NXP Semiconductors

LPC4317JET100E - 204MHz Dual-Core Cortex-M4/M0 MCU | NXP

料号: LPC4317JET100E ✓ 量产中
3.3 V Vdss 100-ball TFBGA, 9 mm x 9 mm Package 204 MHz Speed 1 MB Memory
最小起订量: 1 |

LPC4317JET100E 概述

NXP Semiconductors LPC4317JET100E is a dual-core Arm Cortex-M4 and Cortex-M0 microcontroller operating up to 204 MHz, with 1 MB of embedded flash and 136 kB of SRAM in a 100-ball TFBGA package measuring 9 mm by 9 mm. It also includes 16 kB of EEPROM and integrates Ethernet, two high-speed USB controllers, LCD, external memory controller, and quad SPI Flash Interface resources.

A microcontroller is a programmable semiconductor that integrates a processor core, memory, and peripherals into one device. The LPC4317JET100E belongs to the microcontroller hierarchy: dual-core Arm processor, embedded controller, embedded processing, and semiconductor. Its Cortex-M4 core supports demanding real-time control tasks, while the Cortex-M0 coprocessor can execute supporting tasks or offload work from the primary core.

The principal features include 204 MHz operation, 1 MB flash, 136 kB SRAM, and 16 kB EEPROM. Two high-speed USB controllers suit data-transfer, host, and device designs, while integrated Ethernet supports connected industrial equipment. The LCD interface and external memory controller broaden display and expansion options, and the quad SPI Flash Interface, or SPIFI, provides access to external serial flash for additional code or data storage.

The split-core architecture provides an efficient way to partition embedded workloads. The Cortex-M4 core can handle control loops, protocol processing, and application logic, while the Cortex-M0 coprocessor can service background activity. This arrangement can improve real-time responsiveness when firmware is divided by workload rather than running every routine on the same core. The 100-TFBGA package also supports dense PCB layouts but requires careful escape routing and exposed-pad thermal design.

Typical uses include industrial Ethernet controllers, USB-to-Ethernet equipment, data acquisition systems, LCD-equipped human-machine interfaces, and embedded gateways. The integrated connectivity peripherals reduce the need for external controllers in designs requiring Ethernet or high-speed USB. SPIFI expansion is useful when the internal 1 MB flash is insufficient for logs, assets, firmware images, or boot resources.

Designers should confirm power, decoupling, clock, Ethernet, USB, and differential-signal routing directly against the NXP datasheet and reference schematics. The 9 mm square TFBGA requires via-in-pad or otherwise validated escape-routing methods, and the Ethernet and USB interfaces need controlled-impedance layouts. Firmware must also initialize both cores and coordinate shared peripheral access correctly.

This product page consolidates the verified device characteristics, sourcing path, drop-in assessment, and application guidance needed for an initial design review. It supports engineers comparing the LPC4317JET100E for industrial networking, USB connectivity, and real-time embedded control while keeping footprint, memory, and peripheral requirements visible.

直接替换替代料: LPC4317JET100E ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

LPC4317JET100

✅ 直接替换
📦 100-TFBGA (9 mm x 9 mm)
The base LPC4317JET100 listing omits the E suffix; the stated ratings remain 204 MHz, 1 MB flash, 136 kB SRAM, and 100-TFBGA, producing a 0 MHz and 0 kB difference in the stated key specifications.

📋 参考替代料(不在目录中)

LPC4317JET100E 最大额定值与电气特性

Product Type Dual-core Arm Cortex-M4/M0 microcontroller
Maximum Core Frequency 204 MHz
Embedded Flash Memory 1 MB
On-Chip SRAM 136 kB
EEPROM Memory 16 kB
Processor Architecture 32-bit Arm Cortex-M4 with Cortex-M0 coprocessor
High-Speed USB Controllers 2 controllers
Ethernet Interface 1 integrated Ethernet interface
LCD Interface 1 integrated LCD interface
External Memory Controller 1 integrated external memory controller
External Serial Flash Interface Quad SPI Flash Interface (SPIFI)
Configurable Timer State Configurable Timer (SCT)
Serial GPIO Interface Serial General Purpose I/O (SGPIO)
封装 100-ball TFBGA, 9 mm x 9 mm
安装类型 Surface mount
Operating Voltage 3.3 V
Flash Memory Organization 1 M x 8 bits

LPC4317JET100E 100-ball tfbga, 9 mm x 9 mm 引脚配置指南

LPC4317JET100E(100-ball tfbga, 9 mm x 9 mm 封装)的引脚配置。 该数字 IC 包含 GPIO、通信接口(UART、SPI、I2C)和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

LPC4317JET100E 的 100-ball tfbga, 9 mm x 9 mm 封装引脚图

暂无详细引脚数据: LPC4317JET100E.

请参阅 数据手册 以查看完整引脚配置。

典型应用

LPC4317JET100E 适用于 6 应用s: Industrial Ethernet Gateway, USB-to-Ethernet Control Module, LCD HMI and Data Acquisition, USB Data Acquisition Controller, Secure Embedded Connectivity Controller, Industrial Communication Controller.

🏭

Industrial Ethernet Gateway

The LPC4317JET100E fits an industrial Ethernet gateway because it combines a 204 MHz Arm Cortex-M4 core, an Arm Cortex-M0 coprocessor, and integrated Ethernet in one 100-TFBGA device. The Cortex-M4 can manage protocol processing and application logic, while the coprocessor can support background tasks. Its 136 kB SRAM and 1 MB flash provide room for network stacks, diagnostics, and firmware, while the external memory controller can extend capacity when required. Ethernet magnetics, termination, controlled-impedance routing, and isolation must still be designed according to the target network topology.

🌐

USB-to-Ethernet Control Module

The LPC4317JET100E is suitable for a USB-to-Ethernet control module because it provides two high-speed USB controllers alongside an integrated Ethernet interface. The 204 MHz Cortex-M4 core can service USB traffic and Ethernet protocol processing, and the Cortex-M0 coprocessor can handle auxiliary monitoring or configuration work. With 1 MB flash and 136 kB SRAM, the device supports embedded stacks without requiring a separate processor for basic gateway functions. Product designers should account for connector protection, PHY implementation, clocking, and impedance-controlled USB and Ethernet layouts.

📺

LCD HMI and Data Acquisition

The LPC4317JET100E fits an LCD human-machine interface because its integrated LCD controller, 204 MHz Cortex-M4 core, and Cortex-M0 coprocessor can divide display servicing from acquisition and control tasks. The 100-TFBGA package supports compact industrial panels, while 1 MB flash accommodates interface graphics code and 136 kB SRAM supports local buffering. SPIFI can connect to serial flash when configuration data, images, or audit logs exceed internal storage. The design must follow NXP timing requirements for the selected LCD interface and preserve signal integrity across display and analog-measurement circuitry.

🔬

USB Data Acquisition Controller

The LPC4317JET100E can serve as a USB data-acquisition controller because its two high-speed USB controllers coexist with a 204 MHz primary core and a separate Cortex-M0 coprocessor. The primary core can process samples and control transfers, while the second core can maintain monitoring or communications. The 136 kB SRAM is useful for buffer management, and 16 kB EEPROM can retain calibration or configuration parameters when the firmware is designed for that use. Front-end analog isolation, sensor excitation, USB connector protection, and ground partitioning remain separate board-level requirements.

🔒

Secure Embedded Connectivity Controller

The LPC4317JET100E supports secure embedded connectivity controllers that combine USB, Ethernet, and configurable serial peripherals in one processor platform. The 204 MHz Cortex-M4 core can execute network and control firmware, while the Cortex-M0 coprocessor can handle isolated background tasks. Its 136 kB SRAM supports protocol buffers, and the quad SPI Flash Interface permits external boot or asset storage without adding a parallel flash bus. Implementations should partition memory consistently, protect external interfaces physically, and verify boot and update mechanisms against the device security capabilities documented by NXP.

⚡

Industrial Communication Controller

The LPC4317JET100E is appropriate for an industrial communication controller combining Ethernet, two high-speed USB controllers, LCD support, and configurable peripherals. The Cortex-M4 core can process communication protocols and deterministic control logic, while the Cortex-M0 coprocessor can execute monitoring or data-formatting tasks. The State Configurable Timer and Serial GPIO interface broaden the options for specialized timing and serial expansion. A practical implementation should use the 1 MB flash for efficient local code placement, configure the 136 kB SRAM for deterministic buffers, and validate timing against the industrial equipment load environment.

What is the LPC4317JET100E?
The LPC4317JET100E is a 204 MHz dual-core microcontroller from NXP Semiconductors, combining an Arm Cortex-M4 core with an Arm Cortex-M0 coprocessor. According to the NXP product page, it provides 1 MB of flash, 136 kB of SRAM, 16 kB of EEPROM, Ethernet, two high-speed USB controllers, LCD support, and a quad SPI Flash Interface in a 100-ball TFBGA package.
How much memory does the LPC4317JET100E have?
The LPC4317JET100E includes 1 MB of embedded flash, 136 kB of on-chip SRAM, and 16 kB of EEPROM. According to the NXP LPC4317JET100 product page, the flash is organized as 1 M by 8 bits. Designers should budget the internal flash for code and data while using the quad SPI Flash Interface when larger storage, boot media, or external assets are required.
What processors are integrated in the LPC4317JET100E?
The LPC4317JET100E combines an Arm Cortex-M4 processor with an Arm Cortex-M0 coprocessor. According to the NXP product information, the primary Cortex-M4 core operates up to 204 MHz, while the Cortex-M0 core provides additional processing capacity for supporting tasks. This dual-core arrangement can simplify workload partitioning in control, communications, and data-handling systems.
Does the LPC4317JET100E support Ethernet and high-speed USB?
Yes, the LPC4317JET100E integrates one Ethernet interface and two high-speed USB controllers. According to the NXP product page, these resources support connected embedded products without requiring separate controllers for every communication function. Board-level implementation still requires correct PHY, connector, clock, decoupling, and controlled-impedance routing decisions.
What package does the LPC4317JET100E use?
The LPC4317JET100E uses a 100-ball TFBGA package measuring 9 mm by 9 mm. The package is identified as 100-TFBGA by NXP product information and as a 100-pin TFBGA in distributor listings. Because of its ball pitch and thermal requirements, use the manufacturer land pattern and validate assembly-capability limits before committing to the layout.
Where can I download the LPC4317JET100E datasheet?
The primary documentation entry point is the official NXP LPC4317JET100 product page, which links to technical resources for this device family. The LPC4317JET100E is the E-orderable designation of the LPC4317JET100 device. Use the NXP document links for the definitive pin descriptions, electrical characteristics, timing diagrams, and package drawings before releasing a PCB or firmware build.
Where is the LPC4317JET100E pinout located?
The LPC4317JET100E pinout is defined in the NXP family datasheet and package drawing, not by the distributor product listings. Use the pin-description table when assigning balls to power, ground, clocks, communications, and general-purpose I/O. This page does not reproduce a complete 100-ball assignment because the individual ball names were not present in the accessible product summary.
Is the LPC4317JET100E suitable for industrial Ethernet equipment?
The LPC4317JET100E is suitable for industrial Ethernet equipment because it combines a 204 MHz Cortex-M4 core, a Cortex-M0 coprocessor, 1 MB flash, and an integrated Ethernet interface. According to the NXP product page, the MCU also includes two high-speed USB controllers and an external memory controller, supporting gateways, controllers, and connected test equipment.
What is the LPC4317JET100E versus LPC4320FET100,551?
The LPC4317JET100E is a dual-core Cortex-M4/M0 device with 204 MHz operation, 136 kB SRAM, Ethernet, and two high-speed USB controllers. The LPC4320FET100,551 comparison record identifies a Cortex-M4 MCU in a 100-TFBGA package, but it does not establish identical ball assignments. Therefore, the LPC4320FET100,551 is not treated as a verified drop-in replacement without a package-level pin audit.
When should I choose the LPC4317JET100E instead of a simpler Cortex-M MCU?
Choose the LPC4317JET100E when firmware benefits from both a 204 MHz Cortex-M4 core and a separate Cortex-M0 coprocessor, especially when protocol handling, control, and background tasks can be separated. Its 1 MB flash and 136 kB SRAM also provide more local memory than a basic microcontroller. A simpler Cortex-M device remains preferable when those processing and connectivity resources are unnecessary.
What can replace the LPC4317JET100E as a drop-in part?
The verified drop-in candidate is LPC4317JET100, which has the same base device designation and NXP product-page documentation; the alternate listing omits the E suffix. No other candidate in the cross-reference results was confirmed to have the same 100-ball footprint, pin assignments, dual-core architecture, memory configuration, and peripheral mapping. Treat unverified MCU comparisons as redesign candidates rather than drop-in replacements.
Is there an NXP equivalent for the LPC4317JET100E?
The LPC4317JET100 is the closest verified NXP listing for the LPC4317JET100E because it represents the same base LPC4317JET100 device without the E suffix. The NXP product page confirms the LPC4317JET100 in the 100-TFBGA package. Before substitution, confirm the ordering suffix, temperature grade, pin configuration, and errata status against the manufacturer product documentation.
Where can I buy the LPC4317JET100E and check its lead time?
Use the Request a Quote form on this page to ask about LPC4317JET100E availability, order quantity, and current lead time. The form allows the request to be routed against the exact NXP ordering code and 100-TFBGA package. No fixed unit price or stock quantity should be inferred because quote status and inventory can change independently.
How do I calculate the power and thermal requirements for an LPC4317JET100E design?
Calculate power from the actual rail voltages and measured core, memory, I/O, Ethernet, and USB activity rather than applying one worst-case number to every design. NXP documents the device electrical limits in the family datasheet. Use the specified package thermal data, exposed-pad layout, and board construction to estimate junction temperature, while confirming maximum operating voltage and total current limits.
How should firmware use the Cortex-M0 coprocessor?
The Cortex-M0 coprocessor should handle a clearly bounded background or service workload while the Cortex-M4 core manages latency-sensitive application logic. According to the NXP family description, the part includes an Arm Cortex-M0 coprocessor alongside the Cortex-M4 core. Firmware developers should follow NXP startup, memory-map, interrupt-routing, and shared-peripheral procedures when initializing and coordinating both processors.

工程参考数据: LPC4317JET100E ——对比、设计指导和合规信息。

选型指南

Choose the LPC4317JET100E when an embedded design requires a 204 MHz Cortex-M4 core, a Cortex-M0 coprocessor, 1 MB flash, 136 kB SRAM, Ethernet, and two high-speed USB controllers in a 100-TFBGA package. The separate coprocessor is especially useful when control code, protocol handling, monitoring, and background processing can be divided into deterministic workloads. The LPC4317JET100 is the verified drop-in candidate when its ordering suffix and qualification requirements match the design. The LPC4320FET100,551 should not replace the target without a detailed review of ball assignments, memory, peripheral differences, and firmware support. Likewise, the LPC1815JET100E is not a drop-in choice despite its similar package designation because its processor architecture and peripheral set differ. For new designs without a requirement for dual cores or high-speed USB, a simpler Cortex-M MCU may reduce package complexity, power use, and firmware effort.

与替代料对比

参数 本产品 LPC4317JET100
Brand NXP Semiconductors NXP Semiconductors
Package 100-TFBGA (9 mm x 9 mm) 100-TFBGA (9 mm x 9 mm)
Processor Cores Arm Cortex-M4 with Arm Cortex-M0 coprocessor Arm Cortex-M4 with Arm Cortex-M0 coprocessor
Maximum Frequency 204 MHz 204 MHz
Embedded Flash 1 MB 1 MB
On-Chip SRAM 136 kB 136 kB
EEPROM 16 kB 16 kB
High-Speed USB Controllers 2 2
Ethernet Integrated Integrated
External Serial Flash Interface Quad SPI Flash Interface (SPIFI) Quad SPI Flash Interface (SPIFI)

关键差异点

  • Dual-core processing in one microcontroller (对比 LPC4317JET100)
  • Integrated connectivity reduces external controller count (对比 LPC4317JET100)
  • Memory configuration matches the base LPC4317 device (对比 LPC4317JET100)

设计说明

Use the NXP 100-TFBGA land pattern and assembly guidelines without changing ball locations or pad geometry. The 9 mm package requires fanout routing from its dense ball array; use via-in-pad only when the PCB fabricator and component supplier support that process. Preserve the manufacturer pad definitions around power, ground, and exposed thermal connections, and complete a manufacturing stack-up review before releasing the artwork.

Estimate junction temperature from the actual rail voltage, processing activity, I/O loading, and board thermal resistance rather than assuming that the TFBGA can dissipate a fixed value. Provide continuous ground-plane connections and the recommended exposed-pad copper area, then verify temperature rise in the assembled enclosure. Compare the calculated margin with the device limits in the NXP family datasheet, especially when both processor cores and communications peripherals operate simultaneously.

Route USB and Ethernet signals as controlled-impedance interconnects with continuous reference planes and minimal layer transitions. Keep clocks away from noisy switching nodes, provide the specified local decoupling at supply pins, and avoid routing communication signals across split plane boundaries. Ethernet magnetics, USB protection components, and connector placement can materially affect signal integrity, so validate the complete channel rather than only the MCU footprint.

Do not assume that a comparator result establishes true MCU drop-in compatibility. Firmware, peripheral routing, power pins, boot configuration, and ball assignments must match before replacement is approved. For the LPC4317JET100E, initialize both cores according to the NXP startup procedure, define which core owns each peripheral, and confirm that shared memory and interrupt ownership do not conflict with the application architecture.

合规信息

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
无铅
Unknown
无卤
Unknown
冲突矿物
Unknown

No explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations were identified for the exact ordering code. Confirm current declarations with NXP before production release.

数据核验日期: 2026-11-07 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

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相关元器件 & 术语

NXP Semiconductors LPC4317JET100E LPC4317JET100 LPC4320FET100,551 LPC1815JET100E Arm Cortex-M4 Arm Cortex-M0 microcontroller embedded controller dual-core microcontroller semiconductor SPIFI Quad SPI Flash Interface State Configurable Timer Serial General Purpose I/O Ethernet controller high-speed USB LCD controller external memory controller 100-TFBGA BGA package family surface-mount package 3.3 V
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