LAN9352TI/ML - 2-Port 10/100 Ethernet Switch | Microchip
料号： LAN9352TI/ML ✓ 量产中LAN9352TI/ML 概述
An Ethernet switch is a network-semiconductor device that receives frames on one port, examines the destination address, and forwards traffic to the appropriate port when required. The LAN9352 integrates two Fast Ethernet ports, switching functions, physical-layer interfaces, and host-control connectivity into one package. Its managed architecture allows an embedded processor or another controller to configure switch behavior rather than relying on a fixed, unmanaged network topology.
The device uses I2C and SPI interfaces for host communication, enabling configuration and control from embedded processors, industrial controllers, or network equipment. According to the Microchip product page, the LAN9352 family targets consumer, embedded, and industrial designs requiring a cost-effective, highly integrated Ethernet solution. The compact 72-QFN package also reduces board area compared with a multi-chip implementation containing separate Ethernet PHYs and a switch controller.
The LAN9352TI/ML package variant is supplied in tape-and-reel form for automated assembly. Distributor technical listings identify a 1.8 V to 3.3 V supply range and an operating-temperature range from -40 °C to +85 °C. Its 72-VFQFN exposed-pad construction provides an exposed thermal and electrical connection to the PCB, allowing controlled heat transfer into the board copper when the layout follows the manufacturer's recommended land pattern and thermal guidelines.
Typical applications include industrial Ethernet equipment, embedded control panels, connected instruments, industrial automation gateways, set-top equipment, and embedded systems that require two Fast Ethernet ports. The integrated switch is particularly useful where two network devices must share a common uplink without adding a full-size external switch module. Host-side management can support diagnostic monitoring, controlled startup, port configuration, and network status reporting.
Layout is critical because Ethernet interfaces combine sensitive analog signaling with high-speed digital control. Follow the manufacturer's pin-assignment table and reference layout, provide the specified decoupling capacitors, route each differential pair as a controlled-impedance pair, and preserve the required separation from noisy power and switching circuitry. Treat the exposed pad as a thermal and electrical feature rather than an optional copper pour.
This page consolidates the confirmed manufacturer and distributor information into a focused engineering resource. It compares package and interface requirements, explains the practical role of the integrated switch, and provides application-oriented design guidance that goes beyond a basic distributor listing. For complete pin assignments, register definitions, timing limits, and electrical characteristics, use the manufacturer documentation linked on this page.
直接替换替代料： LAN9352TI/ML ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： LAN9352TI/ML （相同外形与封装尺寸） ——差异在于 Package, Operating Temperature, Product Type.
该产品暂无直接替换替代料。
请求替代料LAN9352TI/ML 最大额定值与电气特性
| Product Type | Managed Ethernet switch IC |
| Number of Ethernet Ports | 2 ports |
| Ethernet Data Rate | 10/100 Mbps |
| Physical Layer Standard | 10/100 Base-T |
| Host Interface 1 | I2C |
| Host Interface 2 | SPI |
| 封装 | 72-QFN (10 mm x 10 mm) |
| Package Construction | 72-VFQFN with exposed pad |
| 电源电压 | 1.8 V to 3.3 V |
| 工作温度 | -40 °C to +85 °C |
| 安装类型 | Surface mount |
| Shipping Package | Tape and reel |
LAN9352TI/ML tape and reel 引脚配置指南
LAN9352TI/ML（tape and reel 封装）的引脚配置。 引脚编号、功能和连接图在制造商数据手册中定义。请参阅该手册以了解确切的封装尺寸和焊接指南。
暂无详细引脚数据： LAN9352TI/ML.
请参阅 数据手册 以查看完整引脚配置。
典型应用
LAN9352TI/ML 适用于 6 应用s: Industrial Ethernet Control Equipment, Embedded Network Gateway, Connected Measurement Instrument, Industrial Automation Gateway, Networked Embedded Appliance, Consumer Network Endpoint.
Industrial Ethernet Control Equipment
The LAN9352TI/ML fits compact industrial controllers that need two managed 10/100 Mbps ports and a low-voltage host interface. It can connect local sensors, programmable controllers, or service equipment to an existing network while allowing an embedded MCU to configure and monitor the switch. Its -40 °C to +85 °C rating supports extended industrial ambient conditions, while the 10 mm by 10 mm 72-QFN package reduces board area. Confirm isolation, surge requirements, magnetics selection, and Ethernet compliance for the final installation.
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Embedded Network Gateway
The LAN9352TI/ML is useful in an embedded gateway that must consolidate two Fast Ethernet links before forwarding traffic through a host processor. I2C and SPI connectivity allows firmware to read status, configure ports, and integrate controlled startup behavior. Its two 10/100 Mbps ports suit equipment bridges and local network concentrators. The compact 72-QFN outline simplifies high-density PCB layouts, but differential-pair routing, magnetics integration, reference planes, and exposed-pad thermal management must follow the manufacturer layout guidance.
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Connected Measurement Instrument
The LAN9352TI/ML can provide two managed 10/100 Mbps ports in a connected test or measurement instrument that communicates with a host controller. One port may serve an upstream network connection while the other connects local equipment, reducing external switching hardware. The managed interface provides a foundation for port control and diagnostics, and the 1.8 V to 3.3 V supply range integrates with common embedded logic. Validate EMC immunity, isolation strategy, thermal performance, and connector magnetics for the target measurement environment.
推荐
Industrial Automation Gateway
The LAN9352TI/ML supports industrial automation gateways that aggregate two local Ethernet segments before communicating with a higher-level controller. Its managed two-port topology is appropriate for equipment-to-network bridging, while I2C or SPI host access enables configuration and diagnostics. The compact 72-VFQFN package is useful in space-constrained control cabinets, and the -40 °C to +85 °C range aligns with many industrial environments. Production designs must also address galvanic isolation, surge protection, grounding, and long-cable interface requirements.
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Networked Embedded Appliance
The LAN9352TI/ML adds dual managed Fast Ethernet connectivity to embedded appliances that need both service-port and uplink access. A host processor can use SPI or I2C to supervise network activity, coordinate port startup, and support diagnostics without a separate switch controller. The 10 mm by 10 mm package limits board footprint, while the 1.8 V to 3.3 V operating range is compatible with common embedded rails. Keep the Ethernet magnetics and high-frequency traces separated from sensitive analog and power-conversion sections, and follow the recommended reference layout.
推荐
Consumer Network Endpoint
The LAN9352TI/ML can serve as the central Ethernet component in a compact consumer endpoint requiring two managed 10/100 Mbps connections. It is suitable for set-top-class equipment and connected products where board area and integration are important. The tape-and-reel shipping format supports automated production assembly, while SPI and I2C provide flexible host-control options. For a consumer product, confirm the required Ethernet compliance level, update mechanism, security expectations, connector implementation, and lifecycle objectives before final design release.
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推荐产品汇总
工程参考数据： LAN9352TI/ML ——对比、设计指导和合规信息。
选型指南
Do not select it merely for its two-port count. The design must also satisfy the required Ethernet media, magnetics arrangement, isolation, surge protection, management-register expectations, and PCB footprint. If a product requires more than two ports, a different data rate, automotive qualification, or another host interface, compare the LAN9352 family and alternative Ethernet devices against the complete electrical and mechanical requirements. For any proposed substitution, verify pin assignments, supply sequencing, exposed-pad treatment, and firmware compatibility before approving a drop-in claim.
设计说明
Use the manufacturer's 72-VFQFN land pattern and reference layout without altering pad dimensions or exposed-pad geometry. Place input and output decoupling capacitors close to their associated pins, provide a low-impedance ground path beneath the device, and route Ethernet differential pairs over a continuous reference plane. Verify the assembly mask definition and exposed-pad connection with the package drawing before fabrication release.
Keep the two Ethernet channels physically separated where practical and maintain the pair geometry recommended for each channel. Avoid routing Ethernet signals across plane splits, noisy regulator outputs, switching-converter nodes, or digital clock regions. The magnetics, protection components, and differential traces should follow the manufacturer's recommended ordering because small placement changes can degrade signal integrity or upset regulatory testing.
Connect the exposed pad to the recommended PCB copper and thermal-via arrangement to provide a controlled thermal path. Estimate worst-case dissipated power from the selected supply voltage, loaded port activity, and measured operating current, then compare the resulting junction-temperature margin with the device limits. Increase exposed-pad copper or use thermal vias where the enclosure prevents heat from leaving the board.
Do not treat the Ethernet magnetics, termination, surge protection, and isolation components as optional accessories; their values and placement are part of the complete interface design. Also avoid assuming that a switch with the same port count is electrically interchangeable. Check the pin table, management registers, startup sequence, and host firmware against the manufacturer documentation before introducing any alternate ordering code.
合规信息
Compliance declarations are not stated in the available product and distributor excerpts. Confirm RoHS, REACH, lead-free, halogen-free, conflict-minerals, and automotive qualification status from the manufacturer documentation before release.
