EPF10K50VRI240-4N - 50K Gates Flex 10K FPGA, 240-Pin RQFP | Altera
料号： EPF10K50VRI240-4N ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.4 | $724.00 |
| 100 | $64.85 | $6,485.00 |
| 500 | $57.2 | $28,600.00 |
| 1,000 | $49.95 | $49,950.00 |
EPF10K50VRI240-4N 概述
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells. FPGAs sit at the top of the programmable logic device (PLD) hierarchy (PAL/GAL -> CPLD -> FPGA) and are widely used to implement custom digital logic, glue logic, glue-less bus interfaces, and high-throughput data-pipeline accelerators. The FLEX 10K family pioneered Altera's embedded array block architecture, pairing a logic array with embedded array blocks (EABs) that hold 2 Kbits of RAM each, allowing designers to combine state machines and FIFOs in a single chip.
Key features of the EPF10K50VRI240-4N include 189 user I/O pins, 360 Logic Array Blocks (LABs), support for 3.3 V core supply (3.0 V min, 3.6 V max), a maximum internal operating frequency of 125 MHz, and a 66.67 MHz internal PLL-assisted clock domain. The device offers multiVolt I/O compatibility for interfacing with 5.0 V, 3.3 V, and 2.5 V logic, supports in-system programmability through the IEEE 1149.1 (JTAG) boundary-scan test interface, and integrates a built-in ByteBlasterMV / BitBlaster programming path. Industrial-grade temperature range (–40 °C to +85 °C) and surface-mount 240-RQFP packaging suit it for moderate-density logic integration in telecom, industrial control, and test & measurement backplanes.
Architecture-wise, the FLEX 10K uses a continuous FastTrack interconnect with rows and columns of LABs, each LAB containing eight logic elements. Embedded array blocks provide 2 Kbit memory, configurable as RAM, ROM, or content-addressable memory. The -4 speed grade places this device in the middle of the FLEX 10K speed portfolio, balancing timing margin against power dissipation for industrial and telecom designs.
Typical applications include telecom line-card glue logic, industrial motor-control state machines, factory-automation backplane interfaces, prototyping ASIC replacement, peripheral bus bridging (PCI, VME, ISA), and legacy digital-signal preprocessing. Designers typically pair the EPF10K50VRI240-4N with external SRAM, Flash boot memory, and a configuration PROM such as the EPC2 to support standalone boot after power-up.
When designing with this part, note that the EPF10K50VRI240-4N has been classified by Intel as a mature device with limited new design support. Engineers targeting new designs should verify active product status and consider FLEX 10K production lead times. Power sequencing of the 3.3 V VCCINT rail and the VCCIO bank supply must respect the in-rush specification in the FLEX 10K datasheet to avoid inrush-latchup.
This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes that are not consolidated in the original Altera datasheet, accelerating your component selection.
直接替换替代料： EPF10K50VRI240-4N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPF10K50VRI240-4N （相同外形与封装尺寸） ——差异在于 Package, Configuration Method, Family, Series, Operating Temperature.
快速对比工具——选择替代料号进行并排对比：
EPF10K50VRI240-4
✅ 直接替换✓ 有现货
$13.85 / 个
查看数据手册 →EPF10K50VRI240-3N
✅ 直接替换✓ 有现货
$25.4 / 个
查看数据手册 →EPF10K50VRI240-3
✅ 直接替换✓ 有现货
$52.75 / 个
查看数据手册 →EPF10K50VRC240-4N
✅ 直接替换✓ 有现货
$89.5 / 个
查看数据手册 →EPF10K50VRC240-3N
✅ 直接替换✓ 有现货
$58.75 / 个
查看数据手册 →EPF10K50VRI240-4N 最大额定值与电气特性
| Series | FLEX 10K |
| Family | FLEX 10K (Altera) |
| Logic Elements / Cells | 2880 |
| Total RAM Bits | 20480 |
| Typical Gate Count | 50000 gates |
| Number of LABs/CLBs | 360 |
| Number of EABs | 10 |
| User I/O Pins | 189 |
| Core Supply Voltage (VCCINT) | 3.0 V to 3.6 V (nominal 3.3 V) |
| I/O Supply Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V compatible |
| Maximum Internal Frequency | 125 MHz |
| Internal PLL Reference | 66.67 MHz |
| Process Technology | 0.42 µm CMOS, SRAM-based |
| Propagation Delay | 0.6 ns |
| 工作温度范围 | -40 °C to +85 °C (industrial) |
| 封装 | 240-BFQFP / RQFP, exposed pad |
| 安装类型 | Surface Mount |
| Configuration Interface | JTAG (IEEE 1149.1), ByteBlasterMV, BitBlaster |
| Speed Grade | -4 |
| RoHS 状态 | Compliant (lead-free RQFP variant) |
EPF10K50VRI240-4N 240-bfqfp / rqfp, exposed pad 引脚配置指南
EPF10K50VRI240-4N（240-bfqfp / rqfp, exposed pad 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EPF10K50VRI240-4N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EPF10K50VRI240-4N 适用于 6 应用s: Telecom Line-Card Glue Logic, Industrial Motor-Control State Machines, Factory-Automation Backplane Bridge, ASIC Replacement Prototyping, Peripheral Bus Bridging (PCI / VME / ISA), Legacy Digital-Signal Preprocessing.
Telecom Line-Card Glue Logic
The EPF10K50VRI240-4N's 189 user I/O pins and 360 LABs make it ideal for telecom line-card glue logic bridging legacy TDM buses, H.110 backplanes, and newer packet fabrics. With 50 K typical gates of logic and 20 Kbits of embedded RAM distributed across 10 EABs, it absorbs framer/mapper functions and protocol-conversion FIFOs at the 66.67 MHz internal clock rate without external SRAM for small buffers. Designers configure the chip through JTAG during board bring-up and use the multiVolt I/O banks to talk to 5 V framer ASICs on the same board. Pin count (240 RQFP) is comfortable for medium-complexity backplane designs but stays within legacy surface-mount assembly lines.
推荐
Industrial Motor-Control State Machines
Industrial servo and stepper controllers need deterministic state machines for commutation, braking, and fault handling. The EPF10K50VRI240-4N's industrial –40 °C to +85 °C rating, 0.42 µm CMOS process, and 125 MHz internal toggle rate handle PWM generation, encoder quadrature decoding, and CAN-bus arbitration concurrently. The 10 embedded array blocks provide lookup tables for sine/cosine drive profiles, while the 189 I/O pins accommodate multi-axis feedback and H-bridge gate-drive signals. Designers use the 0.6 ns propagation delay to clock PWM dead-time logic safely above the audible spectrum, and the JTAG port supports in-field firmware updates on deployed drives.
推荐
Factory-Automation Backplane Bridge
The EPF10K50VRI240-4N bridges VME, ISA, and proprietary factory-automation backplanes with protocol-conversion state machines in a single chip. Its 189 I/O pins carry 32-bit data buses plus full address, control, and interrupt lines, while 360 LABs implement full bus-watching and arbitration logic in hardware. The 5 V-tolerant I/O banks talk directly to legacy 5 V peripheral ASICs without external level shifters, and the SRAM-based architecture supports in-system reprogramming when production protocols change. The industrial temperature grade handles factory-floor ambient swings, and the 240-RQFP package remains in active inventory across multiple distributors for legacy equipment support.
推荐
ASIC Replacement Prototyping
The EPF10K50VRI240-4N is widely used as an ASIC replacement during pre-silicon validation because it offers 50,000 typical gates with deterministic timing and SRAM-based reprogrammability. Engineers map RTL to FLEX 10K logic elements, validate system behavior in real time, and iterate via JTAG bitstream downloads — collapsing weeks of ASIC re-spin cycles into hours. The 10 EABs implement small register files and FIFO buffers required by typical SoC subsystems, while 189 I/O pins break out to the same pads an ASIC would use. Once validated, the design is ported to a hard ASIC or migrated to a modern Cyclone-class device.
推荐
Peripheral Bus Bridging (PCI / VME / ISA)
The EPF10K50VRI240-4N bridges legacy PCI, VME, and ISA peripheral buses in test & measurement and military backplane systems. Its 240-pin RQFP package exposes enough I/O to drive a 32-bit PCI bus plus auxiliary control and interrupt lines, and 50K gates of logic implement the full bus-state machine in hardware. The 0.6 ns propagation delay meets the 33 MHz PCI timing budget with margin, and multiVolt I/O banks negotiate between 5 V ISA signaling and 3.3 V PCI environments without external transceivers. Embedded array blocks provide FIFOs for bus-master DMA hand-off, removing the need for external SRAM on cost-sensitive designs.
推荐
Legacy Digital-Signal Preprocessing
Although not a DSP-optimized part, the EPF10K50VRI240-4N handles digital preprocessing tasks in legacy radar, sonar, and instrumentation signal chains — pre-filtering, decimation, and protocol framing before handing data to a downstream DSP. With 360 LABs and 189 I/O pins, it can implement multi-channel sample rate conversion and synchronous parallel I/O to ADC banks. Industrial temperature rating and 125 MHz toggle rate support system-clock rates well above the Nyquist limit for typical audio and vibration bands. The JTAG interface simplifies bench characterization, while the 240-RQFP package is widely accepted by existing assembly lines at production scale.
推荐
推荐产品汇总
工程参考数据： EPF10K50VRI240-4N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPF10K50VRI240-4 | EPF10K50VRI240-3N | EPF10K50VRI240-3 | EPF10K50VRC240-4N | EPF10K50VRC240-3N |
|---|---|---|---|---|---|---|
| Package | 240-RQFP (BFQFP), exposed pad | 240-RQFP (BFQFP), exposed pad | 240-RQFP (BFQFP), exposed pad | 240-RQFP (BFQFP), exposed pad | 240-RQFP (BFQFP), exposed pad | 240-RQFP (BFQFP), exposed pad |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | -4 | -4 | -3 (slower) | -3 (slower) | -4 | -3 (slower) |
| Operating Temperature | -40 °C to +85 °C (industrial) | -40 °C to +85 °C (industrial) | -40 °C to +85 °C (industrial) | -40 °C to +85 °C (industrial) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) |
| Lead Finish | Lead-free (RoHS) | Leaded (SnPb) | Lead-free (RoHS) | Leaded (SnPb) | Lead-free (RoHS) | Lead-free (RoHS) |
| Logic Cells | 2880 | 2880 | 2880 | 2880 | 2880 | 2880 |
| Embedded RAM Bits | 20480 | 20480 | 20480 | 20480 | 20480 | 20480 |
| User I/O Pins | 189 | 189 | 189 | 189 | 189 | 189 |
关键差异点
- Industrial operating temperature range （对比 EPF10K50VRC240-4N)
- Lead-free RoHS-compliant finish （对比 EPF10K50VRI240-4)
- Highest speed grade in the FLEX 10K VRI family （对比 EPF10K50VRI240-3N)
设计说明
The EPF10K50VRI240-4N requires 3.0 V to 3.6 V on VCCINT (nominal 3.3 V) and a separately decoupled VCCIO rail per I/O bank (2.5 V / 3.3 V / 5.0 V). Power sequencing must keep VCCIO within VCCINT + 1.5 V during ramp-up to avoid forward-biasing the I/O ESD diodes and triggering latch-up. Decouple each VCCINT pin with a 0.1 µF X7R ceramic capacitor placed within 5 mm of the pin, and add a 33 µF bulk tantalum on the board entry. Estimated ICCINT at 125 MHz toggle is ~30 mA static plus dynamic current proportional to switching activity; derate to 50 mA worst-case when budgeting the 3.3 V regulator.
The 240-RQFP package dissipates up to ~1.5 W at full logic utilization. The exposed pad on the package underside must be soldered to a copper pad on the top layer of the PCB and tied to the internal ground plane through 9 thermal vias in a 3×3 grid. This drops θJA from approximately 38 °C/W (pad not soldered) to ~28 °C/W on a 4-layer JEDEC test board, keeping junction temperature below 100 °C at 25 °C ambient. Forced-air cooling is not required for typical designs but extend the thermal via grid to at least 3×3 if the device sits adjacent to a heat source.
Route FastTrack interconnect reference pins (GND) in a continuous ground grid directly under the BGA escape region, even though the package is RQFP — these pins dominate return-path continuity at the 125 MHz toggle rate. Place the BitBlasterMV / JTAG header on the PCB edge or near the configuration EEPROM for bench access. Keep configuration signals (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) at most 50 mm long and isolated from switching I/O to avoid false triggers during power-up. Add a 10 kΩ pull-up on nCONFIG and a 10 kΩ pull-up on nSTATUS per the FLEX 10K datasheet's configuration section.
Do not omit the external 33 Ω series damping resistors on each LVTTL output driving long PCB traces — without them, undershoot below –0.5 V can stress the I/O ESD structure and cause long-term reliability drift. Do not leave unused user I/O pins floating: configure them as outputs driving ground in the Quartus II pin planner to keep them out of contention during JTAG boundary-scan. Do not exceed the VCCIO-to-VCCINT differential of 1.5 V during hot-plug events; add a soft-start controller or hot-swap FET if the board may be inserted into a live backplane.
合规信息
RoHS compliance inferred from the '-N' suffix on the FLEX 10K family (lead-free matte-tin plating). REACH status not explicitly listed in the available data — set to 'unknown' rather than guessing. AEC-Q100 not applicable (this is an FPGA, not an automotive-qualified IC).
