GX79472 - Quad 96Gbaud Linear Driver for 800G Optical | Renesas
料号： GX79472 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 500 | $222 | $111,000.00 |
| 1,000 | $199 | $199,000.00 |
GX79472 概述
A linear driver (also called a linear amplifier or linear modulator driver) is a key analog building block inside the transmit path of an optical module. It sits between the high-speed DSP or SerDes and the electro-absorption modulated laser (EML) or Mach-Zehnder modulator (MZM). Its job is to deliver a precisely-scaled differential voltage swing that the optical modulator converts into the optical amplitude and phase transitions encoding 800 Gbit/s PAM-4 or higher symbol rates, while contributing minimal distortion and noise.
Key features of the GX79472 include four independent linear driver channels each capable of 96 Gbaud operation, per-channel 100 ohm differential AC-coupled inputs for direct DC-isolation from preceding SerDes outputs, an integrated SPI interface for per-channel gain and DC bias control, and a single-die integration that reduces PCB area and BOM count. The device targets 800G optical transmitter SFF modules for both metro and long-haul transport, where deterministic linearity and low additive jitter are essential at the highest symbol rates.
At the architecture level, the GX79472 uses a wideband analog design suitable for the high data rates demanded by next-generation coherent and direct-detect optical links. The single-die integration of RF amplifier and SPI control simplifies module-level PCB layout, reduces parasitic loop inductance, and supports the channel-density targets of QSFP-DD and OSFP form factors.
Typical applications include 800G coherent transmitter modules, metro and long-haul DWDM line-side optics, next-generation DCO pluggable modules, and high-speed test instrumentation driver references. The GX79472 also pairs naturally with Renesas coherent DSPs and high-speed TIAs.
A key design consideration is that the GX79472 requires precision DC blocking at the input and matched 50 ohm single-ended or 100 ohm differential transmission lines on the output to the modulator to preserve the 96 Gbaud eye margin. Designers should follow the reference layout in the datasheet to control channel-to-channel crosstalk. This page synthesizes manufacturer datasheet details, authoritative distributor pricing, and drop-in footprint alternatives not always shown on stock pages.
直接替换替代料： GX79472 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
GX79472-QUAL
✅ 直接替换📋 参考替代料（不在目录中）
GX79472-DNT
✅ 直接替换📋 参考替代料（不在目录中）
GX79472 最大额定值与电气特性
| 功能 | Quad-channel linear driver IC |
| Number of Channels | 4 (quad) |
| Maximum Baud Rate per Channel | 96 Gbaud |
| Input Configuration | Differential, AC-coupled, 100 ohm |
| Control Interface | SPI (DC bias, gain) |
| Target Application | 800G and beyond optical transmitter SFF modules |
| Use Cases | Metro and long-haul optical transport |
| Architecture | Linear amplifier + integrated SPI control on single die |
| Integration | Quad driver and DC control on single die |
| Package (DNT variant) | Die (unpackaged) |
| Quality Grade | QUAL (qualified) variant available |
| Evaluation Board | GX79472-DNT-EVB |
GX79472 die (unpackaged) 引脚配置指南
GX79472（die (unpackaged) 封装）的引脚配置。 该模拟元件具有输入、输出和电源引脚。请参阅制造商数据手册以了解失调调零、补偿和使能引脚配置。适用于信号调理和放大器电路。
暂无详细引脚数据： GX79472.
请参阅 数据手册 以查看完整引脚配置。
典型应用
GX79472 适用于 6 应用s: 800G Coherent Transmitter Module, Metro DWDM Line-Side Optics, Long-Haul Coherent Pluggable Module, Next-Generation DCO Pluggable Module, High-Speed Test Instrumentation Driver, Photonic-Integrated Circuit Driver.
800G Coherent Transmitter Module
In coherent 800G transmitters the GX79472 drives the I/Q modulator inputs directly. Each of its four differential channels can sustain 96 Gbaud symbol rates, matching the demands of 800 Gbps DP-16QAM and emerging 1.6 Tbps links. The on-die SPI interface lets the host DSP tune the DC bias and gain per channel to optimize IQ mixer linearity; this per-channel control is critical because coherent links require matched gain and tight balance across I and Q paths. Compared with lower-baud discrete drivers, the GX79472 lets designers collapse four driver channels onto one die, saving PCB footprint in QSFP-DD and OSFP modules while keeping the symbol rate headroom for the next-generation DCO roadmap.
推荐
Metro DWDM Line-Side Optics
Metro DWDM transmitters drive multiple optical carriers across the C-band. The GX79472's quad-channel 96 Gbaud capability lets one IC handle four EML or MZM modulators in parallel, supporting 4x 200G or 4x 400G line-side cards where physical layout density is essential. The integrated SPI lets the microcontroller adjust the DC bias point to compensate optical power or temperature drift, which improves long-term stability. The differential AC-coupled input accepts the direct output of a Renesas DSP or third-party SerDes, simplifying interface design. Metro deployments especially benefit from the device's low-power linear architecture, allowing more channels per face plate without raising the module's thermal budget.
推荐
Long-Haul Coherent Pluggable Module
Long-haul transceivers operate over thousands of kilometers where any driver non-linearity compounds chromatic and non-linear noise from the fiber. The GX79472's linear architecture preserves symbol fidelity at 96 Gbaud, giving long-haul designers margin for the demanding OSNR requirements of 16QAM, 64QAM and emerging probabilistic constellations. Each SPI-controlled channel permits per-lane equalization to balance gain across lanes - particularly important on complex grid spaced MUX/DEMUX cards. The single-die integration also minimizes the parasitic discontinuities that would otherwise appear in a multi-chip 4x driver layout, which directly improves the OSNR penalty typical of long-haul links. Pairing the GX79472 with a Renesas coherent DSP simplifies the full transmit chain for 1.6T pluggables targeting the long-haul market.
推荐
Next-Generation DCO Pluggable Module
Digital Coherent Optics (DCO) modules integrate the DSP, driver, and TIA into a single pluggable body at QSFP-DD or OSFP form factors. The GX79472 fits the driver role inside this architecture: four 96 Gbaud channels connect between the coherent DSP and the optical subassembly, and the SPI-controlled bias lets the DSP calibrate the driver for optimum PAM-4 or 16QAM performance. This is particularly valuable when the same platform must support multiple line rates (such as 400G, 800G, and 1.6T). Compared with lower-baud-rate drivers the GX79472 reduces the channel count needed inside the pluggable, allowing designers to use the freed PCB area for thermal management - a major bottleneck in DCO modules.
推荐
High-Speed Test Instrumentation Driver
Test and measurement equipment (BERTs, DCA modules, optical modulation analyzers) need a clean differential driver to set reference signals for 800G/1.6T characterization. The GX79472 provides four independently controllable 96 Gbaud drivers on a single die, perfect for parallel optical sources in test rigs. Its SPI interface is leveraged by lab automation software to sweep gain and DC bias empirically. Compared with using four separate instrumentation amplifiers, the GX79472 simplifies the bench setup, lowering channel-to-channel timing mismatch. Estimated: in a 4-port BERT setup a single PCB-mounted GX79472-QUAL plus four reference TOSA fixtures reduces footprint by roughly half versus a discrete multi-driver design.
推荐
Photonic-Integrated Circuit Driver
Photonic Integrated Circuits (PICs) for datacom and telecom route optical signals via silicon-nitride or indium-phosphide waveguides and need linear drivers that can be co-packaged directly onto the PIC. The GX79472-DNT bare-die variant is offered as a multi-chip module die specifically for this scenario. Once bonded to the photonic substrate, the driver delivers 96 Gbaud signals to four on-chip modulators, eliminating the high-speed inter-chip wiring that would otherwise dominate the channel-loss budget. Its compact single-die footprint, combined with SPI controllability, supports the convergence of optical and electrical functions in advanced PIC packaging. Estimated: bonding the bare die next to the modulators keeps channel insertion loss below 1 dB at 50 GHz, versus around 3 dB for a packaged variant over a flex-routed interconnect.
推荐
推荐产品汇总
工程参考数据： GX79472 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | GX79472-QUAL | GX79472-DNT |
|---|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Channels | 4 | 4 | 4 |
| Max Baud Rate per Channel | 96 Gbaud | 96 Gbaud | 96 Gbaud |
| Input Configuration | Differential AC-coupled, 100 ohm | Differential AC-coupled, 100 ohm | Differential AC-coupled, 100 ohm |
| Control Interface | SPI | SPI | SPI |
| Form Factor | Standard IC | Qualified IC | Bare die (for MCM/PIC) |
| Target Application | 800G+ optical transmitter SFF modules | 800G+ optical transmitter SFF modules | 800G+ optical transmitter modules / PIC co-packaging |
| End-market | Metro & long-haul | Metro & long-haul | Metro & long-haul / photonic integration |
关键差异点
- Quad 96 Gbaud on a single die （对比 GX7295 family (lower baud rate))
- Integrated SPI for per-channel control （对比 Generic discrete 4-channel drivers without on-die control)
- Bare-die option for PIC integration （对比 Packaged-only competitors)
设计说明
Use controlled-impedance 100 ohm differential transmission lines from each driver channel output to the modulator. Place AC-coupling capacitors immediately adjacent to the IC pads on the input side to avoid reflections at 96 Gbaud. Estimated: with a microstrip stackup of 8-mil substrate the differential insertion loss is roughly 0.05 dB/mm at 50 GHz, so keep total trace lengths under 10 mm where possible. Use the Renesas evaluation board layout as a reference for the SPI bus and supply-decap arrangement.
The GX79472 requires low-noise analog supplies; a switching regulator feeding the analog rail must be followed by a high-PSRR LDO and substantial decoupling. Place 100 nF X7R capacitors at each supply pin and a 4.7 uF or larger bulk capacitor within a few millimeters. Estimated: total supply noise should be kept below 0.5 mVrms to maintain 16QAM SNR margins on the modulator. SPI activity can couple into the analog rail; consider separating the SPI VIO supply from the analog supply with a ferrite bead.
At full 4-channel drive into a low-V swing load the package dissipates significant heat, especially inside compact QSFP-DD modules where airflow is limited. Confirm the package junction-to-ambient thermal resistance in the datasheet and size the thermal via array beneath the exposed pad accordingly. Estimated: a typical 4-channel continuous 96 Gbaud drive can dissipate up to several hundred mW per channel. Monitor the in-module temperature during qualification testing, particularly for long-haul applications where ambient temperatures may reach 70-85 C inside a chassis.
Do not assume the GX79472-DNT bare-die pads are bonded 1:1 to the GX79472-QUAL package pins - the pad-out differs and the data must be re-read for the die variant when designing a multi-chip module. Confirm that the SPI address of each instance is unique on shared buses. Avoid replacing the GX79472 with a generic 4-channel driver unless the baud rate, swing, and linearity specs are explicitly verified; the part's 96 Gbaud analog bandwidth is what differentiates it from earlier quad drivers.
合规信息
Compliance status not stated in the verified web data; confirm with Renesas product declaration before production release.
