LCMXO2-256HC-4SG32C - 256 LUT MachXO2 FPGA, 22 I/O, 32-QFN | Lattice
料号： LCMXO2-256HC-4SG32C ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $6.1 | $6.10 |
| 10 | $5.5 | $55.00 |
| 100 | $4.84 | $484.00 |
| 500 | $4.18 | $2,090.00 |
| 1,000 | $3.62 | $3,620.00 |
LCMXO2-256HC-4SG32C 概述
An FPGA (Field-Programmable Gate Array) is a reconfigurable logic device that engineers program after PCB assembly to implement custom digital functions. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) alongside CPLDs. The MachXO2 family targets control plane tasks such as bus bridging, GPIO expansion, power sequencing, and instant-on logic - functions where traditional CPLDs or small FPGAs are otherwise deployed.
Key features of the LCMXO2-256HC-4SG32C include a built-in programmable Flash memory eliminating the need for an external configuration PROM, a dedicated FIFO control logic block supporting widths from 4 to 36 bits and depths from 16 to 4096, programmable low-swing differential I/O for LVDS-style signaling, and a -4 speed grade that delivers 7.24 ns propagation delay. Multiple power-saving modes (Standby, Sleep, and I/O-disable) lower quiescent consumption for battery-fed designs.
Architecturally the device combines LUT4-based logic slices with on-chip flash, an embedded block RAM, PLL-style clock conditioning, and hardened I/O buffers. The 65 nm process and the integrated Flash allow instant-on start-up within microseconds, making the device useful as a system supervisor that boots before the main processor. The exposed-pad QFN package also provides a low-thermal-resistance path for mildly elevated dissipation during high toggle activity.
Typical applications include I/O expansion and level shifting in routers and embedded boards, control logic for displays and backlight drivers, power-up sequencing and housekeeping in server / storage platforms, sensor aggregation in industrial IoT nodes, and low-power handheld devices that benefit from the 19 µW standby figure.
When designing with this part, plan decoupling carefully: place 0.1 µF and 1 µF MLCCs adjacent to each VCC/VCCAUX pin pair and stitch the exposed pad to a continuous ground plane to manage thermal performance. Verify your IO bank voltage configuration before generating the bitstream; mismatched VCCI banks and LVCMOS standards are the most frequent build failures.
直接替换替代料： LCMXO2-256HC-4SG32C ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
LCMXO2-256HC-4SG32I
✅ 直接替换📋 参考替代料（不在目录中）
LCMXO2-256HC-4SG32CES
✅ 直接替换📋 参考替代料（不在目录中）
LCMXO2-256HE-4SG32C
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LCMXO2-256ZE-4SG32C
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LCMXO2-256HC-4MG32C
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
ICE40LP384-SG32
✅ 直接替换📋 参考替代料（不在目录中）
LCMXO2-256HC-4SG32C 最大额定值与电气特性
| Family | MachXO2 |
| Number of Logic Elements / Cells | 256 |
| Number of LUTs | 256 |
| Number of I/O | 21 to 22 |
| 电源电压 | 2.375 V to 3.465 V |
| 工作温度 | 0 °C to 85 °C |
| 安装类型 | Surface Mount |
| 封装 / 外壳 | 32-UFQFN Exposed Pad (32-QFN EP) |
| Supplier Device Package | 32-QFN |
| Propagation Delay (speed grade -4) | 7.24 ns |
| Process Technology | 65 nm low power |
| Standby Power | as low as 19 µW to 22 µW |
| Distributed RAM | up to 54 Kbits |
| User Flash Memory | up to 256 Kbits (on-chip) |
| Dedicated FIFO Logic | Yes (FIFO control block included) |
| I/O Standards | LVCMOS, LVTTL, LVDS, programmable low-swing differential |
| RoHS / Halogen-Free Status | RoHS compliant, Halogen free (per package variant) |
LCMXO2-256HC-4SG32C 引脚配置
| 引脚 1 | GND — Ground |
| 引脚 2 | IOB_0 — I/O Bank 0 - general purpose user I/O |
| 引脚 3 | IOB_1 — I/O Bank 0 - general purpose user I/O |
| 引脚 4 | IOB_2 — I/O Bank 0 - general purpose user I/O |
| 引脚 5 | IOB_3 — I/O Bank 0 - general purpose user I/O |
| 引脚 6 | IOB_4 — I/O Bank 0 - general purpose user I/O |
| 引脚 7 | IOB_5 — I/O Bank 0 - general purpose user I/O |
| 引脚 8 | VCCI_B0 — I/O Bank 0 supply voltage (LVCMOS reference) |
| 引脚 9 | IOB_6 — I/O Bank 0 - general purpose user I/O |
| 引脚 10 | IOB_7 — I/O Bank 0 - general purpose user I/O |
| 引脚 11 | GND — Ground |
| 引脚 12 | TDI — JTAG Test Data In |
| 引脚 13 | TMS — JTAG Test Mode Select |
| 引脚 14 | TCK — JTAG Test Clock |
| 引脚 15 | TDO — JTAG Test Data Out |
| 引脚 16 | VCC — Core supply voltage |
| 引脚 17 | VCCAUX — Auxiliary supply voltage (Flash and PLL) |
| 引脚 18 | GNDA — Analog ground |
| 引脚 19 | VCCI_B2 — I/O Bank 2 supply voltage (LVCMOS reference) |
| 引脚 20 | IOB2_0 — I/O Bank 2 - general purpose user I/O |
| 引脚 21 | IOB2_1 — I/O Bank 2 - general purpose user I/O |
| 引脚 22 | IOB2_2 — I/O Bank 2 - general purpose user I/O |
| 引脚 23 | GND — Ground |
| 引脚 24 | VCCI_B1 — I/O Bank 1 supply voltage (LVCMOS reference) |
| 引脚 25 | IOB1_0 — I/O Bank 1 - general purpose user I/O |
| 引脚 26 | IOB1_1 — I/O Bank 1 - general purpose user I/O |
| 引脚 27 | IOB1_2 — I/O Bank 1 - general purpose user I/O |
| 引脚 28 | IOB1_3 — I/O Bank 1 - general purpose user I/O |
| 引脚 29 | GND — Ground |
| 引脚 30 | DONE — Configuration done indicator |
| 引脚 31 | PROGRAMN — Active-low program/reconfigure |
| 引脚 32 | INITN — Active-low initialization indicator |
典型应用
LCMXO2-256HC-4SG32C 适用于 6 应用s: I/O Expansion and Bus Bridging, Power-Up Sequencing and Reset Management, Low-Power IoT Sensor Aggregation, Display and Backlight Control Logic, Industrial Control Plane Glue Logic, Consumer Audio/Video Signal Switching.
I/O Expansion and Bus Bridging
The LCMXO2-256HC-4SG32C is well suited as an I/O expander that bridges between a host MCU/processor and slow peripherals. Its 21-22 user I/O with multi-standard support (LVCMOS 1.2/1.5/1.8/2.5/3.3, LVTTL) lets designers mix 1.8 V sensors and 3.3 V MCUs on the same board without external level shifters. With 256 LUTs and a 7.24 ns propagation delay, the part can handle 25-50 MHz glue logic easily. The on-chip 256 Kbit user Flash eliminates the configuration PROM, simplifying PCB design and BOM in bridging fan-out and protocol muxing tasks.
推荐
Power-Up Sequencing and Reset Management
The 65 nm low-power MachXO2 architecture with built-in user Flash allows the LCMXO2-256HC-4SG32C to be a system supervisor that powers up before main processors and asserts sequential reset/PGOOD rails. Standby current as low as 19-22 µW keeps housekeeping power minimal in always-on systems. The device can implement delay timers, watchdog logic, and 4-36 bit wide FIFO control using its dedicated FIFO block. The exposed-pad QFN package handles brief inrush events with adequate thermal dissipation.
推荐
Low-Power IoT Sensor Aggregation
Battery-fed IoT nodes benefit from the LCMXO2-256HC-4SG32C's Sleep and Standby power modes - measured standby in the 19 µW range - while still waking quickly to aggregate SPI/I2C/UART sensor data. With 256 LUTs the device can implement hardware FIFOs and basic processing of a sensor stream before handing off to a low-power radio. The 32-QFN surface-mount package fits consumer devices under 1 cm², and the embedded user Flash eliminates the need for a separate boot ROM footprint.
推荐
Display and Backlight Control Logic
The LCMXO2-256HC-4SG32C functions as a display bridge controller - generating LVDS-style differential signaling for panels and creating programmable timing for backlight PWM. Its programmable low-swing differential I/O supports the LVDS-style signaling commonly required for TFT panels. The dedicated FIFO block supports widths of 4-36 bits and depths up to 4096, ideal for buffering pixel data between a low-cost MCU and the panel. Operating from 2.5 V or 3.3 V rails matches typical display-power supply voltages without level shifting.
推荐
Industrial Control Plane Glue Logic
Factory automation, PLC I/O modules, and process control systems use the LCMXO2-256HC-4SG32C as deterministic glue logic. With propagation delay of 7.24 ns at the -4 speed grade and full deterministic timing, the device integrates encoder counters, isolated-input debouncing, and relay-driver sequencing. The same 32-QFN footprint accommodates the industrial temperature grade LCMXO2-256HC-4SG32I variant, allowing one PCB design to serve both commercial 0-85 °C and industrial -40 to 100 °C product lines. The process node and exposed pad support 24/7 industrial operation.
推荐
Consumer Audio/Video Signal Switching
Set-top boxes, A/V receivers, and home-theater control boards use the LCMXO2-256HC-4SG32C as a fast digital crosspoint switch and HDMI-side aux controller. The 256 LUTs and the 7.24 ns propagation delay comfortably switch 1080p clock frequencies, while the LVDS-style I/O support differential signaling on HDMI TMDS lines. The exposed-pad QFN package supports hand-held IR remote receivers with low radiated emissions. Standby power as low as 19-22 µW keeps utility wattage down when the consumer product is idle.
推荐
推荐产品汇总
工程参考数据： LCMXO2-256HC-4SG32C ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | LCMXO2-256HC-4SG32I | LCMXO2-256HC-4SG32CES | LCMXO2-256HE-4SG32C | LCMXO2-256ZE-4SG32C | ICE40LP384-SG32 |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 32-UFQFN Exposed Pad (32-QFN EP) | 32-UFQFN Exposed Pad - same | 32-UFQFN Exposed Pad - same | 32-UFQFN Exposed Pad - same | 32-UFQFN Exposed Pad - same | 32-UFQFN (QFN, no exposed pad) |
| Number of LUTs | 256 | 256 | 256 | 256 | 256 | 384 |
| Number of User I/O | 21 | 21 | 21 | 21 | 21 | 23 |
| Supply Voltage | 2.375 V to 3.465 V | 2.375 V to 3.465 V | 2.375 V to 3.465 V | 2.375 V to 3.465 V | 2.375 V to 3.465 V | 1.14 V to 1.26 V core (LVCMOS 1.8/2.5/3.3 I/O) |
| Configuration Memory | Internal Flash (non-volatile) | Internal Flash (non-volatile) | Internal Flash (non-volatile) | Internal Flash (non-volatile) | Internal Flash (non-volatile) | External SRAM-based (volatile, needs boot Flash) |
关键差异点
- Non-volatile on-chip Flash eliminates configuration PROM （对比 ICE40LP384-SG32)
- As low as 19 µW standby power in Sleep mode （对比 LCMXO2-256HC-4SG32I)
- 128-bit AES bitstream encryption standard （对比 Generic 32-pin CPLDs)
设计说明
Provide one 0.1 µF decoupling capacitor adjacent to each VCC and VCCAUX pin, plus a bulk 1 µF MLCC near the VCC cluster. The exposed pad is the primary thermal and ground return, so stitch multiple ground vias around its perimeter. Estimated: with 0.3 W internal dissipation on a 1 oz 4-layer board, theta_JA is around 35 °C/W yielding a 10-12 °C junction rise at room temperature.
Route JTAG signals (TDI, TDO, TMS, TCK) with 50 Ω controlled impedance and a 33 Ω series resistor at the FPGA pin; keep TCK trace length under 6 inches to avoid reflections. Place a 0.1 µF MLCC adjacent to VCCI of each I/O bank so PLL/IO buffers see a stable reference. Exposed pad must be soldered to a continuous ground pour to satisfy thermal AND electrical grounding.
Avoid these typical MachXO2 build failures: (1) leaving the exposed pad floating - causes erratic operation and thermal shutdown during activity; (2) configuring bank VCCI for one LVCMOS standard but driving it with another - generates latch-up warnings; (3) omitting the PROGRAMN pull-up resistor - blocks reconfiguration; (4) using wrong Lattice Diamond/Radiant project settings - causes DRC errors. Validate the bitstream in Lattice Diamond before rework.
合规信息
RoHS compliant per Lattice product page. Halogen-free package per MachXO2 family datasheet. AEC-Q100 not applicable (FPGAs in this density are typically industrial-grade rather than AEC-qualified). Choose the I-grade part for industrial temperature; AEC-Q100-specific variants are not offered for the 256-LUT package in this footprint.
