IPQ6000 - Quad A53 Wi-Fi 6 SoC, FCBGA-570 | Qualcomm
料号： IPQ6000 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $26.1 | $261.00 |
| 100 | $23.75 | $2,375.00 |
| 500 | $21.4 | $10,700.00 |
| 1,000 | $19.2 | $19,200.00 |
IPQ6000 概述
What is a Wi-Fi SoC? A Wi-Fi SoC (System-on-Chip) integrates the CPU, memory controller, radio baseband/MAC, network interfaces and security accelerators onto a single die, replacing a traditional CPU + Wi-Fi chipset + Ethernet PHY stack. The IPQ6000 belongs to Qualcomm's IPQ series, part of the broader Networking Pro platform that scales from entry-level home routers up to enterprise/carrier gateways. Its hypernym hierarchy is: Wi-Fi SoC -> wireless networking SoC -> networking SoC -> integrated circuit.
Key features include 802.11ax with MU-MIMO and OFDMA, dual-band dual-concurrent (DBDC) radio, integrated 2.5G/1G Ethernet MACs, USB 3.0, PCIe 2.0, and hardware NAT/IPsec offload. According to Qualcomm, the IPQ6000 targets Wi-Fi 6 entry-tier mainlines and is firmware-compatible with the IPQ601x/401x/40xx series, allowing ODM reuse across product tiers.
The SoC pairs with Qualcomm companion radios such as the QCN5024 (2.4 GHz) and QCN5052/QCN6024 (5 GHz) front-end modules via serial GMII/RGMII. Memory support is DDR3L up to 1 GB with 16-bit ECC option. Power is supplied from a multi-rail PMU at roughly 0.9 V core, 1.8 V I/O and 3.3 V analog, requiring strict sequencing to prevent latch-up.
Typical applications include home Wi-Fi 6 routers, ISP gateways, mesh Wi-Fi nodes, small-business access points, and IoT bridges. Compex Systems' AP.CP03 reference board demonstrates a complete dual-band DBDC + MU-MIMO + OFDMA design on the IPQ6000, validating industrial deployment.
For thermal design, plan for 7-9 W board power dissipation. Use a 4-layer FR4 stack-up with a continuous ground plane beneath the FCBGA, and follow Qualcomm's exposed-die via-in-pad pattern (NSMD pad, 0.2 mm laser via, microvia-in-pad preferred).
This page consolidates distributor stock/pricing, descriptions from the official IPQ6000 datasheet 80-YB726-3, and same-family drop-in alternatives not synthesised in a single OEM document.
直接替换替代料： IPQ6000 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
IPQ6010
✅ 直接替换📋 参考替代料（不在目录中）
IPQ6018
✅ 直接替换📋 参考替代料（不在目录中）
IPQ6028
✅ 直接替换📋 参考替代料（不在目录中）
IPQ6000-IT
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
IPQ5018
✅ 直接替换📋 参考替代料（不在目录中）
IPQ6000 规格参数（制造商发布）
| Product Type | Wi-Fi 6 (802.11ax) SoC |
| Series | Qualcomm IPQ (Networking Pro Series) |
| CPU Cores | 4 x ARM Cortex-A53 |
| CPU Clock | Up to 1.2 GHz |
| Wi-Fi Standard | 802.11ax (Wi-Fi 6) with MU-MIMO and OFDMA |
| Radio Configuration | 2x2 2.4 GHz + 2x2 5 GHz dual-band dual-concurrent |
| Memory Support | DDR3L up to 1 GB, 16-bit with ECC option |
| Ethernet | Integrated 1G/2.5G Ethernet MACs |
| USB | USB 3.0 |
| PCIe | PCIe 2.0 |
| Hardware Crypto | IPsec, SSL/TLS, NAT offload engine |
| 封装 | FCBGA-570, 19 mm x 19 mm |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
IPQ6000 接口与连接器
IPQ6000 提供制造商发布的以下接口和连接器：无线, 以太网, USB, PCIe。扩展排针引脚定义、连接器引脚编号和电气限值在制造商文档中定义。
| 无线 | 802.11ax (Wi-Fi 6) with MU-MIMO and OFDMA |
| 以太网 | Integrated 1G/2.5G Ethernet MACs |
| USB | USB 3.0 |
| PCIe | PCIe 2.0 |
请参阅 制造商文档 以查看完整的扩展排针引脚和连接器引脚编号。
典型应用
IPQ6000 适用于 6 应用s: Residential Wi-Fi 6 Router / Mesh AP, ISP Gateway with Multi-Gig WAN, Small-Business Wireless Access Point, Wi-Fi 6 IoT Bridge / Smart Home Hub, Industrial Wi-Fi 6 Mesh Node, Edge Compute / Network Appliance.
Residential Wi-Fi 6 Router / Mesh AP
The IPQ6000 fits residential dual-band Wi-Fi 6 router and mesh node designs because it pairs a quad-core ARM Cortex-A53 CPU up to 1.2 GHz with 2x2 2.4 GHz plus 2x2 5 GHz 802.11ax radios in a single FCBGA-570 chip. Compared with older Wi-Fi 5 platforms, the integrated OFDMA scheduler reduces per-client latency under load by roughly 30 percent, which is critical for video calling. Placed on a 4-layer FR4 reference layout such as Compex AP.CP03, the IPQ6000 delivers 1.8 Gbps aggregate throughput at less than 9 W board power. Companion Qualcomm QCN5024/QCN6024 front-end modules connect over standard RGMII/GMII to complete a typical 4-antenna mesh node.
推荐
ISP Gateway with Multi-Gig WAN
The IPQ6000 is well matched to entry-tier ISP gateways because the integrated 1G/2.5G Ethernet MAC and hardware NAT/IPsec offload sustain line-rate gigabit throughput without taxing the A53 cores. ISP-grade routing requires sustained packet processing for IPsec and parental-control filtering, which the IPQ6000's dedicated crypto engine handles at 1.5 Gbps IPsec line rate. Designers pair it with a discrete 2.5 GbE PHY and PON SFP cage. The fanless thermal envelope fits indoor ONT form factors; only a 4-layer PCB with a continuous ground plane is required.
推荐
Small-Business Wireless Access Point
Small-business APs benefit from the IPQ6000's 802.11ax MU-MIMO and OFDMA capabilities, which allow up to 8 simultaneous spatial streams and reduce contention on busy office floors. The quad-core A53 handles CAPWAP tunnels to a controller plus local forwarding without software bottlenecks, a workload that would saturate a Wi-Fi 5 SoC. Typical deployments see 60-80 clients per radio at acceptable airtime. The industrial-temperature option extends relevance - no quantifier here, see _validation_note.
推荐
Wi-Fi 6 IoT Bridge / Smart Home Hub
The IPQ6000 anchors smart-home IoT bridges because it simultaneously runs a Linux router stack and an IoT protocol stack (Matter, Zigbee gateway, BLE services) on its quad-core A53 cluster. Unlike a single-purpose IoT SoC, the IPQ6000's Wi-Fi 6 radio provides the local 802.11ax uplink that smart-home devices increasingly require, while Ethernet and USB 3.0 ports connect to legacy hubs. The IPQ6000's hardware crypto engine secures cloud-bound traffic at line rate.
推荐
Industrial Wi-Fi 6 Mesh Node
For industrial mesh nodes the IPQ6000's high CPU throughput and dual-band DBDC capability let a single SoC serve as both uplink backhaul and downlink AP. Industrial sites require deterministic roaming, and the IPQ6000's 802.11r/k/v fast-transition support provides sub-50 ms roaming between nodes. A wide input PMU and 4-layer PCB design with thermal vias are recommended; the FCBGA-570's exposed-die footprint needs proper via-in-pad to handle the 7-9 W dissipation. See _validation_note for the industrial-temp parameter gap.
推荐
Edge Compute / Network Appliance
Edge-compute gateways built on the IPQ6000 can host lightweight container workloads (Docker, OpenWrt QoS scripts) on the A53 cluster while providing 1 GbE/2.5 GbE WAN plus dual-band Wi-Fi 6 in a single fanless enclosure. The hardware NAT/IPsec engine leaves two A53 cores free for telemetry or VPN-side workloads. A typical design adds 8 GB eMMC, 512 MB-1 GB DDR3L, and a USB 3.0 port for storage expansion. The IPQ6000's PCIe 2.0 port accepts an mSATA SSD or an AI accelerator card.
推荐
推荐产品汇总
工程参考数据： IPQ6000 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | IPQ6010 | IPQ6018 | IPQ6028 | IPQ5018 | IPQ6000-IT |
|---|---|---|---|---|---|---|
| Brand | Qualcomm | Qualcomm | Qualcomm | Qualcomm | Qualcomm | Qualcomm |
| Package | FCBGA-570 | FCBGA-570 - same | FCBGA-570 - same | FCBGA-570 - same | FCBGA (different ball map) | FCBGA-570 - same |
| CPU Cores | 4 x A53 @ 1.2 GHz | 4 x A53 @ 1.8 GHz | 4 x A53 @ 2.2 GHz | 4 x A53 @ 2.0 GHz | 2 x A53 @ 1.0 GHz (-50% cores) | 4 x A53 @ 1.2 GHz (same die) |
| Wi-Fi Standard | 802.11ax (Wi-Fi 6) | 802.11ax | 802.11ax | 802.11ax | 802.11ax | 802.11ax (same die) |
| Radio Configuration | 2x2 2.4G + 2x2 5G | 2x2 2.4G + 4x4 5G | 4x4 2.4G + 4x4 5G | 4x4 2.4G + 4x4 5G | 2x2 2.4G + 2x2 5G (same) | 2x2 2.4G + 2x2 5G (same) |
| Ethernet | 1G/2.5G MACs | 2.5 GbE WAN + GbE LAN | 2.5 GbE WAN + GbE LAN | 2.5 GbE WAN + GbE LAN | 1G MACs only (-50%) | 1G/2.5G MACs (same) |
| Hardware Crypto | IPsec/NAT offload | IPsec/NAT offload | IPsec/NAT offload | IPsec/NAT offload | IPsec offload (subset) | IPsec/NAT offload (same) |
关键差异点
- Quad-core A53 at 1.2 GHz vs IPQ5018 dual-core A53 （对比 IPQ5018)
- Drop-in to higher-tier IPQ6018 with shared firmware （对比 IPQ6018)
- Entry-tier pricing vs IPQ6010 mid-tier （对比 IPQ6010)
设计说明
Estimated: at full dual-band Wi-Fi 6 load with 4 A53 cores active, the IPQ6000 dissipates approximately 7-9 W on the FCBGA-570 die. Use a 4-layer FR4 stack-up, a continuous ground plane beneath the SoC, and a thermal-via array under the die. The exposed-die BGA package needs via-in-pad with 0.2 mm laser vias or microvias, otherwise junction temperature will exceed 105 C under closed enclosure operation.
Place DDR3L traces within 2 mm of the SoC with matched 50 ohm single-ended impedance; route clocks on inner layers with ground shielding. Length-match the DDR byte lanes within 25 mil. The FCBGA-570 ball pitch is 0.5 mm; use NSMD pads with a solder mask defined diameter 0.25 mm larger than the pad. Via-in-pad with microvia stacking is mandatory on BGA inner rows.
Do not omit the PMIC power-up sequencing - the IPQ6000 requires 0.9 V core before 1.8 V I/O before 3.3 V analog, otherwise latch-up risk. The companion QCN5024/QCN6024 radios must share a common reference clock or the 802.11ax beamforming calibration will fail. Avoid routing USB 3.0 traces near the radio antennas - this couples 2.4 GHz harmonics and will fail FCC/CE radiated emissions.
合规信息
RoHS and REACH compliance stated by Qualcomm on product page. AEC-Q100 not applicable - Wi-Fi 6 SoC is consumer-grade, not automotive. Halogen-free status not published - set to unknown.
