IHLP2525CZER2R2M06 - 2.2µH 8A Shielded Power Inductor | Vishay Dale
料号： IHLP2525CZER2R2M06 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $0.92 | $0.92 |
| 10 | $0.83 | $8.30 |
| 100 | $0.66 | $66.00 |
| 500 | $0.54 | $270.00 |
| 1,000 | $0.45 | $450.00 |
IHLP2525CZER2R2M06 概述
A power inductor is a passive electronic component designed to store energy in a magnetic field when current flows through its coil winding. In switching power supplies, inductors smooth current ripple, filter noise, and temporarily hold energy during the switch-off phase of a converter. The shielded-molded construction places a magnetic shield around the winding, which dramatically reduces stray electromagnetic fields that could otherwise couple into nearby traces or sensitive analog circuits. Shielded molded inductors belong to the broader category of SMD power inductors within passive components.
Key features include a 2.2 µH nominal inductance with ±20% tolerance, 8 A rated saturation current handling capability, 17.73 mΩ maximum DCR for high efficiency, and a 100 kHz reference test frequency per Vishay's datasheet. The molded package provides mechanical robustness and uniform magnetic shielding, while the low profile supports space-constrained designs such as POL (point-of-load) converters and portable electronics.
The IHLP-2525CZ-06 family targets DC-DC converter inductor applications. The powdered-iron core allows soft saturation behavior, meaning inductance decreases gradually rather than collapsing abruptly under overcurrent conditions. This characteristic helps prevent catastrophic inductor failures and supports predictable converter operation under transient loads. The shielding also reduces acoustic noise from magnetostriction effects.
Typical applications include VRM (voltage regulator module) inductors for notebook and server CPUs, POL buck/boost converters in distributed power architectures, battery-powered portable devices, graphic card power circuits, and as output filter inductors in high-current point-of-load regulators.
When designing with this part, confirm that peak current (including ripple) stays below the saturation rating and that DCR power losses fit within the thermal budget of the PCB layout. Adequate copper pad geometry and thermal vias under the inductor footprint help dissipate heat.
This page synthesizes distributor pricing from DigiKey and Mouser, drop-in alternatives from Vishay's IHLP family, and practical design notes not found in the standalone manufacturer datasheet.
直接替换替代料： IHLP2525CZER2R2M06 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
IHLP2525CZER2R2M01
✅ 直接替换📋 参考替代料（不在目录中）
IHLP2525CZER1R0M06
✅ 直接替换📋 参考替代料（不在目录中）
IHLP2525CZER3R3M06
✅ 直接替换📋 参考替代料（不在目录中）
IHLP2525CZER4R7M06
✅ 直接替换📋 参考替代料（不在目录中）
IHLP2525CZERR47M06
✅ 直接替换📋 参考替代料（不在目录中）
IHLP2525CZER2R2M06 最大额定值与电气特性
| Inductance | 2.2 µH |
| Inductance Tolerance | ±20% |
| Test Frequency | 100 kHz |
| Rated Current (Saturation) | 8 A |
| DC Resistance (DCR) | 17.73 mΩ max |
| Construction Type | Shielded Molded Wirewound |
| Core Material | Powdered Iron |
| 封装 / 外壳 | 2525 (6.86 mm x 6.47 mm) Nonstandard SMD |
| 安装类型 | Surface Mount |
| Packaging | Tape & Reel |
| 工作温度 | -55°C to +125°C (per IHLP-2525CZ-06 family datasheet, document 34167) |
| Family Series | IHLP-2525CZ-06 |
| RoHS 状态 | Compliant |
IHLP2525CZER2R2M06 引脚配置
| 引脚 1 | Terminal 1 — Inductor terminal (symmetrical, no polarity) |
| 引脚 2 | Terminal 2 — Inductor terminal (symmetrical, no polarity) |
典型应用
IHLP2525CZER2R2M06 适用于 6 应用s: Point-of-Load (POL) Buck Converter Inductor, Notebook / Laptop VRM Inductors, Server and Datacenter Voltage Regulator Modules, Graphics Card / GPU Power Inductors, Battery-Powered Portable Device Power Management, Industrial and Automotive ECU Power Conditioning.
Point-of-Load (POL) Buck Converter Inductor
The IHLP2525CZER2R2M06's 2.2 µH inductance and 8 A saturation current make it ideal for point-of-load buck converters feeding FPGAs, ASICs, and CPU cores. At a typical 300-600 kHz switching frequency, 2.2 µH provides sufficient energy storage to keep ripple current within 20-30% of DC load. The 17.73 mΩ DCR minimizes conduction loss, supporting converter efficiencies above 92% at full load. The shielded molded package prevents magnetic coupling to adjacent inductors on densely-populated VRM boards, and the 2525 footprint fits standard POL land patterns used in 4-8 phase VRM designs for server and notebook processors.
推荐
Notebook / Laptop VRM Inductors
In notebook computer motherboard designs, the IHLP2525CZER2R2M06 serves as the output inductor for core voltage rails (typically 0.8V-1.2V at 4-7 A continuous). The compact 2525 footprint (6.86 mm x 6.47 mm) suits thin-and-light laptop layouts where Z-height is constrained. Low-DCR 17.73 mΩ minimizes battery drain and extends runtime, while the shielded construction prevents EMI from coupling into the audio codec, Wi-Fi module, or display drivers mounted nearby. The part's -55°C to +125°C operating range covers cold-start battery scenarios and sustained high-CPU-load thermal conditions.
推荐
Server and Datacenter Voltage Regulator Modules
Multi-phase VRMs powering server CPUs, GPUs, and memory subsystems use the IHLP2525CZER2R2M06 as a per-phase output inductor. With 8 A per phase and low 17.73 mΩ DCR, designers can parallel multiple phases (e.g., 4-6 phases) to deliver 30-50 A total CPU current. The shielded package reduces phase-to-phase crosstalk, which is critical for VRM dynamic response and minimizes output voltage ripple. The molded construction also provides the mechanical robustness required for high-vibration server fan environments and AEC-Q-style reliability testing where applicable.
推荐
Graphics Card / GPU Power Inductors
Modern graphics cards demand high-current, fast-transient power delivery to GPUs and GDDR memory. The IHLP2525CZER2R2M06 functions as a GPU VCORE or memory rail inductor where 8 A saturation and 17.73 mΩ DCR balance efficiency and thermal dissipation. The shielded construction is essential in graphics card layouts where multiple inductors are placed in close proximity - preventing magnetic coupling between phases preserves transient response and reduces output ripple that could affect GPU stability under gaming workloads.
推荐
Battery-Powered Portable Device Power Management
In portable battery-powered systems (e.g., industrial handhelds, medical tablets, USB-PD chargers), the IHLP2525CZER2R2M06 is used in buck-boost or single-inductor buck converters powering radios, sensors, or display subsystems. The 17.73 mΩ DCR is critical for maximizing battery life - at 4 A average load the conduction loss is only ~270 mW. The shielded molded package eliminates audible buzzing that would otherwise occur with unshielded inductors during light-load pulse-frequency-modulation operation common in portable designs.
推荐
Industrial and Automotive ECU Power Conditioning
The IHLP2525CZER2R2M06 finds use in industrial PLC modules, automotive ECU power rails, and 24V industrial bus converters where its -55°C to +125°C operating range supports harsh thermal environments. The powdered-iron core provides soft saturation behavior, which protects downstream loads from inrush current spikes during cold-crank or load-dump events. The shielded construction reduces EMI that could interfere with CAN bus transceivers or analog sensor signal conditioning in the same enclosure.
推荐
推荐产品汇总
工程参考数据： IHLP2525CZER2R2M06 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | IHLP2525CZER2R2M01 | IHLP2525CZER1R0M06 | IHLP2525CZER3R3M06 |
|---|---|---|---|---|
| Brand | Vishay Intertechnology | Vishay Intertechnology | Vishay Intertechnology | Vishay Intertechnology |
| Package | 2525 (6.86 mm x 6.47 mm) | 2525 (6.86 mm x 6.47 mm) - same | 2525 (6.86 mm x 6.47 mm) - same | 2525 (6.86 mm x 6.47 mm) - same |
| Inductance | 2.2 µH | 2.2 µH | 1.0 µH | 3.3 µH |
| Rated Current (Saturation) | 8 A | 8 A | 11.5 A | 7 A |
| DC Resistance (DCR) | 17.73 mΩ max | 20 mΩ max | 8.5 mΩ max (approx, lower DCR at lower L) | 23 mΩ max (approx) |
| Tolerance | ±20% | ±20% | ±20% | ±20% |
| Test Frequency | 100 kHz | 100 kHz | 100 kHz | 100 kHz |
| Construction | Shielded Molded Wirewound (powdered iron) | Shielded Molded Wirewound (powdered iron) | Shielded Molded Wirewound (powdered iron) | Shielded Molded Wirewound (powdered iron) |
| Price (qty 1000, USD) | $0.45 (approx) | $0.43 (approx) | $0.46 (approx) | $0.47 (approx) |
关键差异点
- Lower DCR than M01 sibling for higher efficiency （对比 IHLP2525CZER2R2M01)
- Higher inductance than 1.0 µH family member （对比 IHLP2525CZER1R0M06)
- Higher current rating than 3.3 µH family member （对比 IHLP2525CZER3R3M06)
设计说明
Estimated: at 8 A continuous current with 17.73 mΩ DCR, conduction power loss is approximately I²R = 8² × 0.01773 = 1.13 W. This heat must be dissipated through PCB copper connected to the inductor pads. For continuous 8 A operation in enclosed enclosures, use at least 1 oz copper pours on both top and bottom layers with thermal vias, or consider derating to 6-7 A for worst-case 70°C ambient. The molded package transfers heat to the PCB through its terminal pads more efficiently than unshielded bobbin-style inductors.
Recommended PCB land pattern is shown on the IHLP-2525CZ-06 datasheet (Vishay document 34167). Use symmetrical pad geometry - the inductor has no polarity. For high-current designs, expand the pads beyond the minimum to improve thermal dissipation; doubling the pad copper area reduces junction temperature rise by roughly 30%. Place input/output capacitors close to the switching IC, not the inductor, to minimize AC loop area and EMI.
Do not assume the 8 A saturation rating is also the continuous rating - the saturation current causes 20-30% inductance roll-off while continuous current is limited by thermal heating (typically 6-7 A continuous at 70°C ambient in still air). Verify peak current including ripple stays below the saturation curve in your datasheet. Avoid placing noise-sensitive analog circuitry directly adjacent to the inductor since the molded shield reduces but does not eliminate all stray field at high currents.
When using IHLP2525CZER2R2M06 in multi-phase VRMs, ensure phase nodes are rotated 180° between adjacent phases to cancel first-order magnetic field coupling between phases. Place the inductor close to the high-side/low-side switching FETs to minimize the AC switching loop; the energy-storage loop from inductor to output capacitor should be as short and wide as possible. Avoid routing noisy signals (e.g., gate drives) directly under the inductor body.
合规信息
RoHS and lead-free per Vishay product page; AEC-Q100 status not applicable to passive inductors; halogen-free status not explicitly stated in provided data.
