LPC1102UK - 50MHz Cortex-M0 MCU with 32KB Flash | NXP
料号： LPC1102UK ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1.8188 | $1.82 |
| 10 | $1.8188 | $18.19 |
| 100 | $1.8188 | $181.88 |
| 500 | $1.8188 | $909.40 |
| 1,000 | $1.8188 | $1,818.80 |
LPC1102UK 概述
A microcontroller is a programmable system-on-chip that integrates a processor core, nonvolatile program memory, volatile data memory, digital peripherals, and interface controllers on one die. The LPC1102UK belongs to the LPC11xx family of Arm Cortex-M0 devices. Its compact instruction set and integrated memory support embedded control, while its 32-bit architecture provides a practical migration path from legacy 8-bit and 16-bit designs.
The verified product information identifies the Arm Cortex-M0 processor, 50 MHz maximum operating frequency, 32 KB flash, 8 KB SRAM, and 16-WLCSP package. The NXP product page also describes the LPC11xx family as a low-power, low-cost family designed for 8-bit and 16-bit microcontroller replacements, with reduced code size and a scalable entry-level feature set.
Compared with larger general-purpose Cortex-M devices, the LPC1102UK emphasizes simplicity, compactness, and low cost. Its 2.17 mm by 2.32 mm uncased chip package minimizes PCB area but requires assembly processes capable of handling very small pitch balls and fine board-routing features. The package page identifies this option as 16-pin WLCSP, making land-pattern and assembly verification essential before release to production.
Typical uses include small sensor controllers, compact industrial modules, building-control endpoints, appliance control boards, and connected low-power products. Engineers should account for restricted memory, small-package assembly, exposed-pad or thermal considerations, and firmware complexity when selecting this device.
The key design priority is to validate code size, peripheral requirements, clocking, power behavior, and PCB assembly before committing the very small footprint. Use NXP's product page and LPC1102UK datasheet as the controlling references for electrical limits, pin functions, package dimensions, and programming support.
This page consolidates verified source data, technical context, procurement facts, and engineering cautions that are not presented as one unified document by the distributor listings. It helps buyers distinguish the confirmed LPC1102UK capabilities from specifications that still require direct datasheet verification.
直接替换替代料： LPC1102UK ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
LPC1102UK
✅ 直接替换✓ 有现货
$1.8188 / 个
查看数据手册 →LPC1102UK,118
✅ 直接替换📋 参考替代料（不在目录中）
OL-LPC1102UK
✅ 直接替换📋 参考替代料（不在目录中）
LPC1102
✅ 直接替换📋 参考替代料（不在目录中）
LPC1102/UM
✅ 直接替换📋 参考替代料（不在目录中）
LPC1102UK 最大额定值与电气特性
| Product Type | 32-bit ARM Cortex-M0 microcontroller |
| CPU Core | ARM Cortex-M0 |
| Maximum CPU Frequency | 50 MHz |
| Architecture | 32-bit |
| Flash Memory | 32 KB |
| Flash Organization | 32K x 8 bits |
| SRAM | 8 KB |
| 封装 | 16-WLCSP (2.17 mm x 2.32 mm) |
| Package Type | WLCSPUncased Chip |
| Package Pin Count | 16 pins |
| 生命周期状态 | NRND |
LPC1102UK 16 pins 引脚配置指南
LPC1102UK（16 pins 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： LPC1102UK.
请参阅 数据手册 以查看完整引脚配置。
典型应用
LPC1102UK 适用于 6 应用s: Compact Sensor Controller, Building-Control Endpoint, Appliance Control Board, Battery-Powered IoT Module, Low-Cost Data Logger, Communication Interface Module.
Compact Sensor Controller
The LPC1102UK fits compact sensor nodes where board area and firmware complexity must remain small. Its 50 MHz Arm Cortex-M0 core provides more processing headroom than a basic 8-bit controller, while 32 KB flash and 8 KB SRAM support acquisition logic, calibration state, and a lightweight communications state machine. In a typical design, the MCU digitizes sensor inputs, applies filtering, stores configuration in nonvolatile memory, and reports results through a low-speed serial interface. The 16-WLCSP package measures 2.17 mm by 2.32 mm, but its fine assembly requirements can outweigh any board-space savings unless the assembly line supports the package and the firmware remains comfortably within the 32 KB program-memory budget.
推荐
Building-Control Endpoint
The LPC1102UK is appropriate for distributed building-control endpoints that monitor inputs and drive discrete outputs without requiring a high-power processor. Its 32-bit Cortex-M0 architecture can handle debouncing, state transitions, timers, communication scheduling, and diagnostic flags, while the 50 MHz operating rate leaves practical headroom for interrupt-driven control. A typical circuit would connect the MCU to sensors, relay or triac drivers, and a bus transceiver, with firmware enforcing startup delays and safety interlocks. The 8 KB SRAM may become restrictive if extensive buffering or complex network stacks are needed, so code-size and peak-memory measurements should be completed against the intended compiler and library configuration before layout release.
推荐
Appliance Control Board
The LPC1102UK can serve as the central controller in a compact appliance when the design requires deterministic real-time behavior, modest memory, and low component cost. Its Cortex-M0 core at up to 50 MHz can execute motor-step timing, button handling, temperature monitoring, fault detection, and state-machine control without an operating system. In this use, firmware should prioritize deterministic interrupts and bounded execution times, while the PCB provides careful decoupling, grounded return paths, and protection from motor-switching transients. Compared with a larger MCU, the LPC1102UK offers a simpler solution but supplies only 32 KB flash and 8 KB SRAM; adding protocol stacks, graphical displays, or extensive logs may require a higher-memory device.
推荐
Battery-Powered IoT Module
The LPC1102UK can fit a small battery-powered IoT module when its workload is limited to sensing, local logic, and intermittent communication. The 50 MHz Cortex-M0 core supports responsive peripheral handling, while 8 KB SRAM is adequate for many short message buffers but not for demanding edge processing. Firmware should place the processor in low-power states between events and use timer-driven wakeups to avoid unnecessary active time. Before selecting it, verify the exact low-power modes, active and sleep currents, wake-up sources, and analog characteristics in the manufacturer datasheet because these values are not present in the supplied source excerpts. The WLCSP package helps miniaturization, although battery products also require careful leakage-current analysis and mechanical protection.
推荐
Low-Cost Data Logger
The LPC1102UK is viable for a compact data logger that records bounded sensor or event data and periodically transmits it. Its 32 KB flash can hold firmware and limited nonvolatile data, while 8 KB SRAM can hold acquisition buffers, counters, and communication frames. A practical implementation should measure normal and worst-case firmware memory, avoid allocating near the SRAM limit, and define flash wear controls if persistent records are updated frequently. The 50 MHz core provides enough instruction throughput for many control tasks, but the MCU's small package and limited memory make it less suitable than a larger device for large histories, high-rate sampling, or complex protocols. The choice should follow measured data rate, retention period, and transmission workload.
推荐
Communication Interface Module
The LPC1102UK can act as a small protocol or command interface when the surrounding transceiver performs the physical-layer work. At up to 50 MHz, the Cortex-M0 core can frame packets, validate commands, update local state, and expose diagnostics through serial or parallel signals. Its 32 KB flash and 8 KB SRAM are suitable for compact protocol stacks but require disciplined buffer allocation and library selection. During PCB design, place the MCU and decoupling close to the connector or transceiver, maintain short return paths, and isolate high-current switching sections from sensitive communications. Because the supplied excerpts do not enumerate the LPC1102UK peripheral set, engineers must verify UART, SPI, I2C, USB, and timer availability against the current datasheet before assigning interfaces.
推荐
推荐产品汇总
工程参考数据： LPC1102UK ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | LPC1102UK | LPC1102UK,118 | OL-LPC1102UK | LPC1102 | LPC1102/UM |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 16-WLCSP (2.17 mm x 2.32 mm) | 16-WLCSP (2.17 mm x 2.32 mm) | 16-WLCSP (2.17 mm x 2.32 mm) | 16-WLCSP (2.17 mm x 2.32 mm) | 16-WLCSP (2.17 mm x 2.32 mm) | 16-WLCSP (2.17 mm x 2.32 mm) |
| CPU Core | ARM Cortex-M0 | ARM Cortex-M0 | ARM Cortex-M0 | ARM Cortex-M0 | ARM Cortex-M0 | ARM Cortex-M0 |
| Maximum CPU Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash Memory | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| SRAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| Word Size | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Assembly Form | WLCSP uncased chip | WLCSP uncased chip | WLCSP uncased chip | WLCSP uncased chip | WLCSP uncased chip | WLCSP uncased chip |
关键差异点
- Very compact verified package （对比 STM32F072RBT6TR)
- 32-bit entry-level processing （对比 ATMEGA328-AU)
- Memory footprint tailored to compact control （对比 STM32F030R8T6TR)
设计说明
Treat the LPC1102UK as a fine-pitch WLCSP design, not a conventional leaded-package replacement. Use NXP's OL-LPC1102UK package page to verify ball assignments, solder-mask and paste geometry, courtyard, and assembly tolerances. Keep escape traces short, avoid acute angles, and route sensitive signals away from switching nodes. The 2.17 mm by 2.32 mm package can save board area but may require smaller components, tighter inspection, and specialized assembly capability.
Validate the power tree against the manufacturer electrical limits before routing. The supplied excerpts do not provide the LPC1102UK supply range or current ratings, so do not assume a nominal rail or regulator output. Confirm the core and I/O voltage domains, decoupling values, startup sequencing, and maximum operating current directly from the current NXP datasheet. Place required bulk and high-frequency capacitors according to those limits, then check droop during wake-up and peripheral activity.
Memory capacity is a common design failure point for this part. Measure the linked firmware, stack, interrupt usage, and peak heap allocation against the verified 32 KB flash and 8 KB SRAM limits, leaving margin for diagnostics and future revisions. Avoid adding a communication stack or logging feature merely because the source fits at first build; test the worst-case runtime allocation and update path before committing the compact package.
Plan signal integrity around the actual interface speeds and external circuitry. Keep clock and communication routes short, provide continuous return paths, and place protection devices close to their connectors. If the MCU drives relays, displays, or other switching loads, separate high-current paths from sensitive control traces and use appropriate ground partitioning or filtering. Because pin-level peripheral assignments were not supplied here, verify every signal against the official package and datasheet before layout release.
合规信息
The supplied verified results identify the manufacturer, package, memory, core, frequency, pricing reference, and NRND lifecycle status, but do not provide explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations.
