EPF10K50VQC240-2N - 50K Gates FLEX 10K FPGA 240-PQFP | Intel
料号： EPF10K50VQC240-2N ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $13.95 | $1,395.00 |
| 500 | $11.8 | $5,900.00 |
| 1,000 | $10.1 | $10,100.00 |
EPF10K50VQC240-2N 概述
What is an FPGA? An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer configures after manufacture. FPGAs sit above CPLDs in the programmable logic hierarchy and are used to implement arbitrary digital logic, DSP pipelines, glue logic, bus interfaces, and full soft processor cores. The FLEX 10K family was the industry's first device to embed an array block alongside the logic array, enabling true SOPC integration where memory and logic coexist on one programmable fabric.
Key features of this device include 360 Logic Array Blocks (LABs), 20,480 typical RAM bits, built-in low-skew clock distribution trees, fast and predictable FastTrack Interconnect continuous routing, JTAG boundary-scan support, and tri-state emulation. The internal maximum frequency is 125 MHz and the propagation delay is approximately 0.6 ns. It is the commercial temperature grade variant, specified for 0 °C to 70 °C operation with a -2 speed grade.
Technically, the FLEX 10K architecture is implemented with SRAM configuration memory, allowing unlimited re-programmability in-system through the ByteBlaster or BitBlaster configuration interfaces. The embedded array blocks (EABs) provide true dual-port RAM, ROM, and multiplier functions, while the LABs each contain eight logic elements. This makes the EPF10K50VQC240-2N suitable for telecommunications, industrial control, consumer electronics, and legacy digital system retrofits where mid-density programmable logic is required.
Typical applications include telecom line cards, motor and motion control, factory automation backplanes, networking glue logic, and ASIC prototyping. For replacement scenarios, this part is pin-compatible with other EPF10K50VQC240 speed grades (-1, -3) and the VQC240 family in general. Design with 3.0 V to 3.6 V core supply, ensure JTAG chain integrity, and follow Altera AN 116 configuration guidelines.
直接替换替代料： EPF10K50VQC240-2N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPF10K50VQC240-2N （相同外形与封装尺寸） ——差异在于 Process Technology, Operating Temperature, Configuration Method, Package, Mounting Type.
快速对比工具——选择替代料号进行并排对比：
EPF10K50VQC240-3N
✅ 直接替换✓ 有现货
$49.95 / 个
查看数据手册 →EPF10K50VQC240-1N
✅ 直接替换✓ 有现货
$11.5 / 个
查看数据手册 →EPF10K50EQC240-2N
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$87.2 / 个
查看数据手册 →EPF10K50VQI240-2N
✅ 直接替换✓ 有现货
$55 / 个
查看数据手册 →EPF10K30AQC240-1N
✅ 直接替换✓ 有现货
$52.9 / 个
查看数据手册 →EPF10K50VQC240-2N 最大额定值与电气特性
| Series | FLEX 10K |
| Family | FLEX 10K (FLEX 10KE) |
| Typical Gates | 50,000 |
| Logic Elements / Cells | 2,880 |
| Logic Array Blocks (LABs) | 360 |
| Total RAM Bits | 20,480 |
| User I/Os | 189 |
| 工作电源电压 | 3.0 V to 3.6 V (3.3 V nominal) |
| Process Technology | 0.42 µm CMOS |
| Internal Frequency (max) | 125 MHz |
| Propagation Delay | 0.6 ns |
| Speed Grade | -2 |
| 工作温度 | 0 °C to +70 °C (Commercial) |
| Package Type | 240-BFQFP (PQFP, 32x32 mm) |
| 安装类型 | Surface Mount |
| Logic Family | CMOS (SRAM-based) |
| Configuration Method | SRAM, JTAG (ByteBlaster / BitBlaster) |
| Lead Free / RoHS | Not RoHS-compliant (contains lead, SnPb finish) |
EPF10K50VQC240-2N 240-bfqfp (pqfp, 32x32 mm) 引脚配置指南
EPF10K50VQC240-2N（240-bfqfp (pqfp, 32x32 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EPF10K50VQC240-2N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EPF10K50VQC240-2N 适用于 6 应用s: Telecommunications Line Cards, Industrial Control and Factory Automation, ASIC Prototyping and Logic Emulation, Legacy Digital System Retrofits, Test and Measurement Equipment, Networking Glue Logic and Protocol Bridging.
Telecommunications Line Cards
The EPF10K50VQC240-2N fits telecom line card designs through its mid-range 2,880 logic elements and 189 user I/Os, sufficient to bridge legacy TDM buses (E1/T1 framers) to backplane fabrics. With 360 LABs and 20,480 RAM bits, it can implement glue logic between framer ICs, line interface units, and switch fabrics, while the 0.6 ns propagation delay and 125 MHz internal Fmax handle the parallel bus multiplexing required for HDLC controllers. The 240-PQFP 32x32 mm package is compatible with through-hole-style rework stations still common in telecom depot repair workflows. The built-in JTAG chain allows in-system reprogramming for field firmware updates without removing the line card.
推荐
Industrial Control and Factory Automation
The EPF10K50VQC240-2N serves industrial control backplanes by providing 189 user I/Os to interface parallel sensors, stepper motor controllers, and PLC backplanes while the 2,880 logic elements implement finite state machines and encoder decoders. The SRAM-based configuration supports in-system firmware upgrades via JTAG, allowing factory-floor reprogramming without board removal. The 240-PQFP package accepts robust socketed or soldered mounting, which is standard in retrofit automation panels where boards may need swapping. Designers can leverage the 20,480 RAM bits to implement FIFO buffers between conveyor line controllers and SCADA uplinks, with the 125 MHz Fmax handling the deterministic cycle times required for motor commutation logic.
推荐
ASIC Prototyping and Logic Emulation
The EPF10K50VQC240-2N is well-suited as an ASIC prototyping vehicle because its 50K gates and 189 I/Os approximate mid-range gate-array densities typical of 1990s-era ASICs, allowing designers to validate RTL before committing to a hard mask. The SRAM configuration can be reloaded in seconds through the ByteBlaster or JTAG, supporting rapid design-iteration cycles. The 240-PQFP package enables quick swap-out on prototype boards, and the 0.6 ns propagation delay and 125 MHz internal Fmax approximate the timing characteristics of gate-array ASICs from the same era, giving reasonable pre-silicon validation accuracy. Embedded array blocks provide true dual-port RAM for prototyping ASIC RAM macros.
推荐
Legacy Digital System Retrofits
The EPF10K50VQC240-2N fits legacy system retrofits where EOL 74-series TTL and PAL-based designs must be replaced by a single programmable device, with 189 user I/Os sufficient to absorb wide TTL data buses and 2,880 logic elements consolidating dozens of discrete glue-logic packages. The 240-PQFP 32x32 mm footprint is compatible with through-hole-to-SMD adapter boards used in legacy equipment refurbishment, and the JTAG interface allows ISP updates in fielded units without desoldering. Designers can also use it as a 'socket adapter' replacement: drop it into a retired PLCC84 PAL footprint via adapter PCB to modernize legacy boards with minimal mechanical rework.
推荐
Test and Measurement Equipment
The EPF10K50VQC240-2N serves test and measurement chassis where parallel data acquisition, custom waveform generation, and protocol decoding all need flexible digital logic. Its 189 user I/Os can directly capture 16-bit-wide parallel ADC buses, while 2,880 logic elements implement decoders for SPI, I2C, UART, and custom proprietary test protocols. The 20,480 bits of embedded RAM buffer captured samples before DMA handoff to the host controller. Operating from a single 3.3 V rail simplifies power tree design in portable instrument form factors, and JTAG-based configuration lets manufacturers ship the same hardware with different firmware personalities for different SKUs.
推荐
Networking Glue Logic and Protocol Bridging
The EPF10K50VQC240-2N handles networking glue logic where Ethernet MACs, PHY interfaces, TDM framers, and switch fabrics must be bridged together. With 189 I/Os, it can simultaneously connect a 32-bit processor bus, an MII/RMII PHY, and an SPI-managed switch fabric, while 2,880 logic elements implement header parsing, CRC checking, and packet buffering state machines. The 125 MHz internal Fmax comfortably handles 100 Mbit/s MII clock domains, and the 20,480 RAM bits serve as small packet queues before DMA to main memory. The 240-PQFP footprint also simplifies thermal management in 1U rack-mount networking gear.
推荐
推荐产品汇总
工程参考数据： EPF10K50VQC240-2N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPF10K50VQC240-3N | EPF10K50VQC240-1N | EPF10K50EQC240-2N | EPF10K50VQI240-2N | EPF10K30AQC240-1N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 240-PQFP (BFQFP, 32x32 mm) | 240-PQFP - same | 240-PQFP - same | 240-PQFP - same | 240-PQFP - same | 240-PQFP - same |
| Typical Gates | 50,000 | 50,000 | 50,000 | 50,000 | 50,000 | 30,000 |
| Logic Elements / Cells | 2,880 | 2,880 | 2,880 | 2,880 | 2,880 | 1,728 |
| Speed Grade | -2 | -3 (faster) | -1 (slower) | -2 | -2 | -1 |
| Operating Temperature | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | -40 °C to +85 °C (Industrial) | 0 °C to +70 °C |
| Core Voltage | 3.3 V (3.0-3.6 V) | 3.3 V | 3.3 V | 2.5 V (FLEX 10KE) | 3.3 V | 3.3 V |
| User I/Os | 189 | 189 | 189 | 189 | 189 | 189 |
关键差异点
- Faster speed grade in identical package （对比 EPF10K50VQC240-3N)
- Industrial temperature grade in same footprint （对比 EPF10K50VQI240-2N)
- Lower-power FLEX 10KE variant in same footprint （对比 EPF10K50EQC240-2N)
设计说明
The EPF10K50VQC240-2N core requires a stable 3.3 V supply within the 3.0 V to 3.6 V range as specified in the FLEX 10K datasheet. Decouple VCCINT with one 100 µF bulk plus 0.1 µF + 0.01 µF ceramics at each VCCINT pin group, and place a ferrite bead between the 3.3 V regulator and the FPGA's VCCINT pins to suppress switching noise from adjacent logic. The I/O banks (VCCIO) are 5 V tolerant and may be tied to a separate rail; if mixing 3.3 V and 5 V peripherals, provision both rails.
Estimated: configuration mode pins (MSEL0/MSEL1) must be tied correctly for the chosen configuration scheme; leaving them floating causes the device to fail to enumerate on power-up. JTAG chain integrity must be verified before production: TCK should be pulled to a known state through a 1 kΩ resistor, and the ByteBlaster header should include the nCONFIG pull-up (typically 10 kΩ to VCCIO). Designers migrating from FLEX 10K (V) to FLEX 10KE (E) variants must check that all used features are supported, since some legacy EAB configurations differ.
The 240-PQFP (32x32 mm) package has a typical θJA around 30-35 °C/W for the BFQFP body. In enclosed industrial enclosures with no airflow, derate the operating temperature: at 1 W internal dissipation, expect a 30 °C junction temperature rise. For sealed cabinets, mount the FPGA on a copper area at least 1 sq-in on top and bottom layers and provide a 100 LFM minimum airflow; thermal vias under the exposed die-pad region significantly improve heat transfer.
合规信息
The EPF10K50VQC240-2N is a legacy 1990s-era PQFP FPGA and was originally released with tin-lead (SnPb) finish; it is NOT RoHS-compliant. For RoHS-compliant replacements, consult Intel/Altera FLEX 10KE (E-suffix) variants which were later released with lead-free finishes. AEC-Q100 not applicable as this is a commercial-grade FPGA, not an automotive-qualified part.
