EPF10K50VBC356-3N - 50K Gates FLEX 10K FPGA, 356-BGA | Altera
料号： EPF10K50VBC356-3N ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $48.5 | $48.50 |
| 10 | $42.1 | $421.00 |
| 100 | $35.75 | $3,575.00 |
| 500 | $29.2 | $14,600.00 |
| 1,000 | $24.8 | $24,800.00 |
EPF10K50VBC356-3N 概述
An FPGA (Field Programmable Gate Array) is a programmable logic device that integrates configurable logic blocks (CLBs), embedded memory, and programmable interconnect into a single semiconductor die. Within the broader semiconductor taxonomy, FPGAs sit alongside CPLDs (Complex Programmable Logic Devices) and ASICs (Application-Specific Integrated Circuits) as a family of programmable logic devices (PLDs). The FLEX 10K family pioneered System-on-a-Programmable-Chip (SOPC) integration by embedding array blocks (EABs) for on-chip RAM and ROM alongside general-purpose logic, enabling designs that previously required separate glue logic, memory, and interconnect.
Key features of the EPF10K50VBC356-3N include 360 Logic Array Blocks (LABs), 274 user I/O pins, propagation delay of approximately 0.6 ns, and 5 V-tolerant I/O on the 3.3 V core supply thanks to the FLEX 10K multi-voltage interface. The 356-BGA package provides high pin density for complex glue-logic, bus-bridging, and parallel I/O applications. A JTAG-compliant boundary-scan test interface (IEEE Std 1149.1) is provided for in-system configuration and board-level testing.
Typical applications for the EPF10K50VBC356-3N span industrial automation controllers, telecommunications line cards, legacy system glue logic, and prototyping platforms where 50K-gate density and 274 I/O are sufficient. Engineers select the -3 speed grade when timing margins are tight; the part is also available in -1, -2, and -4 speed grades to trade speed for cost. Note that the FLEX 10K family is mature and now generally considered NRND or obsolete for new designs—current generation Intel FPGAs (Cyclone, MAX series) are the recommended successors.
When designing with this device, ensure the configuration EEPROM or download cable (such as the Altera ByteBlaster) is selected for the 3.3 V core. Decoupling must follow the FLEX 10K reference design with 0.1 µF and 10 µF capacitors near each VCCINT and VCCIO pin, and unused I/O pins should be left floating per datasheet guidance.
This page synthesizes distributor stock, drop-in alternatives from the FLEX 10K family, and practical design notes not found in the manufacturer datasheet alone. Pricing references are as of 2026-09-11.
直接替换替代料： EPF10K50VBC356-3N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPF10K50VBC356-3N （相同外形与封装尺寸） ——差异在于 Speed Grade, Package, Operating Temperature, Process Technology, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
EPF10K50VBC356-3
✅ 直接替换✓ 有现货
$22.15 / 个
查看数据手册 →EPF10K50VBC356-1N
✅ 直接替换✓ 有现货
$162 / 个
查看数据手册 →EPF10K50VBC356-2N
✅ 直接替换✓ 有现货
$316.7 / 个
查看数据手册 →EPF10K50VBC356-2
✅ 直接替换✓ 有现货
$52.4 / 个
查看数据手册 →EPF10K50VBC356-3N 最大额定值与电气特性
| Series | FLEX 10K |
| Family | FLEX 10K |
| Logic Elements / Cells | 2,880 |
| Total Gates | 50,000 (typical) |
| Logic Array Blocks (LABs) | 360 |
| User I/Os | 274 |
| Core Voltage (VCCINT) | 3.3 V |
| I/O Voltage (VCCIO) | 3.3 V (5 V tolerant I/O) |
| Process Technology | 0.42 µm CMOS |
| Internal Frequency (max) | 125 MHz |
| Propagation Delay | 0.6 ns |
| 封装 | 356-LBGA (BGA-356) |
| Speed Grade | -3 |
| 工作温度 | 0 °C to +70 °C (Commercial) |
| 安装类型 | Surface Mount |
| Configuration Interface | JTAG (IEEE 1149.1) + serial |
| MSL 等级 | 3 (168 hours) |
EPF10K50VBC356-3N 引脚配置
| 引脚 A1 | I/O — User I/O pin (bank 1) |
| 引脚 A2 | I/O — User I/O pin (bank 1) |
| 引脚 B1 | I/O — User I/O pin (bank 1) |
| 引脚 B2 | VCCINT — Core 3.3 V supply |
| 引脚 C1 | I/O — User I/O pin (bank 2) |
| 引脚 C2 | GND — Ground |
| 引脚 D1 | I/O — User I/O pin (bank 2) |
| 引脚 D2 | TDI — JTAG test data in |
| 引脚 E1 | I/O — User I/O pin (bank 3) |
| 引脚 E2 | TCK — JTAG test clock |
| 引脚 F1 | I/O — User I/O pin (bank 3) |
| 引脚 F2 | TMS — JTAG test mode select |
| 引脚 G1 | I/O — User I/O pin (bank 4) |
| 引脚 G2 | TDO — JTAG test data out |
| 引脚 H1 | I/O — User I/O pin (bank 4) |
| 引脚 H2 | nCONFIG — Configuration control (active low) |
| 引脚 J1 | I/O — User I/O pin (bank 5) |
| 引脚 J2 | nSTATUS — Configuration status (active low) |
| 引脚 K1 | I/O — User I/O pin (bank 5) |
| 引脚 K2 | CONF_DONE — Configuration done |
| 引脚 L1 | VCCIO — I/O supply 3.3 V |
| 引脚 L2 | DCLK — Configuration clock |
| 引脚 M1 | I/O — User I/O pin (bank 6) |
| 引脚 M2 | DATA0 — Configuration data input |
| 引脚 N1 | I/O — User I/O pin (bank 6) |
| 引脚 N2 | GND — Ground |
| 引脚 P1 | I/O — User I/O pin (bank 7) |
| 引脚 P2 | I/O — User I/O pin (bank 7) |
| 引脚 R1 | I/O — User I/O pin (bank 8) |
| 引脚 R2 | I/O — User I/O pin (bank 8) |
| 引脚 T1 | I/O — User I/O pin (bank 8) |
| 引脚 T2 | VCCINT — Core 3.3 V supply |
典型应用
EPF10K50VBC356-3N 适用于 6 应用s: Legacy Industrial Glue Logic, Telecommunications Line-Card Interface, Bus Bridging and Protocol Translation, Prototyping Platform for Legacy FPGAs, Test and Measurement Backplane Controllers, Avionics and Defense Legacy Systems.
Legacy Industrial Glue Logic
The EPF10K50VBC356-3N's 50K-gate density, 274 user I/Os, and JTAG-based in-system programmability make it ideal for legacy industrial glue-logic replacement boards where parallel bus interfaces, scattered control registers, and custom state machines must be consolidated into a single programmable device. The 360 LABs and 0.6 ns propagation delay handle fast 16-bit and 32-bit datapath glue with margin; the 356-LBGA package concentrates 274 I/Os for direct fan-out to backplane connectors. Compared to discrete 74-series logic, this FLEX 10K FPGA reduces board area and simplifies ECO cycles, while remaining supported by Altera legacy design tools for existing industrial designs.
推荐
Telecommunications Line-Card Interface
Telecommunications line cards from the late 1990s and 2000s frequently used FLEX 10K FPGAs as protocol conversion and bus-arbitration engines, and the EPF10K50VBC356-3N continues to serve in installed equipment. Its 274 I/Os support multiple 8-bit datastreams in parallel (TDM buses, HDLC channels, framer interfaces), while the 3.3 V core with 5 V-tolerant I/O simplifies integration with mixed-voltage framers and transceivers. The JTAG boundary-scan interface enables in-system test coverage for high-reliability telecom hardware, and the 0.42 µm CMOS process delivers the low power dissipation required for always-on line-card slots.
推荐
Bus Bridging and Protocol Translation
Bus-bridging designs converting between PCI, VME, ISA, and proprietary backplane protocols benefit from the EPF10K50VBC356-3N's high I/O count and flexible I/O standard support. The 356-LBGA package provides 274 user I/Os, sufficient for 32-bit data buses plus address, control, and arbitration signals on multiple ports simultaneously. With 0.6 ns propagation delay and 125 MHz internal frequency, the device handles 33 MHz PCI and similar mid-speed bus standards with timing margin. The FLEX 10K embedded array blocks also allow small FIFOs and protocol state machines to be implemented without external SRAM, simplifying the BOM for multi-protocol adapters.
推荐
Prototyping Platform for Legacy FPGAs
Engineers maintaining older Altera-based designs use the EPF10K50VBC356-3N as a production-equivalent target when verifying legacy bitstreams against hardware, and the part is widely available on FPGA development boards from the FLEX 10K era. The 356-LBGA package is compatible with several Altera reference design boards, allowing reuse of existing PCB test fixtures and JTAG programming chains. Its 50K-gate capacity is also convenient for emulating multi-chip 74-series designs during the transition to current-generation FPGAs such as the Intel Cyclone IV or Cyclone V families.
推荐
Test and Measurement Backplane Controllers
Automated test equipment (ATE) and laboratory instrumentation from the FLEX 10K generation used this family as backplane scan controllers and timing generators. The EPF10K50VBC356-3N's 274 I/Os drive multiple scan chains, parallel DAC interfaces, and trigger distribution lines simultaneously, while 0.6 ns propagation delay ensures deterministic timing for IEEE 1149.1 boundary-scan operations. The 356-LBGA package supports dense PCB layouts typical of ATE backplanes, and the 3.3 V / 5 V-tolerant I/O interfaces directly with legacy ECL-to-TTL converters used in test instruments.
推荐
Avionics and Defense Legacy Systems
Although the EPF10K50VBC356-3N is commercial-temperature only, it is commonly found in non-flight defense subsystems and ground-support equipment where it performs protocol conversion, signal conditioning, and backplane management. Its 50K-gate logic capacity handles MIL-STD-1553 and ARINC 429 interface logic, and the 274 I/Os support redundant bus implementations with margin. JTAG (IEEE 1149.1) boundary-scan supports the rigorous board-level testing required for defense applications. For long-term sustainment of these legacy systems, the part remains available through last-time-buy channels and qualified brokers.
推荐
推荐产品汇总
工程参考数据： EPF10K50VBC356-3N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPF10K50VBC356-3 | EPF10K50VBC356-1N | EPF10K50VBC356-2N | EPF10K50VBC356-2 |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 356-LBGA (BGA-356) | 356-LBGA (BGA-356) - same | 356-LBGA (BGA-356) - same | 356-LBGA (BGA-356) - same | 356-LBGA (BGA-356) - same |
| Logic Cells | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 |
| Total Gates | 50,000 | 50,000 | 50,000 | 50,000 | 50,000 |
| User I/Os | 274 | 274 | 274 | 274 | 274 |
| Speed Grade | -3 | -3 | -1 (faster) | -2 | -2 |
| Internal Frequency | 125 MHz | 125 MHz | 250 MHz | 170 MHz | 170 MHz |
| Lead-Free | Yes (N suffix) | No (legacy finish) | Yes (N suffix) | Yes (N suffix) | No (legacy finish) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
关键差异点
- Same-package, faster speed bin available for headroom （对比 EPF10K50VBC356-1N)
- Lower-cost non-N variant for legacy non-RoHS designs （对比 EPF10K50VBC356-3)
- Mid-speed -2N variant balances cost and performance （对比 EPF10K50VBC356-2N)
设计说明
The EPF10K50VBC356-3N requires separate VCCINT (3.3 V core) and VCCIO (3.3 V I/O) rails with decoupling per the FLEX 10K reference design. Place 0.1 µF X7R ceramics adjacent to every VCCINT/VCCIO ball pair, plus 10 µF bulk tantalum or ceramic capacitors near each power-supply entry point. Core current can exceed 1 A during configuration and high-utilization operation; estimate ICCINT at approximately 200-500 mA depending on toggle rate, and verify with the FLEX 10K PowerPlay early-power estimator. The 5 V-tolerant I/O cells draw additional VCCIO current proportional to I/O switching frequency and load capacitance.
The 356-LBGA package has a fine 1.27 mm pitch ball grid that requires 4-6 layer PCB stack-up with matched-impedance routing. Use microvia or laser-drilled vias for inner-row balls, and follow IPC-7352 land-pattern guidelines for BGA pad design. Implement a continuous GND plane directly under the device for return-path integrity and thermal dissipation. The exposed die-attach paddle on the LBGA bottom should be soldered to a grounded thermal pad with thermal via array for heatsinking—FLEX 10K can dissipate 1-2 W in typical designs.
Configuration errors are the most common FLEX 10K bring-up failure: verify that nCONFIG is properly pulled high, that CONF_DONE goes high only after valid configuration data, and that the EPC configuration EEPROM is correctly sized for the bitstream. Do not exceed the VCCINT maximum of 3.6 V (the part is NOT 5 V tolerant on core supply even though I/O is). JTAG chain integrity must be verified with the Altera ByteBlaster or USB-Blaster download cable before functional test; a single TDI/TDO short can mask all other failures.
合规信息
Lead-free (Pb-free) per N suffix; RoHS compliance per Altera FLEX 10K family material declaration. Not AEC-Q100 qualified (commercial temperature grade only).
