LCMXO3LF-1300E-5UWG36ITR1K - 1280 LUT MachXO3LF FPGA, 36-WLCSP | Lattice
料号： LCMXO3LF-1300E-5UWG36ITR1K ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $8.55 | $8.55 |
| 10 | $7.95 | $79.50 |
| 100 | $6.95 | $695.00 |
| 500 | $6.1 | $3,050.00 |
| 1,000 | $5.55 | $5,550.00 |
LCMXO3LF-1300E-5UWG36ITR1K 概述
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, interconnect, and I/O cells that can be customized after manufacturing to implement arbitrary digital functions, glue logic, or compute pipelines. FPGAs sit above ASICs and microcontrollers in flexibility and below general-purpose CPUs in per-unit cost. The MachXO3 family is Lattice's ultra-low-power platform targeting IO expansion, bridge, and control plane functions in consumer, communications, and industrial designs, while the MachXO3LF adds hardened Embedded Block RAM (EBR) and on-chip flash for instant-on, single-chip operation.
Key features of the LCMXO3LF-1300E-5UWG36ITR1K include 1280 4-input LUTs, 65 kb of distributed EBR, built-in user flash and configuration flash (instant-on at <1 ms typical), hardened I/O including hot-socket, pull-up/pull-down, Schmitt trigger, and LVCMOS 1.2/1.5/1.8/2.5/3.3 V support. The WLCSP package eliminates the lead frame and bond wires, minimizing inductance and package height for wearable, smartphone, and small-form-factor designs.
The architecture combines LUT-based logic fabric with embedded EBR blocks, dedicated PLL, and hard I/O buffers. Configuration is stored in on-chip flash and can be reloaded via JTAG or SPI in seconds, enabling field upgrades and design iteration without re-bricking devices. The "5" speed grade and "E" enhanced-process indicator place this part in the mainstream performance bin for the family.
Typical applications include I2C/SPI GPIO expansion for microcontrollers in IoT edge nodes, low-power sensor aggregation in wearables, LED control and backplane management in display modules, and glue-logic bridging in industrial HMI panels. The combination of single-chip instant-on and ultra-low static current also suits battery-backed always-on subsystems.
When designing with this part, plan WLCSP ballout carefully: trace escape must route from the underside BGA pad array using microvia or fan-out PCB technology, and the small package footprint (2.54 x 2.59 mm) requires precise solder paste stencil aperture control. Power sequencing of the 1.2 V core rail must respect the MachXO3 inrush profile or use the internal power-on-reset circuit.
This page synthesizes distributor pricing for the LCMXO3LF-1300E-5UWG36ITR1K, drop-in alternative MPNs that share the 36-WLCSP footprint, application circuits, and practical PCB layout notes that complement the Lattice MachXO3 family datasheet.
直接替换替代料： LCMXO3LF-1300E-5UWG36ITR1K ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： LCMXO3LF-1300E-5UWG36ITR1K （相同外形与封装尺寸） ——差异在于 Operating Temperature, Mounting Type, Speed Grade, Configuration Memory, Core Supply Voltage.
快速对比工具——选择替代料号进行并排对比：
LCMXO3LF-2100E-5UWG36ITR1K
✅ 直接替换📋 参考替代料（不在目录中）
LCMXO3LF-640E-5UWG36ITR1K
✅ 直接替换📋 参考替代料（不在目录中）
LCMXO3L-1300E-5UWG36ITR1K
✅ 直接替换📋 参考替代料（不在目录中）
LCMXO3LF-1300E-5UWG36ITR
✅ 直接替换✓ 有现货
$4.4 / 个
查看数据手册 →LCMXO3LF-1300E-5UWG36ITR1K 最大额定值与电气特性
| Family | MachXO3LF |
| Number of Logic Elements / Cells | 1280 |
| Number of LABs / CLBs | 160 |
| Total RAM Bits | 65536 |
| Number of I/O | 28 |
| Core Supply Voltage | 1.14 V to 1.26 V |
| 工作温度 | -40 °C to +100 °C (TJ) |
| 安装类型 | Surface Mount |
| 封装 / 外壳 | 36-UFBGA, WLCSP |
| Supplier Device Package | 36-WLCSP (2.54 x 2.59 mm) |
| Packaging | Tape & Reel (TR) |
| Speed Grade | 5 |
| Process Variant | E (enhanced) |
| Configuration Memory | On-chip flash (instant-on) |
| RoHS 状态 | Compliant |
LCMXO3LF-1300E-5UWG36ITR1K 36-wlcsp (2.54 x 2.59 mm) 引脚配置指南
LCMXO3LF-1300E-5UWG36ITR1K（36-wlcsp (2.54 x 2.59 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： LCMXO3LF-1300E-5UWG36ITR1K.
请参阅 数据手册 以查看完整引脚配置。
典型应用
LCMXO3LF-1300E-5UWG36ITR1K 适用于 6 应用s: I2C/SPI GPIO Expansion for Microcontrollers, Wearable Sensor Aggregation, LED Backplane Driver in Display Modules, Industrial HMI Bridge Logic, Battery-Backed Always-On Subsystem, IoT Edge Node Glue Logic.
I2C/SPI GPIO Expansion for Microcontrollers
The LCMXO3LF-1300E-5UWG36ITR1K is widely deployed as a low-power GPIO expander that lets a small MCU add dozens of LVCMOS 1.2 V to 3.3 V compliant pins without an external bus mux. With 1280 LUTs and 28 user I/O, it can host multiple soft I2C/SPI controllers, interrupt controllers, and PWM generators in parallel, offloading the main MCU. The on-chip flash enables instant-on so that peripherals are immediately addressable on power-up, critical for industrial HMI panels where the host MCU may need milliseconds to boot. Placement between the MCU and the peripheral cluster with 100 kHz to 1 MHz I2C clock is straightforward; the design trade-off is per-pin latency versus bus utilization.
推荐
Wearable Sensor Aggregation
In wearables, the LCMXO3LF-1300E-5UWG36ITR1K serves as a sensor hub that aggregates I2C/SPI data from accelerometers, optical heart-rate sensors, and battery monitors before forwarding them to the application processor. The 2.54 x 2.59 mm WLCSP keeps total board area below 7 mm², leaving room for a coin-cell battery and antenna. The 1.14 V to 1.26 V core supply matches the typical wearable power tree, and the LF sub-family's instant-on flash removes the need for an external boot PROM, simplifying the BOM. Performance is more than adequate for sample aggregation up to a few hundred Hz, and the trade-off versus a dedicated sensor hub ASIC is flexibility (the LUTs can host custom DSP) versus per-unit cost.
推荐
LED Backplane Driver in Display Modules
Display modules use the LCMXO3LF-1300E-5UWG36ITR1K to drive LED backplane strings via PWM and serial-shift register emulation. The 28 user I/O can host enough PWM channels to multiplex tens of LEDs, while the 1280 LUTs handle brightness-zone state machines and fault detection. Because the device supports LVCMOS 1.2/1.5/1.8/2.5/3.3 V on the same I/O bank, it interfaces directly to common LED driver ICs without level shifters. The on-chip flash enables instantaneous dimming response when the panel wakes from standby, a typical requirement in TVs and monitors. The trade-off versus a dedicated LED driver is added design complexity in exchange for tunable dimming curves.
推荐
Industrial HMI Bridge Logic
In industrial human-machine interface (HMI) panels, the LCMXO3LF-1300E-5UWG36ITR1K bridges between a touch controller, a TFT display, and a host processor, handling protocol conversion (SPI to RGB, I2C to GPIO), debouncing, and timing control. The 1280 LUTs and 65 kb EBR are sufficient to implement color-space conversion or touch event queuing, offloading the main processor. Industrial temperature grade -40 °C to +100 °C is met, satisfying factory-floor requirements. The WLCSP package suits compact panel enclosures, and the on-chip flash allows panel firmware to be updated via SPI without dismantling the HMI. The main design trade-off is fitting the design within 1280 LUTs, which constrains the bridge complexity.
推荐
Battery-Backed Always-On Subsystem
Battery-backed always-on subsystems rely on the LCMXO3LF-1300E-5UWG36ITR1K for housekeeping functions such as power-good sequencing, RTC timestamping, watchdog supervision, and low-speed housekeeping I/O while the main SoC is asleep. The 1.14 V to 1.26 V core supply draws microamp-level quiescent current during static conditions, extending battery life. The LF sub-family's on-chip flash allows the housekeeping logic to wake instantly from the internal flash rather than waiting for external boot, eliminating seconds of dead time. The design trade-off is limited LUT capacity for complex housekeeping state machines versus the lower cost of using the main SoC for these tasks.
推荐
IoT Edge Node Glue Logic
In IoT edge nodes, the LCMXO3LF-1300E-5UWG36ITR1K connects low-speed peripherals (sensors, keypads, displays, secure elements) to an application processor via SPI, I2C, or UART, performing protocol translation and interrupt aggregation. The 28 user I/O easily handles multi-sensor fan-out, and the 65 kb EBR buffers small bursts of sensor data. The industrial temperature grade supports outdoor enclosures, and the WLCSP package suits compact sensor hubs. The on-chip flash provides field-upgradable firmware without external boot memory, a key requirement for remote edge nodes. Trade-offs include managing the WLCSP PCB fan-out and ensuring that the 1280-LUT budget is sufficient for the chosen glue logic.
推荐
推荐产品汇总
工程参考数据： LCMXO3LF-1300E-5UWG36ITR1K ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | LCMXO3LF-2100E-5UWG36ITR1K | LCMXO3LF-640E-5UWG36ITR1K | LCMXO3L-1300E-5UWG36ITR1K | LCMXO3LF-1300E-5UWG36ITR |
|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 36-WLCSP (2.54 x 2.59 mm) | 36-WLCSP (2.54 x 2.59 mm) - same | 36-WLCSP (2.54 x 2.59 mm) - same | 36-WLCSP (2.54 x 2.59 mm) - same | 36-WLCSP (2.54 x 2.59 mm) - same |
| Logic Elements (LUTs) | 1280 | 2100 | 640 | 1280 | 1280 |
| Number of LABs/CLBs | 160 | 263 | 80 | 160 | 160 |
| Total RAM Bits | 65536 | 73728 | 32768 | 65536 | 65536 |
| User I/O | 28 | 28 | 28 | 28 | 28 |
| Core Voltage | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V |
| On-Chip Configuration Flash | Yes (LF sub-family) | Yes | Yes | No (L sub-family, external boot) | Yes |
| Operating Temperature | -40 °C to +100 °C (TJ) | -40 °C to +100 °C (TJ) | -40 °C to +100 °C (TJ) | -40 °C to +100 °C (TJ) | -40 °C to +100 °C (TJ) |
关键差异点
- On-chip configuration flash for instant-on （对比 LCMXO3L-1300E-5UWG36ITR1K)
- Mid-density sweet spot （对比 LCMXO3LF-640E-5UWG36ITR1K)
- Lower LUT density than the 2100 variant （对比 LCMXO3LF-2100E-5UWG36ITR1K)
设计说明
WLCSP packages route signals through an underside BGA-style ball array; design escape requires microvia (laser-drilled, 0.1 mm typical) and 0.4 mm pitch trace-and-space rules on at least the top layer. Plan a 4-layer stack-up with the inner layer 2 used as ground and layer 3 as VCC (1.2 V core) to minimize loop inductance. Use a Ni/Au (ENIG) finish on the WLCSP pads and a laser-cut SMT stencil with 0.08 mm aperture reduction to control solder paste volume, preventing solder balls under the part.
Decouple the 1.14 V to 1.26 V core rail with at least one 1 µF X7R 0402 ceramic placed within 1 mm of the supply ball, plus a parallel 0.1 µF X7R for high-frequency noise. Add a bulk 10 µF ceramic near the part if the host power tree is high-impedance. Power-on-reset (POR) timing follows the MachXO3 family datasheet; if the supply rise time exceeds 1 ms, hold CONFIG low until VCC stabilizes to avoid spurious configuration loads.
Do not confuse the MachXO3L and MachXO3LF sub-families during PCB assembly: both share the 36-WLCSP ball-map, but the L variant lacks on-chip configuration flash and requires an external SPI boot PROM or MCU boot stream. Substituting LF for L is safe (extra flash is fine), but substituting L for LF will leave the design unable to boot. Also confirm that the chosen speed grade ("5" in this part number) matches the timing-closure requirement; the "5" grade is the mainstream bin for 1.2 V operation.
合规信息
RoHS and lead-free status confirmed per Lattice product page and DigiKey listing. REACH, halogen-free, and conflict-minerals disclosures were not in the provided data and are flagged as unknown.
