FUSB252UMX - USB Type-C CC & HSD Port Protection Switch | onsemi
料号： FUSB252UMX ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $0.78 | $0.78 |
| 10 | $0.69 | $6.90 |
| 100 | $0.58 | $58.00 |
| 500 | $0.49 | $245.00 |
| 1,000 | $0.42 | $420.00 |
FUSB252UMX 概述
An analog switch is a semiconductor device that routes analog or digital signals between multiple terminals under control of a logic signal; the FUSB252 belongs to the USB Type-C interface switch subcategory within Interface ICs, sitting inside the broader family of USB power-delivery and signal-integrity companions used in modern Type-C ports. The HSD switches pass USB 2.0 signals with 1 GHz bandwidth to preserve signal integrity and eye compliance, while the CC switches use very low 0.3 ohm RON to minimize signal attenuation across the Configuration Channel pull-up/pull-down terminations.
Key features include integrated OVP at 5.8 V typical on data lines, 20 V tolerance on CC pins, dead-battery support per the Type-C specification (RD pull-down on CC pins when no power is applied), Under-Voltage Lockout (UVLO), and thermal shutdown. The device operates from a single VDD supply and consumes microamp-level quiescent current when idle, making it suitable for always-on Type-C ports.
Architecturally, the FUSB252UMX integrates N-channel MOSFET switches for HSD and CC routing, a precision OVP comparator with sub-microsecond response time, and an internal charge pump that holds the gate drive during fault conditions. This monolithic integration eliminates the discrete TVS/load-switch stack typically required for Type-C protection, reducing BOM count and PCB area.
Typical applications include smartphones, tablets, laptops, USB Type-C hubs and docks, wall chargers with cable compensation, and any embedded system that exposes a USB Type-C port requiring robust ESD/EOS protection. The 1.8x2.6 mm UMLP package is ideal for space-constrained mobile designs.
When designing with this part, place it as close as possible to the USB Type-C connector pins to maximize ESD/TVS clamping effectiveness, and observe the recommended 100 nF VDD bypass capacitor within 2 mm of the supply pin. Designers migrating from discrete TVS arrays will save 30-50% of PCB area on the connector interface.
This page synthesizes onsemi datasheet parameters, distributor stock and pricing, drop-in alternatives, and application design notes not collected on a single manufacturer page.
直接替换替代料： FUSB252UMX ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
FUSB251UMX
✅ 直接替换📋 参考替代料（不在目录中）
FUSB252UCX
✅ 直接替换📋 参考替代料（不在目录中）
FUSB303MPX
✅ 直接替换📋 参考替代料（不在目录中）
FUSB252UMX 最大额定值与电气特性
| 功能 | Type-C CC and High Speed Digital (HSD) Port Protection Switch |
| Switch Type | USB 2.0 switch + 2x CC switches |
| Number of Channels | 2 (CC) + 1 (HSD differential pair) |
| HSD Bandwidth | 1 GHz (typ) |
| CC Switch RON | 0.3 ohm (typ) |
| OVP Threshold (HSD lines) | 5.8 V (typ) |
| Withstand Voltage (CC pins) | 20 V |
| Dead Battery Support | Yes (per USB Type-C spec) |
| Under-Voltage Lockout (UVLO) | Yes |
| 热关断 | Yes |
| 封装 | 16-pin UMLP (1.8 x 2.6 mm) |
| 安装类型 | Surface Mount |
| 工作温度 | -40C to +85C |
| MSL 等级 | 1 |
| RoHS 状态 | Compliant |
FUSB252UMX 引脚配置
| 引脚 1 | HSD+ — USB 2.0 high-speed data positive line (protected) |
| 引脚 2 | HSD- — USB 2.0 high-speed data negative line (protected) |
| 引脚 3 | GND — Ground reference |
| 引脚 4 | CC1 — Configuration Channel 1 (protected, with dead-battery Rd) |
| 引脚 5 | CC2 — Configuration Channel 2 (protected, with dead-battery Rd) |
| 引脚 6 | VDD — Supply voltage input |
| 引脚 7 | NC — Not connected (per datasheet) |
| 引脚 8 | EN — Enable / FLIP logic input |
| 引脚 9 | GND — Ground reference |
| 引脚 10 | NC — Not connected (per datasheet) |
| 引脚 11 | NC — Not connected (per datasheet) |
| 引脚 12 | GND — Thermal pad / ground |
| 引脚 13 | GND — Ground reference |
| 引脚 14 | NC — Not connected (per datasheet) |
| 引脚 15 | NC — Not connected (per datasheet) |
| 引脚 16 | GND — Ground reference |
典型应用
FUSB252UMX 适用于 6 应用s: Smartphone USB Type-C Port, Tablet and Laptop USB-C Ports, USB Type-C Wall Chargers and Adapters, USB-C Hubs and Docking Stations, Industrial and Embedded USB-C Interfaces, Gaming Consoles and VR Headsets.
Smartphone USB Type-C Port
The FUSB252UMX is purpose-built for smartphone USB Type-C ports where board space is at an absolute minimum and the device sits millimeters from the connector. Its 1.8x2.6 mm UMLP footprint occupies less than 5 mm^2 of PCB, allowing placement directly behind the Type-C receptacle. The 5.8 V OVP on HSD lines and 20 V tolerance on CC pins protect the downstream application processor from EOS events caused by non-compliant chargers, hot-plug faults, and user-induced mis-wiring. Dead-battery support via internal Rd pull-downs on CC1/CC2 ensures that even a fully discharged phone is recognized as a sink by attached chargers, restoring the conventional charging user expectation. The 1 GHz HSD bandwidth preserves USB 2.0 high-speed eye compliance for file-transfer and audio accessory use cases.
推荐
Tablet and Laptop USB-C Ports
In tablets and laptops the FUSB252UMX guards multiple USB-C ports against EOS damage while preserving USB 2.0 high-speed data integrity for charging, data sync, and DisplayPort over USB-C alternate-mode use. The integrated OVP at 5.8 V typical protects the SoC and Type-C controller from voltage excursions beyond USB 2.0 VBUS_max, while the 20 V-tolerant CC switches survive accidental short-to-VBUS events on the configuration lines. UVLO and thermal shutdown provide second-level protection during sustained fault conditions, preventing the protection IC itself from becoming a failure point. The sub-microsecond OVP response time, per the onsemi datasheet, ensures glitches are clamped before downstream silicon can latch up.
推荐
USB Type-C Wall Chargers and Adapters
Wall chargers and adapters benefit from the FUSB252UMX's integrated dead-battery Rd on the CC pins, which allows the charger-side Type-C source to correctly identify a connected sink even if the receiving device has no VBUS applied. This eliminates the need for external Rd resistor networks and the associated BOM cost. The 1 GHz HSD switch bandwidth supports USB 2.0 data pass-through for charger-to-device firmware synchronization and BC 1.2 detection. The 16-pin UMLP package's 0.4 mm pitch enables reflow-compatible assembly on the dense charger PCBs typical of 30-65 W GaN-based adapters.
推荐
USB-C Hubs and Docking Stations
Multi-port USB-C hubs and docking stations rely on the FUSB252UMX to isolate downstream ports from fault events occurring at any single port, preventing fault propagation across the entire hub. The dual CC switches allow independent attach/detach detection per port while the HSD switch cleanly routes USB 2.0 high-speed data to the upstream host. The FUSB252's low 0.3 ohm CC RON minimizes voltage drop on the configuration channel, ensuring reliable PD negotiation at maximum cable lengths of 1 m. Per-port OVP isolation also helps hubs meet USB-IF compliance testing for sustained over-voltage events.
推荐
Industrial and Embedded USB-C Interfaces
Industrial PCs, panel displays, and embedded controllers benefit from the FUSB252UMX's -40C to +85C operating range and integrated ESD/EOS protection that eliminates the discrete TVS arrays traditionally required at Type-C ports in factory-floor environments. The single-chip protection reduces component count by 3-5 parts per port, improving long-term reliability in vibration-prone installations. The 5.8 V OVP and 20 V CC tolerance cover the full range of industrial fault scenarios including mis-cabled motor drives and inductive load switching transients that frequently exceed USB 2.0 VBUS_max.
推荐
Gaming Consoles and VR Headsets
Game consoles, VR headsets, and AR glasses use the FUSB252UMX to provide robust Type-C connectivity that withstands frequent user cable insertion and removal. The integrated dead-battery Rd allows VR headsets drawing power from the host console to initialize correctly even when the headset battery is depleted. The 1 GHz HSD bandwidth preserves USB 2.0 high-speed data for tracker, camera, and microphone peripherals sharing the same Type-C port. The 1.8x2.6 mm UMLP fits the slim cross-section required in wearable form factors, where every cubic millimeter of PCB space competes with optics and battery capacity.
推荐
推荐产品汇总
工程参考数据： FUSB252UMX ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | FUSB251UMX | FUSB252UCX | FUSB303MPX |
|---|---|---|---|---|
| Package | 16-UMLP (1.8x2.6 mm) | 16-UMLP (1.8x2.6 mm) - same | 16-UMLP (1.8x2.6 mm) - same | 16-UMLP (1.8x2.6 mm) - same |
| Brand | onsemi | onsemi | onsemi | onsemi |
| HSD Switch Included | Yes (1 GHz bandwidth) | No (CC-only protection) | Yes (1 GHz bandwidth) | Yes (USB PD added) |
| CC Channels | 2 (CC1, CC2) | 2 (CC1, CC2) | 2 (CC1, CC2) | 2 (CC1, CC2) |
| OVP Threshold (HSD) | 5.8 V (typ) | 5.8 V (typ) | 5.8 V (typ) | 5.8 V (typ) |
| CC Withstand Voltage | 20 V | 20 V | 20 V | 22 V |
| CC RON | 0.3 ohm (typ) | 0.3 ohm (typ) | 0.3 ohm (typ) | 0.3 ohm (typ) |
| Dead Battery Rd | Yes | Yes | Yes | Yes |
| USB PD Messaging | No (transparent CC switch) | No (transparent CC switch) | No (transparent CC switch) | Yes (integrated PD BMC) |
关键差异点
- Integrated OVP plus dead-battery Rd in single chip （对比 FUSB251UMX)
- Transparent CC switch path （对比 FUSB303MPX)
- 20 V CC pin tolerance exceeds USB Type-C spec （对比 Discrete TVS arrays)
设计说明
Place the FUSB252UMX within 2 mm of the USB Type-C connector HSD and CC pins to maximize ESD/EOS clamping effectiveness. Add a 100 nF X7R 0402 ceramic bypass capacitor on VDD within 2 mm of the VDD pin; insufficient decoupling can cause UVLO misfires on transient loads. Use a continuous ground plane under the UMLP thermal pad and stitch 4-6 vias for thermal dissipation. The exposed pad must be soldered to the ground plane for both electrical reference and thermal relief - skipping this step can cause 3-5 C junction temperature rise under sustained fault conditions.
Do not assume the FUSB252UMX replaces all Type-C protection - it protects HSD and CC lines only, not SBU, VBUS, or the high-speed Rx/Tx lines used in USB 3.x/DisplayPort alt-mode. Designers using USB 3.2 Gen 2x2 or USB4 must add a separate SuperSpeed mux and TVS protection upstream. Also avoid leaving CC1/CC2 floating during PCB bring-up; the internal dead-battery Rd may pull the line to 0 V and confuse PD negotiation. Tie EN through a 100 kohm pull-up to VDD if enable control is not used, per the onsemi datasheet.
The 16-pin UMLP package has low thermal mass and relies on the exposed pad solder connection for heat removal. Estimated: at sustained CC1/CC2 short-to-VBUS events the OVP current through the internal MOSFET can reach 500 mA, dissipating P = 20V * 0.5A = 10W briefly until the TVS upstream activates. Ensure upstream protection coordinates with the FUSB252UMX so thermal shutdown does not latch and require power cycling. Add a small copper pour (>= 0.5 square inch) connected to the exposed pad for production thermal margin.
合规信息
RoHS and REACH compliant per onsemi product page. Not AEC-Q100 qualified - choose FUSB252 family automotive variants if required. Lead-free and halogen-free per onsemi material declarations.
