow is recommended for closed enclosure designs. Junction temperature must remain below 125°C for the commercial-grade EPF10K30EFC256-2X (0°C to 70°C ambient range).

Use at least a 4-layer PCB with dedicated ground and power planes for FLEX-10KE designs. The 256-FBGA 17x17 mm package requires 1.0 mm pitch BGA fanout routing - use microvia stack-ups or HDI technology for breakout. Reference the Altera AN-114 application note for BGA escape routing and impedance-controlled trace recommendations.

Common pitfalls: (1) Do not confuse -2X (lead-free speed grade -2) with -2N (lead-free speed grade -2 with N suffix indicating different lead-finish variant); both are functional drop-ins but check your contract manufacturer's RoHS requirements. (2) The FLEX-10KE configuration schemes require external configuration devices (e.g., EPC2) - verify JTAG chain integrity. (3) The MAX+PLUS II legacy toolchain is end-of-life; use Quartus II 13.0 or earlier Web Edition for continued design support.

合规信息

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Applicable

无铅

Unknown

无卤

Unknown

冲突矿物

Unknown

RoHS and lead-free status not specified in verified web data. The -2X suffix historically indicates a Pb-free mat tin finish per Altera legacy naming conventions, but this should be confirmed against the manufacturer's material declaration. AEC-Q100 not applicable - this is a commercial-grade legacy FPGA.

数据核验日期： 2026-09-11 ——数据由 XAIPART 元器件工程团队核验和整理

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